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    Untitled

    Abstract: No abstract text available
    Text: Multilayer Chip Balanced Filter – SLFBF Series Operating Temp. : -40℃~+85℃ FEATURES Small size, enable high density mounting Low insertion loss, high attenuation Surface mount type, high reliability z ● ● APPLICATIONS Mobile communication system, such as GSM, DCS, PCS, etc.


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    PDF -2R450G 2R450G 2170MHz 5000MHz 7500MHz SLFBF21 -C01T 960MHz 1880MHz

    6JK3

    Abstract: BC733 bc735 usb common mode choke BC380 BC628 MMDR BC148 pin configuration BC702 Wistron Corporation
    Text: A B C D E D H2 BLOCK DIAGRAMVER.-4 Project Code 4 4,5 3 ICS 94239 M/B D/D LAUNCH CDROM IR 2ND HDD DESKTOP CPU For ENG Willamette For M/P Northwood CLK GEN 6 0.18u 1.3G~1.8G G768D 0.13u 2.0G~2.4G 500mA; 600mA 15 7,8 9,10,11 3 2002/06/06 DDR*2 MCH 15 ATI P6


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    PDF 42Z01 01384-SA ADP3203 150mA G768D 500mA; 600mA 41T01 41T02 41T03 6JK3 BC733 bc735 usb common mode choke BC380 BC628 MMDR BC148 pin configuration BC702 Wistron Corporation

    78u30

    Abstract: oz9981 temic 0675 c9 temic 0675 d4 BC555 oz9983 oz99 temic 0675 d6 BC148 pin configuration foxconn
    Text: Jan. 11 2002 C-Note 2 Block Diagram Mobile CPU 3 HOST BUS LCD 13 CH70011 Almador-M 133MHz 10 12 To P.R. 7,8,9 MIC IN AC'97 CODEC HUB I/F . X I 66MHz AD1881A 24 PCI BUS Line Out OP AMP CARDBUS PWR SW TI 1410A TPS2211A AC-Link O C 11 DVO BUS / 66MHz GMCH Final version


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    PDF 133MHz CH70011 133MHz 66MHz AD1881A 66MHz TPA0202 TSB43AB21 TPS2211A 47R27 78u30 oz9981 temic 0675 c9 temic 0675 d4 BC555 oz9983 oz99 temic 0675 d6 BC148 pin configuration foxconn

    bc733

    Abstract: PLW3216S 74BC645 bc732 TSLCX74 BC242 foxconn BC148 pin configuration 6JK3 wistron
    Text: A B C D H2 BLOCK DIAGRAM E 2002/02/18 VER.S2 Project Code Project Code 4 4,5 DESKTOP CPU For ENG Willamette For M/P Northwood 3 CLK GEN ICS 94239 M/B D/D LAUNCH CDROM IR 2ND HDD 0.18u 1.3G~1.5G 0.13u 2.0G~2.4G 6 G768D 48.41T01.001 48.41T02.001 48.41T03.001


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    PDF 41T01 41T02 41T03 41T05 41T06 43M03 41TZ1 G768D 01384-SA bc733 PLW3216S 74BC645 bc732 TSLCX74 BC242 foxconn BC148 pin configuration 6JK3 wistron

    mcl d01 display

    Abstract: M1535 a1 wistron winstron BC712 BC179 BC698 oz711 geforce2 MH167
    Text: CPU DDR BUFFER PG.4,5 2M * 32bit*4Bank* 4 PG.15 CRT VGA PG.18 LCD NVIDIA GEFORCE2GO 100/200 LVDS PG.18 TV OUT AGP 4x 1.5v 66MHz PG.6,7,8,9 TV ENCODER CH7007 PG.17 1394 VT6306L PG.28 CARDBUS OZ6912/711E3 PG.25,26 SMART CARD ATA 66/100 MiniPCI PIDE HDD PG.30


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    PDF 32bit 100MHz 266MHz 66MHz CH7007 33MHz 33MHz VT6306L OZ6912/711E3 8100BL mcl d01 display M1535 a1 wistron winstron BC712 BC179 BC698 oz711 geforce2 MH167

    U118G

    Abstract: af15 hf ne BTA 36 L31 PIC16F73 inverter circuit diagram CM850 bc154 mi dip 16f73 Wistron Corporation foxconn ww174
    Text: A B C D-Note Block Diagram 16 10, 11, 12 AGP 4x MIC IN AC'97 CODEC AD1881A I F A N 27 AC-Link 28 ICH3-M TSB43AB21 I H 26 IDE PRIMARY HDD 20 C . IDE UltraBay CD/DV DROM CD-RW /FDD NEST/HDD /Battery W W 20 MiniPCI W AC-Link Line Out 37, 38, 39, 40, 41 INPU TS


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    PDF 01218-MP3 42T01 100MHz 266MHz AD1881A 66MHz TPA0202 40C21 U118G af15 hf ne BTA 36 L31 PIC16F73 inverter circuit diagram CM850 bc154 mi dip 16f73 Wistron Corporation foxconn ww174

    47AB

    Abstract: SCD1U16V3KX BCB25 BC536 BC163 216t9 sis645dx foxconn WISTRON BC466
    Text: CLK GEN TOUCAN2 DesKtop-CPU Northwood 2.2~3.06GHz ICS:ICS952004AG DDRBUF:ICS93732 3,4 5,6 VRAM*2 FSB 533/400MHz K4D263238M-QC40 CRT 17 2.5V 200MHz/266MHz DDR * 2 11,12,13 SiS962 24 CD-ROM AGP 4X W/RTC 15" MII LAN MAC PHY 20,21,22,23 1394 conn. Agere FW802A


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    PDF ICS952004AG ICS93732 06GHz K4D263238M-QC40 533/400MHz 200MHz/266MHz 47Y01 SiS645DX 66MHz 16bits/533MBs 47AB SCD1U16V3KX BCB25 BC536 BC163 216t9 foxconn WISTRON BC466

    temic 0675 D4

    Abstract: temic 0675 c9 temic 0675 d6 temic 0675 d1 oz9983 PLW3216S102SQ2 KBC-M38859 BC200 rfid U123D Wistron Corporation
    Text: Mar. 22 2002 Cnote 3 Block Diagram Mobile CPU 3 HOST BUS 01204-4 CRT CONN 4,5 L1: Signal 1 L2: GND TV OUT Tualatin Celeron-T CLK GEN. ICS 950806 PCB LAYER LCD 13 For C2 SOVP 14 L4: Signal 3 Final version L5: GND C3 SVT LVDS 133MHz L3: Signal 2 L6: POWER L7: Signal 4 weak


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    PDF 133MHz CH70011 133MHz 66MHz MAX1631/MAX1772 AD1881A 66MHz TPS2211A 42P26 47R27 temic 0675 D4 temic 0675 c9 temic 0675 d6 temic 0675 d1 oz9983 PLW3216S102SQ2 KBC-M38859 BC200 rfid U123D Wistron Corporation

    BC647

    Abstract: bc657 C1093 smd diode c644 DIODE SMD c336 BC679 BC625 smd diode C645 smd diode c640 smd diode R645
    Text: This Document can not be used without Samsung's authorization. 10. Main System Part List CODE 3920501 0401-000191 DESCRIPTION REFERENCE EA jack-usb-4p-mnt4, JACK-USB;-,-,-,-,- J505 J2501 J2502 3 diode, DIODE-SWITCHING;MMBD4148,75V,200MA,SOT-23,TP D4 D16 D22 D23


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    PDF MMBD4148 200MA OT-23 MBR0540 OD-123 1000MA DO-214AC B340A 5245B 225MW BC647 bc657 C1093 smd diode c644 DIODE SMD c336 BC679 BC625 smd diode C645 smd diode c640 smd diode R645

    oz711

    Abstract: R7F7 bc417 OZ860 tdk ferrite pc95 BC481 BC380 TPA6017 BC339 3AD4
    Text: 5 4 3 2 1 xuanvinhbkt S06/S07 System Block Diagram D D Thermal Mobile CPU ICS954226 03 C1 Stepping 04.05 HOST BUS DDR2 400/533Mhz C Int MIC In Ext MIC In OUTPUTS 5V_S5 13 3V_S5 DCBATOUT LVDS PCI Express 5V_AUX LCD 3D3V_AUX 14 VGA Board NV44M S-Video SYSTEM DC/DC


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    PDF S06/S07 ICS954226 G768D MAX1999 MAX651018 NV44M 400/533MHz OZ824 100MHz oz711 R7F7 bc417 OZ860 tdk ferrite pc95 BC481 BC380 TPA6017 BC339 3AD4

    R5C485-LQFP144

    Abstract: bc725 BC698 BC236 BC709 bc711 BC717 BC683 RC300MB SMD RA3 PNP
    Text: 8 Part List 8-1 Exploded View 8-1-1 System Exploded Housing Bottom P28 8-1 This Document can not be used without Samsung’s authorization. 8 Part List No Part Name Code No Q’ty Specification Vendor 1 UNIT/HOUSING-BOTTOM BA75-01374A 1 SON & ARRK 2 FAN BA31-00018A


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    PDF BA75-01374A BA31-00018A BA92-02744A BA75-01375A BA59-01294A BA61-00910A BA43-00134A BA75-01376A BA59-01052A BA75-01377A R5C485-LQFP144 bc725 BC698 BC236 BC709 bc711 BC717 BC683 RC300MB SMD RA3 PNP

    77C7

    Abstract: 887c 1r12r
    Text: This Document can not be used without Samsung's authorization. 10. Main System Part List CODE 3920501 0401-000191 DESCRIPTION REFERENCE EA jack-usb-4p-mnt4, JACK-USB;-,-,-,-,- J505 J2501 J2502 3 diode, DIODE-SWITCHING;MMBD4148,75V,200MA,SOT-23,TP D4 D16 D22 D23


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    PDF

    1g22SB

    Abstract: SB3211 BC741 SIS 648 SB315 CP2216 AMS1117 1104 BC246 RB342 diode sb315
    Text: M A R G A I D K C O L B M E T S Y S D 3 K PCB LAYER High Speed DDR-SDRAM K4D263238A-GC36 Clock Gen CY28381 100MHz P.17,18 DeskTop CPU Northwood FSB 400/533MHz P.11 2.5V 266/333MHz P.19 275MHz P.5,6 P.3 DDR*2 CRT CONN Delay Buffer CY28352 2.5V 266/333MHz P.4


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    PDF CY28381 K4D263238A-GC36 100MHz 400/533MHz 275MHz 266/333MHz CY28352 NV18-PRO) 133MHz 1g22SB SB3211 BC741 SIS 648 SB315 CP2216 AMS1117 1104 BC246 RB342 diode sb315

    bc725

    Abstract: BC248 BC249 BC195 BC105* BC106* BC107* BC108* BC109* BC110 bc711 BC710 bc188 BC712 BC246
    Text: This Document can not be used without Samsung’s authorization. 9 Schematic Material List 9-1 Main Board Part List Code Location Category Spec 0902-001840 D 730 IC-MICROPROCESSOR 730PGA,1.6GHz,64Bit,uF 3709-001236 J1 CONNECTOR-CARD EDGE 68P,1.27MM,ANGLE,AU


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    PDF 100nF 100nF, 2K/33OHM 220PF 10000NF, bc725 BC248 BC249 BC195 BC105* BC106* BC107* BC108* BC109* BC110 bc711 BC710 bc188 BC712 BC246

    BC539

    Abstract: SCD1U10V bc540 BC541 BCB25 BCB47 bc647 ICS952023 bc639 b35 ICS952023FT
    Text: CLK GEN Toucan2+ DesKtop-CPU Northwood 2.2~3.2GHz ICS:ICS952023FT DDRBUF:ICS93732 3,4 5,6 Project code: PCB P/N : REVISION : VRAM*2 FSB 800/533/400MHz K4D263238M-QC40 CRT 17 2.5V 200MHz/266/333MHz DDR * 2 11,12,13 CD-ROM AGP 4X SiS963 24 W/RTC PHY 20,21,22,23


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    PDF ICS952023FT ICS93732 K4D263238M-QC40 800/533/400MHz 200MHz/266/333MHz 47Y01 SiS648FX 66MHz 16bits/533MBs ATA100 BC539 SCD1U10V bc540 BC541 BCB25 BCB47 bc647 ICS952023 bc639 b35

    Foxconn L S-36

    Abstract: wistron rc71 MH187 BC643 b1535 foxconn Wistron Corporation BCC-11 BC148 pin configuration
    Text: CPU TV OUT LCD VGA LVDS PG.18 PG. 14,15,16,17 PG.26 PG.29,30 CARDBUS PORT 802.11b 1394 PORT LAN LAYER 5 SIGNAL LAYER 6 GND RJ45 RJ11 PRIMARY IDE TXFM LAYER 7 SIGNAL ATA 66/100 LAYER 8 COMPONENT MDC PG.21 PG.32 PG.28 LPC DEBUG CONN 1st HDD CD ROM PG.38 FIR


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    PDF 66MHz 100MHz 266MHz MAP-17 33MHz 44T01 33MHz uPD720100 48Mb/S 8100BL Foxconn L S-36 wistron rc71 MH187 BC643 b1535 foxconn Wistron Corporation BCC-11 BC148 pin configuration

    BC249

    Abstract: BC248 BC246 bc711 bc725 bc732 BC247 BC217 samsung R519 BC735
    Text: This Document can not be used without Samsung’s authorization. 9 Schematic Material List 9-1 Main Board Part List Code Location Category Spec 0902-001840 D 730 IC-MICROPROCESSOR 730PGA,1.6GHz,64Bit,uF 3709-001236 J1 CONNECTOR-CARD EDGE 68P,1.27MM,ANGLE,AU


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    PDF 100nF 100nF, 2K/33OHM 220PF 10000NF, BC249 BC248 BC246 bc711 bc725 bc732 BC247 BC217 samsung R519 BC735