ADV08 Search Results

ADV0812

Abstract: ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F
Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0812 ADDITIONAL PACKAGE OPTION FOR SELECTED STRATIX III FPGA DEVICES Description Altera will be introducing the Fine-Line BGA F1152 non-OPD on package decoupling 8-layer substrate design as an additional package option. The Stratix® III FBGA F1152 package is

ADV0804

Abstract: marking A3 Taiwan semiconductor ALTERA PART MARKING EP3SE50 EP3SL110 MARKed A7 marking a7 altera marking JESD46-C 1/USB/EP3SE110
Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0804 TSMC WAFER FABRICATION SITES FOR THE STRATIX III FPGA FAMILY Description Altera will begin shipping Stratix III FPGAs out of two Taiwan Semiconductor Manufacturing Company TSMC wafer fabrication sites: FAB 12, located in Hsinchu, Taiwan, and FAB 14,

jesd48b

Abstract: ADV0813
Contextual Info: Revision: 1.0.0 CUSTOMER ADVISORY ADV0813 PRODUCT DISCONTINUANCE NOTICE PDN POLICY Description Altera’s product discontinuance policy will be aligned with the JEDEC standard JESD48B. Specifically, customers will have a period of 6 months from the issuance date of a PDN to place a

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

Contextual Info: I poüJUjpe/£¿50^cluJO/euuoL|/ e ¿ 6 0 ^ uio 85 =£ 2 ; 60 6 6-d d V -90 1 9GNÍirZ2 A3tí S09t7 dWV V L dO-in L A3d 133 H 5 l °t7 33 V 0S 8 9NIMVdQ L ' ON 9 N ] H V a a 01 0 3 1 0 IdlSBd 6¿¿00 L V OdVOOdOd 3ZI5 N 313Vld333d 03ds l on a oa d 3 NV N V