AMB1608C5512Z10 Search Results

AMB1608

Contextual Info: MD-MDE008-0307 MULTILAYER CHIP BALUN AMB2012 Typ Features • Low loss • High balance characteristic Specification Center Frequency(fo) 2450.0MHz Frequency Range f0 ± 50MHz Insertion Loss 1.0Db max. (f0 ± 50MHz) Unbalance Lmpedance 50Ω Balance impedance

Contextual Info: MD-MDE009-0711 Multilayer Chip Balun: AMB1608 Series Device Features „ „ „ Applications Miniature Size and Low Profile 1.6mm x 0.8mm x 0.6mm Low Insertion Loss (0.6dB typ. /C2450series) RoHS Compliant Wireless LAN, Bluetooth module WiMAX „ „ Shape & Dimensions

AMB1608C2450

Abstract: AMB1608C
Contextual Info: MD-MDE009-0307 Multi-layer chip balun Features Low loss High balance characteristic Specification Amp. BW Z Ω IL VSWR Phase Balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 1.0 1.5 180±10 1.0 AMB1608C2450Z10 2400 - 2500 100

AMB1608C2450

Contextual Info: MD-MDE009-0307 MULTILAYER CHIP BALUN AMB1608 Typ Features • Low loss • High balance characteristic Specification BW Z（Ω） Parts Number IL VSWR Phase Balance Amp. balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 1.0 1.5

Contextual Info: MD-MDE009-0501 Multi-layer chip balun Features Low loss High balance characteristic Specification Parts Number BW Z（Ω） IL VSWR Phase Balance Amp. balance [MHz] balance [dB Typ] [Typ] [deg Typ] AMB1608C2450Z05 2400 - 2500 50 0.7 1.5 180±10 1.0 AMB1608C2450Z10

AMB1608C3600Z10A

Abstract: AMB1608C2450Z05 AMB1608C3600Z05 AMB1608C2450
Contextual Info: MD-MDJ009-0912 積層チップバラン AMB1608 シリーズ [特長] „ „ „ [用途] 小型低背化 1.6mm x 0.8mm x 0.6mm 低損失化 (0.6dB typ. /C2450series) RoHS 指令対応 „ „ „ 無線 LAN, Bluetooth モジュール WiMAX,WiBro モジュール

Contextual Info: MD-MDE009-0912 Multilayer Chip Balun: AMB1608 Series Device Features „ „ „ Applications Miniature Size and Low Profile 1.6mm x 0.8mm x 0.6mm Low Insertion Loss (0.6dB typ. /C2450series) RoHS Compliant Wireless LAN, Bluetooth module WiMAX , WiBro „ „