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    BGA 1296 Search Results

    BGA 1296 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
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    BGA 1296 Price and Stock

    Intel Corporation Q6UJ9BGA1296

    (Alt: 944406)
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    EBV Elektronik Q6UJ9BGA1296 5 Weeks 1
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    BGA 1296 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    196-pin

    Abstract: DSP56300 EB360
    Text: Freescale Semiconductor Engineering Bulletin EB360 Rev. 1, 10/2005 Mechanical Differences Between the 196-pin MAP-BGA and 196-pin PBGA Packages This document describes the differences between the 196-pin Mold Array Process-Ball Grid Array MAP-BGA and the 196pin Plastic Ball Grid Array (PBGA) packages. The MAP - BGA


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    EB360 196-pin 196-pin 196pin DSP56300 EB360 PDF

    DSP56300

    Abstract: EB362
    Text: Freescale Semiconductor Engineering Bulletin EB362 Rev. 1, 10/2005 Mechanical Differences Between the 252-pin MAP-BGA and 252-pin PBGA Packages This document describes the differences between the 252-pin MAP-BGA Mold Array Process-Ball Grid Array and the 252pin PBGA (Plastic Ball Grid Array) packages. The MAP-BGA


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    EB362 252-pin 252-pin 252pin DSP56300 EB362 PDF

    HXC125

    Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
    Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The


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    1654563-CC CE-PDF-07-08 HXC125 mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296 PDF

    292 MAPBGA

    Abstract: cluster stepper motor pp e MC9S12XHZ256 MC9S12XHZ512 HCS12X MC9S12XHZ384 S12XE S12XEETX4KV2 BA 508 C0 S12XMMCV3
    Text: Data Sheet Covers MC9S12XHZ384, MC9S12XHZ256 HCS12X Microcontrollers MC9S12XHZ512 Rev. 1.05 11/2008 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not


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    MC9S12XHZ384, MC9S12XHZ256 HCS12X MC9S12XHZ512 S12XE 11/200OWERED 292 MAPBGA cluster stepper motor pp e MC9S12XHZ256 MC9S12XHZ512 HCS12X MC9S12XHZ384 S12XEETX4KV2 BA 508 C0 S12XMMCV3 PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


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    BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    MCF52236CAF50

    Abstract: MC52233 Bosch HFM 8 Bosch hfm 6 MCF52235 Bosch hfm integr MCF52230 MCF52232 MCF52233
    Text: Devices Supported: MCF52230 MCF52231 MCF52232 MCF52233 MCF52234 MCF52235 MCF52236 Document Number: MCF52235RM Rev. 6 07/2010 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not


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    MCF52230 MCF52231 MCF52232 MCF52233 MCF52234 MCF52235 MCF52236 MCF52235RM MCF52234CVM60, MCF52235CVM60 MCF52236CAF50 MC52233 Bosch HFM 8 Bosch hfm 6 MCF52235 Bosch hfm integr MCF52230 MCF52232 MCF52233 PDF

    56800E

    Abstract: DSP56800E DSP56800ERM DSP56852 DSP56852UM DSP56852VFE
    Text: Data Sheet Technical Data 56800E 16-bit Digital Signal Controllers DSP56852 Rev. 8 01/2007 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not


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    56800E 16-bit DSP56852 DSP56852VFE 120MHz 16-bed 56800E DSP56800E DSP56800ERM DSP56852 DSP56852UM DSP56852VFE PDF

    Untitled

    Abstract: No abstract text available
    Text: TRAY CONTAINER UNIT : mm 3 x 7=21 NEC 80.0 135° C MAX. A' 37.70 40.00 37.50 37.70 27.95 7 BGA37.5 × 37.5A 40.00 135.9 PPE A 240.0 315.0 322.6 SECTION A-A' 3.92 (6.35) 7.62 37.70 Applied Package Quantity (pcs) 1296-pin Plastic BGA (37.5×37.5) (FLIP CHIP TYPE)


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    BGA37 1296-pin SSD-A-H7543 PDF

    TRK 5213

    Abstract: TN256 M68000 MC68000 MCF52235 MCF54450 MCF54452 MC680X0 527-01
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: M5373EVB Technical Note


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    M5373EVB TN256 TRK 5213 TN256 M68000 MC68000 MCF52235 MCF54450 MCF54452 MC680X0 527-01 PDF

    MMA7660FC

    Abstract: MPC8536E capacitive touch sensor freescale MCU AUTOMATIC STREET LIGHT CONTROLLER using IR sensor ir water level sensor Freescale
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: i.MX Product Family.


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    PDF

    sim 900A

    Abstract: 56800E 56F8155 56F8300 56F8355 A8-13 MC56F8355 MC56F8357VVFE
    Text: Data Sheet Preliminary Technical Data 56F8300 16-Bit Digital Signal Controllers MC56F8355 Rev. 17 08/2009 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available


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    56F8300 16-Bit MC56F8355 MC56F8357VVFE 56F8355/56F8155 sim 900A 56800E 56F8155 56F8300 56F8355 A8-13 MC56F8355 PDF

    56800E

    Abstract: 56F8300 56F8367 MC56F8167 MC56F8367 MC56F8367E freescale superflash
    Text: Data Sheet Preliminary Technical Data 56F8300 16-bit Digital Signal Controllers MC56F8367 Rev. 9 11/2009 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not


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    56F8300 16-bit MC56F8367 MC56F8367, MC56F8167 56F8367/56F8167 56800E 56F8300 56F8367 MC56F8167 MC56F8367 MC56F8367E freescale superflash PDF

    CPU12V1

    Abstract: CPU12X IMX 208 CPU12V0 CPU12XV1 292 MAPBGA 8D-13 HC12(CPU12) Reference Manual hcs12 moda modb xgate S12X
    Text: Reference Manual S12 & S12S S12X & S12XS & S12XE Microcontrollers CPU12/CPU12X v01.03 03/2008 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale


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    S12XS S12XE CPU12/CPU12X S12XE CPU12V1 CPU12X IMX 208 CPU12V0 CPU12XV1 292 MAPBGA 8D-13 HC12(CPU12) Reference Manual hcs12 moda modb xgate S12X PDF

    56800E

    Abstract: 56F800 56F807 DSP56F807 DSP56F807VF80 DSP56F807VF80E freescale superflash
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56F807VF80, DSP56F807VF80E


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    DSP56F807VF80, DSP56F807VF80E 56F807 56F800 16-bit DSP56F807 56800E 56F800 56F807 DSP56F807 DSP56F807VF80 DSP56F807VF80E freescale superflash PDF

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


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    SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket PDF

    56F8157

    Abstract: 56F8300 56F8357 MC56F8157 MC56F8357 sim 900A A1465
    Text: Data Sheet Preliminary Technical Data 56F8300 16-bit Digital Signal Controllers MC56F8357 Rev. 15 01/2007 freescale.com Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not


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    56F8300 16-bit MC56F8357 MC56F8357, MC56F8157 56F8357/56F8157 56F8157 56F8300 56F8357 MC56F8157 MC56F8357 sim 900A A1465 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Specifications PART NO: VL47B5263B-K9S/F8S/E7S-IU REV: 1.1 General Information 4GB 512MX64 DDR3 UNBUFFERED SODIMM 204 PIN WITH BGA DRAM COMPONENTS UNDER-FILLED Description The VL47B5263B is a 512Mx64 DDR3 SDRAM high density SODIMM. This memory module consists of


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    VL47B5263B-K9S/F8S/E7S-IU 512MX64 VL47B5263B 256Mx8 204-pin 204-pin, in-li00 PDF

    IC BOSCH 30536

    Abstract: Bosch throttle body motor MPC5606SRM MPC5606S 2PCS02 transistor h331 S13 instrument cluster schematic bosch edc 17 EIC 4021 eMIOS200
    Text: Devices Supported: MPC5602S MPC5604S MPC5606S MPC5606SRM Rev. 5 4 May 2010 MPC5606S Microcontroller Reference Manual, Rev. 5 Freescale Semiconductor 1 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are


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    MPC5606S MPC5606SRM MPC5602S MPC5604S MPC5606S IC BOSCH 30536 Bosch throttle body motor 2PCS02 transistor h331 S13 instrument cluster schematic bosch edc 17 EIC 4021 eMIOS200 PDF

    Lead Free reflow soldering profile BGA

    Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
    Text: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array


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    EB635 Lead Free reflow soldering profile BGA Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181 PDF

    AN3300

    Abstract: sjt1 J-STD-020B
    Text: Freescale Semiconductor Application Note Document Number: AN3300 Rev. 0, 07/2006 General Soldering Temperature Process Guidelines Solder Joint and Package Temperature for Pb-free BGA in SnPB and Pb-free Solders in IR or Convection Reflow Ovens Freescale Semiconductor’s commitment to quality,


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    AN3300 AN3300 sjt1 J-STD-020B PDF

    mpc8314

    Abstract: KMPC Freescale SST MPC mpc8313 etsec Ethernet freescale 352 tepbga MPC864x Freescale usb mcf51jm128 MPC55XX CONFIG P2010 MPC823
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: CWH-PPC-8540N-VE, MPC55xx


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    CWH-PPC-8540N-VE, MPC55xx SG1007Q22009 MPC184VF mpc8314 KMPC Freescale SST MPC mpc8313 etsec Ethernet freescale 352 tepbga MPC864x Freescale usb mcf51jm128 MPC55XX CONFIG P2010 MPC823 PDF

    DDR3-1066

    Abstract: DDR3-1333 PC3-10600
    Text: Product Specifications PART NO: VL47B5263B-K9S/F8S/E7S-IU REV: 1.1 General Information 4GB 512MX64 DDR3 UNBUFFERED SODIMM 204 PIN WITH BGA DRAM COMPONENTS UNDER-FILLED Description The VL47B5263B is a 512Mx64 DDR3 SDRAM high density SODIMM. This memory module consists of


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    VL47B5263B-K9S/F8S/E7S-IU 512MX64 VL47B5263B 256Mx8 204-pin 204-pin, in-li00 DDR3-1066 DDR3-1333 PC3-10600 PDF

    pogo pins

    Abstract: IC274-084344 bga 1296 lga 388 IC274-036274 IC274-048278 IC274-056310 IC274-073158 IC274-080305 IC274-11901
    Text: IC274 Series Test Contactor SMT Pogo Pins (LGA, BGA, CSP - 0.50 to 1.50mm Pitch) Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max.


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    IC274 10mA/20mV pogo pins IC274-084344 bga 1296 lga 388 IC274-036274 IC274-048278 IC274-056310 IC274-073158 IC274-080305 IC274-11901 PDF

    MC908LJ24

    Abstract: MC908Lk24 MC908MR16 mc908mr32 MC3PHAC xc912bc32 MC68376 bdm programming MC9S08SH4 xc912dg128 USBMULTILINKBDME
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56852VFE, DSP56F807VF80, DSP56F807VF80E, MC56F8357VVFE, MC56F8367VVFE


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    DSP56852VFE, DSP56F807VF80, DSP56F807VF80E, MC56F8357VVFE, MC56F8367VVFE SG1006Q12008 MC908LJ24 MC908Lk24 MC908MR16 mc908mr32 MC3PHAC xc912bc32 MC68376 bdm programming MC9S08SH4 xc912dg128 USBMULTILINKBDME PDF