maruwa alumina ball
Abstract: grinding mill alumina ball grinding LH 192 maruwa PORCELAIN A-185
Text: MARUWA GENERAL CATALOG ALUMINA BALL MARUWA alumina balls are used at glass, porcelain enamel, abrasives, cement, pigment, and other ceramic factories, as well as paint factories, chemical factories, and weak electric appliance makers, as powder grinding media for pot mills, tube mills,
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Abstract: No abstract text available
Text: Resistors Make Possible Ceramic Ball Grid Termination Arrays Ceramic Ball Grid Ceramic Ball Grid CHC Series Termination Arrays Superior TaNFilm resistors on ceramic substrate Termination Arrays High density networks on a reduced footprint High purity alumina
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Abstract: No abstract text available
Text: Chipscale Thevenin Termination Network IRC Advanced Film Division CHC Thevenin Series High purity alumina substrate • High speed digital termination network • Superior TaNFilm resistors on ceramic substrate • JEDEC standard 8-9A compatible Solder balls
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CC0910L
CC0910L
100ppm/
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Abstract: No abstract text available
Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series • Superior TaNFilm resistors on ceramic substrate High purity alumina substrate • High density networks on a reduced footprint • Excellent high frequency performance Solder balls
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CD0865
100ppm/
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Abstract: No abstract text available
Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series • Standard tolerances to ±1% High purity alumina substrate • Custom array solutions also available • Excellent high frequency performance • Pb-Free options available — consult factory
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CD0910
CD0865
100ppm/
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CD1065B-01-50R0-F
Abstract: 100k7
Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series High purity alumina substrate • Superior TaNFilm resistors on ceramic substrate • High density networks on a reduced footprint • Excellent high frequency performance Solder balls
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CD0865
p100ppm/
15722R0
CD1065B-01-50R0-F
100k7
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Untitled
Abstract: No abstract text available
Text: Ceramic Ball Grid Termination Arrays IRC Advanced Film Division CHC Series • Superior TaNFilm resistors on ceramic substrate High purity alumina substrate • High density networks on a reduced footprint • Excellent high frequency performance • Standard tolerances to ±1%
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CD0910
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thevenin
Abstract: No abstract text available
Text: Chipscale Thevenin Termination Network CHC Thevenin Series • High speed digital termination network • Superior TaNFilm resistors on ceramic substrate • RoHS compliant terminations available • JEDEC standard 9-9A compatible High purity alumina substrate
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thevenin
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Untitled
Abstract: No abstract text available
Text: BR02M560.0A - Rev B - Page 1 of 2 Construction: • High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element Ball Grid Array BGA electrodes RoHS compliant (Sn96.5, Ag3.0, Cu0.5, SAC solder)
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BR02M560
ON/30
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marking code s22
Abstract: roundup OC192 marking s11 duobinary
Text: Product Family: Bessel Absorptive Filter—9th Order Part Number Series: FL9 Series Construction: Features: • • • • • High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7
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Sn63/Pb37)
25Ghz)
marking code s22
roundup
OC192
marking s11
duobinary
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land pattern BGA 0.75
Abstract: AG38 10ghz low pass filter marking code s22 SN63 PB37
Text: Product Family: Bessel Absorptive Filter—7th Order Part Number Series: FL7 Series Construction: Features: • • • • • High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7
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Sn63/Pb37)
land pattern BGA 0.75
AG38
10ghz low pass filter
marking code s22
SN63 PB37
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Alumina ceramic AI203
Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond
Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity
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Abstract: No abstract text available
Text: XO02M610.00 - Rev. C - Page 1 of 2 Construction: • High purity alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat Lead free, RoHS Sn96.5/Ag3.0/Cu0.5 , 12mil diameter, BGA termination (Gnd-Signal-Gnd)
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XO02M610
12mil
20GHz)
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9916h
Abstract: IPC-7095 9916H transistor 9916h123
Text: Product Family: High Efficiency Delay Line - Dual Uncoupled Part Number Series: HE-U Series Construction: Features: • High Purity Alumina or Zirconium Substrate Microstrip Transmission Lines BGA Package
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CT-9916H-123
SOIC16-AC
9916h
IPC-7095
9916H transistor
9916h123
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XOB1208F200S
Abstract: No abstract text available
Text: XO02M610.00 - Rev. A - Page 1 of 2 Product Family: High Frequency Crossover Chip Part Number Series: XOB1208F200S Construction: Features: • High purity alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat
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XO02M610
XOB1208F200S
12mil
20GHz)
XOB1208F200S
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pcb manufacturing
Abstract: XOB1208F100S
Text: XO02M610.01 - Rev. A - Page 1 of 2 Product Family: High Frequency Crossover Chip Part Number Series: XOB1208F100S Construction: Features: • High purity alumina substrate Copper micro-strip transmission line Epoxy-resin overcoat
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XO02M610
XOB1208F100S
12mil
10GHz
pcb manufacturing
XOB1208F100S
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Untitled
Abstract: No abstract text available
Text: FL02M651.00 - Rev J - Page 1 of 3 Product Family: Bessel Absorptive Filter—7th Order Part Number Series: FL7 Series Construction: Features: • High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat
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FL02M651
Sn63/Pb37)
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Untitled
Abstract: No abstract text available
Text: FL02M652-00 - Rev. J - Page 1 of 3 Product Family: Bessel Absorptive Filter—9th Order Part Number Series: FL9 Series Construction: Features: • High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat
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FL02M652-00
Sn63/Pb37)
25Ghz)
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Untitled
Abstract: No abstract text available
Text: HE02M852.00 - Rev F - Page 1 of 2 Construction: • High Purity Alumina or Zirconium Substrate Microstrip Transmission Lines BGA Package Available in RoHS Sn96.5/Ag3.0/Cu0.5 or Non-RoHS (Sn63/Pb37)
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HE02M852
Sn63/Pb37)
CT-9916H-123
SOIC16-AC
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Untitled
Abstract: No abstract text available
Text: FL02M652-00 - Rev. J - Page 1 of 3 Construction: • High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7 or Non-RoHS (Sn63/Pb37)
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FL02M652-00
Sn63/Pb37)
25Ghz)
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Untitled
Abstract: No abstract text available
Text: FL02M651.00 - Rev J - Page 1 of 3 Construction: • High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7 or Non-RoHS (Sn63/Pb37)
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FL02M651
Sn63/Pb37)
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Untitled
Abstract: No abstract text available
Text: BR02M560.0A - Rev B - Page 1 of 2 Product Family: Thin Film SMT Resistor Networks Part Number Series: Miniature BGA Series Construction: Features: • High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element
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BR02M560
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4701 RESISTOR
Abstract: No abstract text available
Text: BR02M560.0A - Rev A - Page 1 of 2 Product Family: Thin Film SMT Resistor Networks Part Number Series: Miniature BGA Series Construction: Features: • High Purity Alumina Oxide Substrate Ni alloy thin-film resistive element
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ON/30
4701 RESISTOR
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FR4 substrate height and thickness
Abstract: FR4 0.8mm thickness FR4 substrate height and thickness 1.2 FR4 height thickness substrate ltcc chip distance ring ltcc fr4 substrate
Text: NETWORKS Hybrid IC MULTI CHIP MODULE • SYSTEM iN PACKAGE MCM CONSTRUCTION SMD SMD Bonding Wire Bonding Wire Solder BallBall Solder Bare Chip Bare Chip Substrate Substrate Several semiconductors in one package offers downsized system with high performance and standardization
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D-25578
FR4 substrate height and thickness
FR4 0.8mm thickness
FR4 substrate height and thickness 1.2
FR4 height thickness substrate
ltcc chip
distance ring
ltcc
fr4 substrate
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