AMS-QQ-P-35 TYPE 2 Search Results

Contextual Info: CAD GENERATED DRAWING DCN CONTROLLED DOCUMENT DWG.NO. S F 1279 - 6001 MATERIAL BODY: ST AINLESS STEEL PER AMS-5640 CONTACT: BE RYLLIUM COPPER PER ASTM B l 96 INSULATOR: TEFLON PER ASTM D1710 FINISH BODY: PASSIVAT ED PER QQ-P-35, TYPE II CONTACT GOLD PER ASTM B 4 8 8 , TYPE II,

Contextual Info: CAD GENERATED DRAWING DCN CONTROLLED DOCUMENT DWG.NO. SF1122-6019 MATERIAL BODIES: ST AINLESS STEEL PER AMS-5640 CONTACT: BE RYLLIUM COPPER PER ASTM B l 96 INSULATOR: TEFLON PER ASTM D1710 1 015 . BODIES: PASSIVAT ED PER QQ-P-35, CONTACT GOLD PER ASTM B 4 8 8 , TYPE II

Contextual Info: CAD GENERATED DRAWING DCN CONTROLLED DOCUMENT DWG.NO. SF1122-6020 MATERIAL BODIES: ST AINLESS STEEL PER AMS-5640 CONTACT: BE RYLLIUM COPPER PER ASTM B l 96 INSULATOR: TEFLON PER ASTM D1710 1 .0 1 5 - BODIES: PASSIVAT ED PER QQ-P-35, CONTACT GOLD PER ASTM B 4 8 8 , TYPE II

Contextual Info: TOSHIBA TENTATIVE TA2123AF TOSHIBA BIPOLAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA2123A F 1.5 V STEREO HEADPHONE AMPLIFIER The TA2123AF is the system amplifier IC which is developed for playback stereo headphone equipments. It is built in dual auto-reverse preamplifiers, dual power

1481P

Contextual Info: fax id: 2006 CYM1471 CYM1481 1024K x8 SRAM Module 2048K x 8 SRAM Module Feat u res • High-d ensity 8-/16-megabit S R A M m o d u les • High-speed C M O S S R A M s — A c c e s s t i m e of 70 n s • L o w active power are constructed from eight 1471 or sixteen (1481) 128K x 8

PS08

Abstract: 100C CYM1471 CYM1481
Contextual Info: fax id: 2006 i , *" : -:V:V:V:V:V:Tÿ:- : i ^ :^ ; ^3»* i ; i M m i : M M :i : i i CYM1471 CYM1481 ^ i i i i i i yy c y p r e s s 1024K x 8 SRAM Module 2048K x 8 SRAM Module Features • High-density 8-/16-megabit SRAM modules • High-speed CMOS SRAMs — Access tim e of 70 ns

Contextual Info: Rectangular Connectors JACKMATE MCJM Series Metal Shell Center Jackscrew Connectors Technical and Performance Data for Metal Shell Electrical Contact Resistance — The average mated contact resistance is 4 milliohms, with a maximum value of 8 milliohms, using standard 24 AWG solid copper

Contextual Info: fax id: 2006 «f CYM1471 CYM1481 c y pr es s 1024K x 8 SRAM Module 2048K x 8 SRAM Module Features • High-density 8-/16-megabit SRAM modules • High-speed CMOS SRAMs — Access tim e of 70 ns • Low active power are constructed from eight 1471 or sixteen (1481) 128K x 8

LDB726

Abstract: 2an transistor ICM7232B
Contextual Info: ICM7231, ICM7232 Numeric/Alphanumeric Triplexed LCD Display Driver December 1993 Features Description • ICM7231 Drives 8 Digits of 7 Segments with Two Inde­ pendent Annunciators Per Digit Address and Data Input In Parallel Format The ICM7231 and ICM7232 family of integrated circuits are

Waveguide Gaskets

Abstract: MIL-DTL-85328 WR137 gasket dimensions M83528 001 Waveguide Gaskets WR187 ZZ-R-765 CLASS 2B, GRADE 50 SHELF LIFE m83528 MIL-DTL-83528C WR340 waveguide fluorosilicone curing
Contextual Info: Elastomeric EMI Shielding Solutions www.lairdtech.com Innovative Technology for a Connected World ANTENNAS & RECEPTION WIRELESS REMOTE CONTROL EMI SOLUTIONS THERMAL MANAGEMENT WIRELESS M2M & TELEMATICS ABOUT LAIRD TECHNOLOGIES Laird Technologies designs and manufactures customized, performance-critical

ctc 880 transistor application

Abstract: TRANSISTOR irf 630
Contextual Info: TLC27M4, TLC27M4A, TLC27NI4B, TLC27M4Y, TLC27M9 LinCMOS PRECISION QUAD OPERATIONAL AMPLIFIERS SLOS093B - OCTOBER 1987 - REVISED AUGUST 1994 0,J,N,ORPWPACKAGE TOPVIEW Trimmed Offset Voltage: TLC27M9 . . . 900 fiV Max at TA = 25°C, V dd = 5 V 10UT [ 1

Contextual Info: HI5816 HARRIS S E M I C O N D U C T O R CMOS 12-Bit Sampling A/D Converter with Serial Data Output and Internal Track and Hold Features Description • 20|xs Conversion Time The HI5816 is a fast, low power, 12-bit successive approximation analog-to-digital converter. It can operate

M83528/002D-017

Contextual Info: EMI CATALOG www.lairdtech.com ABOUT LAIRD Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. Laird operates through two divisions, Wireless Systems and

Contextual Info: TO SHIBA TB1246AN TOSHIBA Bi-CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC TB1246AN NTSC 1 CHIP IF + V C D PROCESSOR IC TA1246AN is the IF & Video processing IC for NTSC color TV system. This IC demodulates NTSC PIF, SIF and composite video signal to R / G / B primary colors and

ERO Electronic F-48

Abstract: mp 130i power transformer NEC a1601 ARC-231 diode CMS PJ 86 LV ARC-600 krc 118 056 ANTENNA WEIGHT e87j ROE EK L2 capacitors K1307
Contextual Info: AN 16 -30 ARC5-2 Handbook Maintenance Instructions AN/ARC-5 AIRCRAFT RADIO EQUIPMENT LF MF HF COMPONENTS THIS PUBLICATION SUPERSEDES AN 16-30ARC5-2 DATED 23 FEBRUARY 1944 REVISED 1 MAY 1953 WHICH SHOULD BE REMOVED FROM FILES AND DESTROYED. PUBLISHED UNDER AUTHORITY O F THE SECRETARY O F THE AIR FORCE

stk 795 813

Abstract: RF-ASMB-88 408-08521 microdot s-93 AMS-2404 microdot tyco 095 rf-asmb-8 microdot 10-32 female connector microdot feed-thru connectors m83513/5-02
Contextual Info: MICRODOT Connectors Table of Contents Microdot Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Microminiature D Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35

EN3155 Cross Reference

Abstract: en3155 m39029 D38999 series I II BACC47 en3155 crimping tools MS24264EXXTXX draka fileca cable ABS1503 en3155 017 aecma NF26Q100
Contextual Info: Amphenol 2010 Amphenol 12-C3 Circular Interconnects Products for Military, Aerospace and Harsh Environments Circular Interconnects • Aluminum • Stainless Steel/Firewall • Composite • Printed Circuit Board Connectors • High Speed Connectors • EMI Filter/Transient

AMP PBT connector 7 way

Abstract: EN3155 Cross Reference en3155 m39029 BOEING bacc63 D38999 series I II MS27615-KXXBXX MS27295 MS24254-16P aecma en3155 L-2119-E
Contextual Info: Amphenol 2010 Amphenol 12-C3 Circular Interconnects Products for Military, Aerospace and Harsh Environments Circular Interconnects • Aluminum • Stainless Steel/Firewall • Composite • Printed Circuit Board Connectors • High Speed Connectors • EMI Filter/Transient

microdot tyco 095

Abstract: raychem mtc 100 connector microdot 10-32 male connector microdot 10-32 female connector MCDM1-15S 096-0002-0015 microdot s-93 083-0158-00R4 086-0099-00F5 mcdm1
Contextual Info: MICRODOT and NANONICS Connectors MICRODOT and NANONICS Connectors Tyco Electronics Corporation Harrisburg, Pennsylvania www.tycoelectronics.com 1308638 10M GIC CGX 8-05 MICRODOT and NANONICS Connectors MICRODOT Connectors Disclaimer While Tyco Electronics has made every

1001d

Contextual Info: CYPRESS PRELIMINARY C Y 7 C 95 4D X ATM HOTLink Transceiver Features technology, functionality, and integration over the field proven CY7B923/933 HOTLink. Second generation HOTLink technology UTOPIA level I and II compatible host bus interface Three-bit Multi-phy address capability built-in

220v AC voltage stabilizer schematic diagram

Abstract: BA 49182 RJh 3047 rjh 3047 equivalent a1458 opto philips ecg master replacement guide MOSFET, rjh 3077 sc1097 philips ecg semiconductors master replacement guide Electronic ballast 40W using 13005 transistor
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 2-6 Fiber Optic Connectors and Accessories . . . . . . . . . . . See Page 121 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 10-122 Fiber Optic Cable, Connectors, and Accessories . . . . . . See Pages 118-122

XAPP031

Contextual Info: £ XILINX XC4000E and XC4000X Series Field Programmable Gate Arrays November 10,1997 Version 1.4 Product Specification XC4000E and XC4000X Series Features Low-Voltage Versions Available Note: XC4000 Series devices described in this data sheet include the XC4000E family and XC4000X Series.

hall marking code A04

Abstract: INTELDX4 write-through YSS 928
Contextual Info: INTEL486 PROCESSOR FAMILY • lntelDX4TM P ro c e s s o r — Up to 100-MHz Operation -Speed-M ultiplying Technology — 32-Bit Architecture — 16K-Byte On-Chip Cache — Integrated Floating-Point Unit — 3.3V Core Operation with 5V Tolerant I/O Buffers