BGA 21X21 Search Results

BGA 21X21 Result Highlights (5)

Part	Manufacturer	Description
84512-202	Amphenol Communications Solutions	100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
10022671-102LF	Amphenol Communications Solutions	528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
84501-001LF	Amphenol Communications Solutions	300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
55714-102LF	Amphenol Communications Solutions	81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
84520-002LF	Amphenol Communications Solutions	400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free

BGA 21X21 Price and Stock

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Fischer Elektronik GmbH & Co KG ICK-BGA-21-X-21 Heatsink for BGAs
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	ICK-BGA-21-X-21	Bulk			29	1 - 10 - 100 $0.79931 1000 $0.79931 10000 $0.79931	Buy Now
Fischer Elektronik GmbH & Co KG ICK-BGA-21-X-21-X-10 Heatsink for BGAs
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	ICK-BGA-21-X-21-X-10	Bulk			23	1 - 10 - 100 $1.01522 1000 $1.01522 10000 $1.01522	Buy Now
Fischer Elektronik GmbH & Co KG ICK-BGA-21-X-21-X-14 Heatsink for BGAs
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	ICK-BGA-21-X-21-X-14	Bulk			22	1 - 10 - 100 $1.06909 1000 $1.06909 10000 $1.06909	Buy Now
Fischer Connectors ICKBGA21X21 Heatsink, BGA,24.3 to 8K/W,21x21x6mm, Conductive Adhesive, Conductive Foil Mount \| Fischer ICKBGA21X21
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
RS	ICKBGA21X21	Bulk			1	1 $0.9 10 $0.72 100 $0.72 1000 $0.72 10000 $0.72	Get Quote
Fischer Elektronik GmbH & Co KG ICKBGA21X21 Heatsink: extruded; black; L: 21mm; W: 21mm; H: 6mm; aluminium
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	ICKBGA21X21		145		1	1 $1.03 10 $0.93 100 $0.72 1000 $0.72 10000 $0.72	Buy Now

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BGA 21X21 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and	OCR Scan	26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30	PDF
Untitled Abstract: No abstract text available Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and	OCR Scan	26x26 15X15	PDF
PCT-GF30 Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044 Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount	Original		PDF
514-PP-NNNMXX-XXX148 Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1 Text: pga/bga/plcc ソケット pga/bga/plccソケットクイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型ソケット半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm	Original	AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1	PDF
35x35 bga Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877 Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169	Original	PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877	PDF
D1065 Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet Text: Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX BGA Sizes Foot Print mm Heat Sink Height (inches) Series # Solution Page # Attachment Method 21mm 21mm 25mm 27mm 35mm 35mm 37mm 37mm 40mm 40mm 40mm 40mm 45mm 45mm 45mm 45mm 45mm 45mm 21x21	Original	21x21 25x25 28x28 35x35 37x37 38x38 71x43 73x50 D1065 Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet	PDF
60068-2-14Na Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance Text: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.	Original	E174442. 16x16 19x19 20x20 60068-2-14Na 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance	PDF
TEXTOOL Abstract: land pattern BGA 0,50 3M 2380 Text: 3M Textool, 1.0mm pitch, Lidded, BGA Test & Burn-In Sockets Type I, II, III • Highly reliable contact that allows for normal variation in BGA ball-diameter and position. • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm	Original	TS-9100-06 TEXTOOL land pattern BGA 0,50 3M 2380	PDF
Preci-Dip Durtal SA Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148 Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin	Original	CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148	PDF
7047 Abstract: SG-BGA-7047 Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 16.125mm Easily removable socket lid	Original	125mm DP110 7047 SG-BGA-7047	PDF
DDR3L lpddr2 Abstract: IMX6DQ6SDLSRM Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLIEC Rev. 2.1, 05/2013 MCIMX6SxCxxxxxB MCIMX6UxCxxxxxB i.MX 6Solo/6DualLite Applications Processors for Industrial Products Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch	Original		PDF
sony cmos sensor imx 172 Abstract: sony CMOS sensor imx 135 sony IMX 132 sony IMX 122 sony IMX 135 MLB150 sony cmos sensor imx 174 sony IMX 132 CMOS MIPI dsi transmitter sony cmos sensor imx 179 Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLAEC Rev. 1, 11/2012 MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch	Original		PDF
MCIMX6S7CVM08AB Abstract: sony IMX 132 sony cmos sensor imx 175 sony cmos sensor imx 179 sony cmos sensor imx 174 sony IMX 138 tdm ip10 sony IMX 145 sony CMOS sensor imx 135 PCIE_rext Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLIEC Rev. 1, 11/2012 MCIMX6SxCxxxxxB MCIMX6UxCxxxxxB i.MX 6Solo/6DualLite Applications Processors for Industrial Products Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch	Original		PDF
Samsung eMMC 4.41 Abstract: No abstract text available Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLAEC Rev. 2.1, 05/2013 MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch	Original		PDF

omap1710 Abstract: omap2420 ic398 FR406 BGA 21x21 Text: GHz BGA Socket - Direct mount, solderless Top View Features: Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 25mm Easily removable swivel socket lid	Original	21x21 DC-BGA/BGA-OMAP2420-H-R-01 H-R-01 omap1710 omap2420 ic398 FR406 BGA 21x21	PDF
SG-BGA-6190 Abstract: No abstract text available Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 23.225mm Ball guide prevents over compression of elastomer	Original	225mm SG-BGA-6190	PDF
SG-BGA-6188 Abstract: No abstract text available Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 32.225mm Ball guide prevents over compression of elastomer	Original	225mm 725mm 725mm 025mm SG-BGA-6188 125mm.	PDF
7107 Abstract: 7107 PCB 7107 datasheet BGA 21x21 7107 applications IC 7107 SG-BGA-7107 Text: GHz BGA Socket - Direct mount, solderless 37.12mm Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 25.48mm 1 1 Clamshell Socket Lid: Black anodized Aluminum.	Original	725mm SG-BGA-7107 125mm. 7107 7107 PCB 7107 datasheet BGA 21x21 7107 applications IC 7107	PDF
1.27mm pitch zif socket 3M 21X21 Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •	Original	SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432	PDF
AC-27621 Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842 Text: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C	Original	NP276 10mA/20mV NP276 45x45 NP276-110522 AC-15751 AC-17393 AC-27621 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842	PDF
h7673 Abstract: 360-Pin MPSU 60 transistor tray dimensions BGA21 Text: TRAY CONTAINER UNIT : mm 5 x 12=60 20.15 135° C MAX. 23.90 BGA21 × 21A A' 21.20 23.90 26.05 21.20 NEC 95.6 135.9 MPSU A 262.9 315.0 322.6 SECTION A-A' (4.62) 6.35 7.62 21.20 Applied Package Quantity (pcs) 360-pin Plastic BGA (21×21) (FLIP CHIP TYPE)	Original	BGA21 360-pin BGA21 SSD-A-H7673 h7673 MPSU 60 transistor tray dimensions	PDF
EA-190-H125-T710 Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710 Text: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow	Original	UL94V-0 EA-190-H125-T710 EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710	PDF
337 BGA Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015 Text: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)	Original	BGA21 21ESP 256-pin 272-pin 292-pin 320-pin 337-pin SSD-A-H7071-3 337 BGA tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015	PDF
BGA 15X15 Abstract: No abstract text available Text: Daisy Chain Package Design 15mm, 321 MAP BGA, 0.65mm Pitch 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 A B C D E F G H * 0.65 mm Pitch * 21x21 Array * 9 Thermal Balls * 15x15 mm Body Size * 0.3 mm Solder Ball Diameter J K L M N P R T U V W Y AA Slide 1	Original	21x21 15x15 BGA 15X15	PDF

BGA 21X21 Search Results

BGA 21X21 Result Highlights (5)

BGA 21X21 Price and Stock

Fischer Elektronik GmbH & Co KG ICK-BGA-21-X-21

Fischer Elektronik GmbH & Co KG ICK-BGA-21-X-21-X-10

Fischer Elektronik GmbH & Co KG ICK-BGA-21-X-21-X-14

Fischer Connectors ICKBGA21X21

Fischer Elektronik GmbH & Co KG ICKBGA21X21

BGA 21X21 Datasheets Context Search

Untitled

Untitled

PCT-GF30

514-PP-NNNMXX-XXX148

35x35 bga

D1065

60068-2-14Na

TEXTOOL

Preci-Dip Durtal SA

7047

DDR3L lpddr2

sony cmos sensor imx 172

MCIMX6S7CVM08AB

Samsung eMMC 4.41

omap1710

SG-BGA-6190

SG-BGA-6188

7107

1.27mm pitch zif socket 3M 21X21

AC-27621

h7673

EA-190-H125-T710

337 BGA

BGA 15X15