BCR ELECTROFILMS Search Results

WBCR-008

Abstract: bcr efi electrofilms back contact
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale The Back Contact Resistor BCR series single-value backcontact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space.

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • • • • • • • • • Product may not be to scale The Back Contact Resistor BCR series single-value back-contact resistor chip is one of the smallest chips available.

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ The Back Contact Resistor BCR series single-value

electrofilms back contact

Abstract: bcr resistor
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value

bcr20

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10  to 1 M • Oxidized silicon substrate for good power dissipation

Contextual Info: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • Wire bondable • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10  to 1 M • Oxidized silicon substrate for good power dissipation

Waffle Pack Packaging

Contextual Info: Waffle Pack Packaging www.vishay.com Vishay Electro-Films VISHAY ELECTRO-FILMS WAFFLE PACK QUANTITY PER PRODUCT FAMILY 2 inch x 2 inch PRODUCT FAMILY CC1CC2CC3CC4CC5CC6CC7CC8SFC SFM SFP SFN SFX SC3 QFM QFN QFX BCR PWA PWB CTT CTA CCC CTR CTN CTM CTQ CCB

Contextual Info: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi­

100S3

Abstract: WBCR-008
Contextual Info: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi­

Contextual Info: BCK SERIES TH IN -FILM The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space and shorten hybrid assembly time. They are manufactured in the smallest chip size available. These chips are manufactured using state-of-the-art thin-film techniques, are 100%

WBCR02750000F

Abstract: BCR50000FKAHWS
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

tantalum nitride

Abstract: bcr electrofilms back contact resistor
Contextual Info: ELECTRO-FILMS INC/ SEMI- 3ME 3101535 QQGQ174 b THIN-FILM BACK-CONTACT RESISTOR tFEA T U R ES t ì o The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assem bly time. They are manufactured in the sm allest chip size available.

Contextual Info: V i sh ay I n t e rt e ch n o l o g y, I n c . I INNOVAT AND TEC O L OGY BCR N HN Thin Film Resistor O 19 62-2012 Resistors - Space Saving, Back Contact Thin Film, Back Contact Resistor Key Benefits • • • • • Requires only one wire bond, thus saving space

one wire

Contextual Info: PRODUCT SHEET V I S H A Y I N T E R T E C H N O L O G Y, I N C . RESISTORS Model BCR Thin Film, Back Contact Resistor FEATURES • Requires only one wire bond, thus saving space • Second electrical connection is made through the back of the chip • Chips can be attached either eutectically or with conductive epoxy

Vishay Power resistor

Abstract: bcr efi one wire bcr resistor
Contextual Info: Thin Film, Back-Contact Resistor FEATURES • Requires only one wire bond, thus saving space • Second electrical connection is made through the back of the chip • Chip can be attached either eutectically or with conductive epoxy • Smaller footprint than alternative configurations

BCR54

Abstract: QFN50 Ta2N 0020
Contextual Info: CHIP RESISTORS Vishay Electro-Films Thin Film Chip Resistors Wire Bondable Single Value SIZE inches POWER PERFORMANCE FILM VALUE RANGE MODEL ALUMINA SINGLE-VALUE TOP-CONTACT SILICON QUARTZ SINGLE-VALUE CHIP RESISTOR SINGLE-VALUE BACK-CONTACT POWER www.vishay.com

bcr54

Abstract: SFP40 QFN50 bcp58 Ta2N
Contextual Info: CHIP RESISTORS Vishay Electro-Films Thin Film Chip Resistors Wire Bondable Single Value SIZE inches POWER VALUE RANGE PERFORMANCE FILM MODEL ALUMINA SINGLE-VALUE TOP-CONTACT SILICON 0.020 x 0.020 25mW 1Ω - 1 MEGΩ QUARTZ SINGLE-VALUE CHIP RESISTOR SINGLE-VALUE

Contextual Info: Catalog Description This catalog describes Electro-Film s, Inc. products and capabilities in the area of hybrid circuit components and high density interconn ect technology. E F I's packaged precision resistor products are described in the Packaged Resistor Product Catalog.

Contextual Info: C a t a l o g D e s c r ip tio n This catalog describes Electro-Film s, Inc. products and capabilities in the area of hybrid circuit components and h igh density interconn ect technology. E F l's packaged precision resistor products are described in the Packaged

Contextual Info: V ishay I ntertechnolog y, I nc . I INNOVAT AND TEC O L OGY Vishay Electro-Films N HN WIRE BONDABLE PASSIVE COMPONENTS O 19 62-2012 Resistors - High-Reliability Components Full Range of Wire Bondable Passive Components INTRODUCTION Vishay Electro-Films EFI offers a full range of wire bondable passive components that includes