Untitled
Abstract: No abstract text available
Text: BCR www.vishay.com Vishay Electro-Films Thin Film, Back-Contact Resistor FEATURES • • • • • • • • • Product may not be to scale The Back Contact Resistor BCR series single-value back-contact resistor chip is one of the smallest chips available.
|
Original
|
PDF
|
MIL-STD-883,
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
|
Untitled
Abstract: No abstract text available
Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment
|
Original
|
PDF
|
100ppm/
-10001F-E
2ST-10001F-E
105-F-0306
|
Untitled
Abstract: No abstract text available
Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment
|
Original
|
PDF
|
100ppm/
2ST-10001F-E
-10001F-E
105-D-1198
|
F0306
Abstract: No abstract text available
Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The MSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment
|
Original
|
PDF
|
100ppm/
-10001F-E
2ST-10001F-E
105-F-0306
F0306
|
Untitled
Abstract: No abstract text available
Text: TX CALIFORNIA MICRO DEVICES Back-Contact Thin Film Resistor Series California Micro Devices TX Series back contact 20 mil resistor chips offer the superior properties of Tantalum Nitride material in a single-bond design. Conductive epoxy or eutectic die-attachment to an active substrate
|
Original
|
PDF
|
100Vdc
C1350800
|
Untitled
Abstract: No abstract text available
Text: TX CALIFORNIA MICRO DEVICES Back-Contact Thin Film Resistor Series California Micro Devices TX Series back contact 20 mil resistor chips offer the superior properties of Tantalum Nitride material in a single-bond design. Conductive epoxy or eutectic die-attachment to an active substrate
|
Original
|
PDF
|
100Vdc
C1350800
|
Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
|
Original
|
PDF
|
MIL-STD-883.
08-Apr-05
|
Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square. • Resistance range: 10 Ω to 1 MΩ The Back Contact Resistor BCR series single-value
|
Original
|
PDF
|
MIL-STD-883.
08-Apr-05
|
electrofilms back contact
Abstract: bcr resistor
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
|
Original
|
PDF
|
MIL-STD-883.
03-Aug-04
electrofilms back contact
bcr resistor
|
Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
|
Original
|
PDF
|
MIL-STD-883.
29-Mar-04
|
WBCR-008
Abstract: bcr efi electrofilms back contact
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale The Back Contact Resistor BCR series single-value backcontact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space.
|
Original
|
PDF
|
MIL-STD-883.
07-Aug-01
WBCR-008
bcr efi
electrofilms back contact
|
Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor With Part Mark FEATURES Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip requires
|
Original
|
PDF
|
MIL-STD-883.
07-Aug-01
|
Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
|
Original
|
PDF
|
MIL-STD-883.
03-Aug-04
|
Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
|
Original
|
PDF
|
MIL-STD-883.
23-Mar-04
|
|
Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
|
Original
|
PDF
|
MIL-STD-883.
08-Apr-05
|
Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
|
Original
|
PDF
|
08-Apr-05
|
Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
|
Original
|
PDF
|
18-Jul-08
|
Untitled
Abstract: No abstract text available
Text: MINI-SYSTEMS INC llllM BACK CONTACT RESISTORS L517&5D OOOO'ifib 327 S7E I> MSBC SERIES The MSBC series back contact chip resistor offers designers a space-saving design in a .020" * .020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the
|
OCR Scan
|
PDF
|
125mW,
MSBC-2-S-T-10K-01
|
Untitled
Abstract: No abstract text available
Text: THIN FILM BACK CONTACT RESISTORS MSBC SERIES The M S B C series back contact chip resistor offers designers a space-saving design in a . 0 2 0 " x . 0 2 0 " size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the
|
OCR Scan
|
PDF
|
125mW,
100ppm
MSBC-2-S-T-10K-01
|
Untitled
Abstract: No abstract text available
Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi
|
OCR Scan
|
PDF
|
15x15
20x20
22x22
QDD02M7
|
BCP 39
Abstract: WBCR-008
Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact S Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi
|
OCR Scan
|
PDF
|
50ppm/
400Q1kU
BCP 39
WBCR-008
|
100S3
Abstract: WBCR-008
Text: Tantalum on Silicon Chip Resistors BCR, BCM, BCP Back Contact Features Back-contact series chip resistors are single valued, small sized, and require only one wire bond, thus providing higher hybrid density and reduced assembly time. They are widely used where space is a premi
|
OCR Scan
|
PDF
|
50ppm/
100S3
WBCR-008
|
Untitled
Abstract: No abstract text available
Text: FEATURES The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assembly time. They are manufactured in the smallest chip size available. BCR SERIES THIN-FILM BACK-CONTACT These chips are manufactured using state-of-the-art thin-film techniques, are
|
OCR Scan
|
PDF
|
MIL-STD-883.
|
tantalum nitride
Abstract: bcr electrofilms back contact resistor
Text: ELECTRO-FILMS INC/ SEMI- 3ME 3101535 QQGQ174 b THIN-FILM BACK-CONTACT RESISTOR tFEA T U R ES t ì o The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assem bly time. They are manufactured in the sm allest chip size available.
|
OCR Scan
|
PDF
|
MIL-STD-883.
tantalum nitride
bcr electrofilms
back contact resistor
|