BACKSHELL FOR BACC10 Search Results

BACKSHELL FOR BACC10 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
GCM188D70E226ME36D		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for Automotive
GRM022C71A472KE19L		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM033C81A224KE01W		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM155D70G475ME15D		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM155R61J334KE01D		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose

BACKSHELL FOR BACC10 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
ms90362-3 Abstract: BACC47 en3545 BACC65 bacc10 ms3459 backshell BACC63BP BACC66 ms24266r ms90362 Text: AUTHORIZED DISTRIBUTOR AND/OR ASSEMBLY FACILITY FOR BOEING FQIS HARNESSES B-707/B-727/B-737 10-60479 B-727 10-61757 B-737 10-61827 B-747 60B40037 B-747 60B40147 B-747-NG S283A202 B-757/B-767 S283T025 B-747-400 S283U007 Series Series Series Series Series Series	Original	PDF	B-707/B-727/B-737 B-727 B-737 B-747 60B40037 60B40147 B-747-NG S283A202 B-757/B-767 ms90362-3 BACC47 en3545 BACC65 bacc10 ms3459 backshell BACC63BP BACC66 ms24266r ms90362
DC-37PTI Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500 Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.	Original	PDF	C-865 UT-304 FCT-551 FCT-552 DC-37PTI ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
BACC63CB Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.	Original	PDF	C-865 UT-304 FCT-551 FCT-552 BACC63CB bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
DIN 41529 Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.	Original	PDF	C-865 UT-304 FCT-551 FCT-552 DIN 41529 bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb