ANSI Y14.5 Search Results

ansi y14.5m-1982

Abstract: Series PVT322
Contextual Info: Series PVT322 Mechanical Specifications Dimensions in millimeters inches Figure 7. Delay Time Definitions Figure 8. Typical Output Capacitance 1. Dimensioning and tolerancing per ANSI Y14.5M-1982 2. Controlling dimension: INCH ➃ Dimension does not include mold protrusions.

sot23 footprint

Abstract: sot-23 footprint
Contextual Info: Transient Voltage Suppressors — Surface Mounted 40 Watt Peak Power NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS

Contextual Info: NOTES: DIMENSIONING & TOLERANCING PER ANSI Y14.5M -1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES], 18.10 [.7125] B 17.70 [.6969] OUTLINE CONFORMS TO JEDEC OUTLINE M S-013AE. E DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING

6-32UNC-2A

Contextual Info: NOTES: 1 DRAWINGS IN ACCORDANCE WITH STANDARD ANSI Y14.5M-1994. 2) UNTOLERANCED DIMENSIONS LOCATING TRUE POSITION ARE BASIC. 3) THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND IS COPYRIGHTED. EXCEPT WITH THE WRITTEN PERMISSION OF SPECTRUM CONTROL, INC. OR ITS

821E

Contextual Info: Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 0.076 TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

357-D

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS POWERTAP & #153 III CASE 357D–01 ISSUE A DATE 01/02/2000 SCALE 1:1 A Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TERMINAL PENETRATION: 5.97 0.235 MAXIMUM.

MARKING O1B

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS CASE 483–01 ISSUE B DATE 04/20/2001 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS

Contextual Info: 853–1242B 06575 1. Package dimensions conform to MIL-M-38510, Outline No. C-12, 32 leads. Rectangular Ceramic Leadless Chip Carrier. 2. Controlling dimension: Inches. Millimeters are shown in parentheses. 3. Dimension and tolerancing per ANSI Y14.5M – 1982.

Contextual Info: CASE OUTLINES AND PACKAGE DIMENSIONS SOIC–14 CASE 751A–03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006

MS-034

Abstract: JEDEC FBGA 11 JEDEC MS-034-AAJ-1
Contextual Info: Altera Device Package Information 400-Pin Wirebond FineLine Ball-Grid Array FBGA • ■ ■ All dimensions and tolerances conform to ANSI Y14.5M – 1994. Controlling dimension is in millimeters. M is the maximum solder ball matrix size. Package Information

LB 11911

Abstract: ELF120GGC-4Z50 MIL-0-45204 ECN3313 burndy CARD EDGE SE9562
Contextual Info: NOTES: UNLESS OTHERWISE SPECIFIED, 1 INTERPRET THIS DRAWNG IN ACCORDANCE WITH ANSI Y14.5M-19B2. CATALOG NUMBER DE5CRFTI0N L1 Z COMPONENT BOARD MATERAL: P.C. BOARD: FR-4 WITH 1 OZ. [26,35fl] MIN COPPER PADS. PAD PLATING. 30 MICRONCHES [0,75 MICRONS] MN. 0CLD,

09Ah

Abstract: 14-PIN
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT-23 TO-236 CASE 318-09 ISSUE AH SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS

Contextual Info: NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006 PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR

8XD0

Contextual Info: Package Information P SUFFIX PLASTIC PACKAGE CASE 626-05 ISSUE K NOTES: 1. 2. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. PACKAGE CONTOUR OPTIONAL ROUND OR SQUARE CORNERS . DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. MILLIMETERS INCHES

751E-04

Contextual Info: -A- 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006 PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR

821D-03

Contextual Info: Q –L– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT

Contextual Info: Case Outlines http://onsemi.com 1099 Case Outlines TO–226AA, TO–92 CASE 29–11 ISSUE AL SCALE 1:1 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 5 LEAD TO–220 TFVA5 CASE 314N–01 ISSUE O SCALE 1:1 –T– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION.

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOD–323 CASE 477–02 ISSUE C DATE 04/30/2002 SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING.

499AC

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 9 BUMP, 1.55X1.55X0.5 PITCH CASE 499AC−01 ISSUE B 1 SCALE 4:1 DATE 20 JUL 2004 −A− 4X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B−01 ISSUE B SCALE 4:1 DATE 27 MAY 2005 D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES

DIMENSIONS soic 16

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K DATE 29 DEC 2006 SCALE 1:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

Contextual Info: 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 0.006

JEDEC FBGA 12 19

Abstract: MS-034 JEDEC OUTLINE
Contextual Info: Altera Device Package Information 324-Pin Non-Thermally Enhanced FineLine Ball-Grid Array FBGA • ■ ■ All dimensions and tolerances conform to ANSI Y14.5M – 1994. Controlling dimension is in millimeters. M is the maximum solder ball matrix size. Package Information