BGA 400 Search Results

BGA 400 Result Highlights (5)

Part	Manufacturer	Description
MPC860PZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860PVR80D4	Rochester Electronics LLC	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC855TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860TCZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
MPC860ENZQ50D4	Rochester Electronics LLC	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

BGA 400 Price and Stock

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Thomas & Betts BGA400-6-40 4In Grnd Bush 6-4/0Wire Range Al \|Abb Thomas & Betts BGA400-6-40
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	BGA400-6-40	Bulk			1	1 $199.12 10 $184.9 100 $164.11 1000 $164.11 10000 $164.11	Buy Now
Master Electronics	BGA400-6-40					1 $139.4 10 $123.47 100 $111.81 1000 $111.81 10000 $111.81	Buy Now
Thomas & Betts BGA400-14-20 4In Grnd Bush 14-2/0Wire Range Al \|Abb Thomas & Betts BGA400-14-20
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	BGA400-14-20	Bulk			1	1 $199.12 10 $184.9 100 $164.11 1000 $164.11 10000 $164.11	Buy Now
Master Electronics	BGA400-14-20					1 $139.4 10 $123.47 100 $111.81 1000 $111.81 10000 $111.81	Buy Now
T&B Fittings BGA400-6-40 Grounding Bushing, 4", Aluminum, Galvanized, Wire Range 6 to 4/0, Black \| T&B Fittings by ABB BGA400-6-40
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	BGA400-6-40	Bulk			1	1 $199.12 10 $181.2 100 $181.2 1000 $181.2 10000 $181.2	Get Quote
T&B Fittings BGA400-14-20 Grounding Bushing, 4", Alum., Wire Range 14-2/0Awg, For use w/ Rigid/IMC Condu \| T&B Fittings by ABB BGA400-14-20
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	BGA400-14-20	Bulk			1	1 $199.12 10 $181.2 100 $181.2 1000 $181.2 10000 $181.2	Get Quote
ABB Group BGA400-6-40 Thomas & Betts
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Sager	BGA400-6-40				1	1 $193.07 10 $182.34 100 $175.05 1000 $175.05 10000 $175.05	Buy Now

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BGA 400 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
reflow soldering profile BGA Abstract: reflow temperature bga BGA PROFILING bga rework Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already	Original	PDF
sn63pb37 solder wire Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01 Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen	Original	PDF
reflow soldering profile BGA Abstract: BGA PROFILING solder joint bga warpage bga rework Text: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: • Use caution when profiling to insure minimal temperature difference <15°C and preferably <10°C between components Removal and replacement of BGA packages on printed	Original	PDF
PCT-GF30 Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044 Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount	Original	PDF
Untitled Abstract: No abstract text available Text: 2 Gigabit Stacked DDR2 SDRAM DD53E 256Mb x 8 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA. • 8 x 11.5 x 1.35mm BGA Package • 50% Space Savings Over Two 60 Ball BGA Packages • Reduced Trace Lengths Over Two BGA Packages • Lead Free—High Temperature Solder Balls	Original	PDF	DD53E 256Mb 2D256M82U4BA DD53E
U48B Abstract: DDR2 Mechanical Dimensions Text: 2 Gigabit Stacked DDR2 SDRAM DD52E 512Mb x 4 Features • Low Profile 63 Ball Two-High Stacked Die micropede BGA. • 8 x 11.5 x 1.35mm BGA Package • 50% Space Savings Over Two 60 Ball BGA Packages • Reduced Trace Lengths Over Two BGA Packages • Lead Free—High Temperature Solder Balls	Original	PDF	DD52E 512Mb 2D512M42U4BA DD52E U48B DDR2 Mechanical Dimensions
BGA package tray 40 x 40 Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07 Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09	Original	PDF	BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
202P Abstract: F202 FDZ202P Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ202P FDZ202P 202P F202
202P Abstract: F202 FDZ202P Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ202P FDZ202P 202P F202
FDZ204P Abstract: No abstract text available Text: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ204P FDZ204P
Untitled Abstract: No abstract text available Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ206P FDZ206P
DIODE A46 Abstract: No abstract text available Text: FDZ293P P-Channel 2.5 V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ293P minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ293P FDZ293P DIODE A46
FDZ294N Abstract: No abstract text available Text: FDZ294N N-Channel 2.5 V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ294N minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ294N FDZ294N
FDZ204P Abstract: No abstract text available Text: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ204P FDZ204P

gk 7031 Abstract: No abstract text available Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.	Original	PDF	W2637A, W2638A W2639A 5990-3892EN gk 7031
Untitled Abstract: No abstract text available Text: FDZ293P P-Channel 2.5 V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ293P minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ293P FDZ293P
Untitled Abstract: No abstract text available Text: FDZ299P P-Channel 2.5 V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ299P minimizes both PCB space This BGA MOSFET embodies a	Original	PDF	FDZ299P FDZ299P
FDZ206P Abstract: No abstract text available Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a	Original	PDF	FDZ206P FDZ206P
JEDEC bga case outline Abstract: 202P F202 FDZ202P Text: FDZ202P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a	Original	PDF	FDZ202P FDZ202P JEDEC bga case outline 202P F202
FDZ206P Abstract: No abstract text available Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a	Original	PDF	FDZ206P FDZ206P
FC-09A Abstract: F63TNR FDZ204P FDZ6966 Text: FDZ204P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a	Original	PDF	FDZ204P FDZ204P FC-09A F63TNR FDZ6966
FDZ27296 Abstract: FDZ7296 Text: FDZ7296 30V N-Channel PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced PowerTrench process with state-of-the-art BGA packaging, the FDZ7296 minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging	Original	PDF	FDZ7296 FDZ27296 FDZ7296
Untitled Abstract: No abstract text available Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and	OCR Scan	PDF	26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30
Untitled Abstract: No abstract text available Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and	OCR Scan	PDF	26x26 15X15

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BGA 400 Search Results

BGA 400 Result Highlights (5)

BGA 400 Price and Stock

Thomas & Betts BGA400-6-40

Thomas & Betts BGA400-14-20

T&B Fittings BGA400-6-40

T&B Fittings BGA400-14-20

ABB Group BGA400-6-40

BGA 400 Datasheets Context Search

reflow soldering profile BGA

sn63pb37 solder wire

reflow soldering profile BGA

PCT-GF30

Untitled

U48B

BGA package tray 40 x 40

202P

202P

FDZ204P

Untitled

DIODE A46

FDZ294N

FDZ204P

gk 7031

Untitled

Untitled

FDZ206P

JEDEC bga case outline

FDZ206P

FC-09A

FDZ27296

Untitled

Untitled