AMKOR RDL Search Results

AMKOR RDL Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
G6421-A		Coilcraft Inc	General Purpose Inductor, 1 Element, RADIAL LEADED
G6422-A		Coilcraft Inc	General Purpose Inductor, 1 Element, RADIAL LEADED
G6426-A		Coilcraft Inc	General Purpose Inductor, 1 Element, RADIAL LEADED
132-15		Coilcraft Inc	General Purpose Inductor, 0.333uH, 5%, 1 Element, Ferrite-Core, 3823, RADIAL LEADED
146-03J08SL		Coilcraft Inc	Variable Inductor, 0.08uH Min, 0.09uH Max, Carbonyl-Core, Shielded, 3030, RADIAL LEADED, ROHS COMPLIANT

AMKOR RDL Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
CSPNL Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the	Original		PDF
amkor RDL Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the	Original		PDF
amkor flip Abstract: wlcsp inspection amkor RDL amkor Sip dS721 Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the	Original		PDF
95Pb Abstract: FCCSP amkor RDL Text: data sheet W A F E R L E V E L PAC K AG I N G CSPnl Features: Wafer Level Packaging CSPnl™ Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP Chip Scale Package products. Through the	Original		PDF
WLCSP flip chip Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters	Original		PDF
WLCSP smt Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None	Original	AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition	PDF