ABLESTIK 8361 Search Results

ABLESTIK 8361 Result Highlights (5)

Part	Manufacturer	Description
10091836-10J-20DLF	Amphenol Communications Solutions	XCede® High Speed Backplane Connectors, 4 wall header.
68683-619LF	Amphenol Communications Solutions	Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Through Mount, Top Entry, Double Row, 38Position ,2.54mm (0.100in) Pitch..
54121-408361750LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
54121-808361300LF	Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
10130787-083618BLF	Amphenol Communications Solutions	HPCE STD VT Receptacle 44P18S

ABLESTIK 8361 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
8361J Abstract: mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700 Text: February 24, 2005 CN 022405 Customer Notification Assembly Subcontractor Change for QFP and PLCC Packaged Devices Dear Valued Customer: This notification is for the purpose of informing you of a change by Mindspeed Technologies in the packages used for the following devices:	Original	PDF	CX28392-25 CX28394-25 CX28342-11 CX28343-11 CX28344-11 R6786-24 28XXX-PCN-002-A 8361J mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
8361H Abstract: EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344 Text: Cypress Semiconductor Reflow Qualification Report QTP# 99344 VERSION 2.0 November, 2000 235°°C Solder Reflow Profile TSOP Package Family All assembly sites for these packages CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director	Original	PDF	ZS444N 44-lead 619919886Q CY7C199-ZC 30C/60 CY7C1021-ZSC CY62128-ZC 8361H EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344
tanaka wire Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-05 Product Affected: All Platic packages Product Mark Back Mark Manufacturing Location Affected: ALL	Original	PDF	G9911-05 KMC184 KMC184VA EME-6730 EME-9730 Mil-Std-883, tanaka wire MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 tanaka wire 10 mils
EME 7320 Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress Text: Cypress Semiconductor Mold Compound Qualification Report QTP# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director	Original	PDF	160-lead CY7C375I-AC EME 7320 Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
ablestik 8390 Abstract: SUMItomo EME-G700 JESD22-B107C EME-G700 SUMITOMO EME G700 IDT72V3672L15PQFI EME-G700 datasheet KMC-184 SUMITOMO G700 Sumitomo EME-G700 material Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0506-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 8/15/2005 PQFP packages (see attachment for affected part #s).	Original	PDF	PL15PQF IDT723672L12PQF IDT723672L15PQF IDT72V3611L12PQF IDT72V3611L15PQF IDT72V3611L20PQF IDT72V3612L12PQF IDT72V3612L15PQF IDT72V3612L20PQF IDT72V3613L12PQF ablestik 8390 SUMItomo EME-G700 JESD22-B107C EME-G700 SUMITOMO EME G700 IDT72V3672L15PQFI EME-G700 datasheet KMC-184 SUMITOMO G700 Sumitomo EME-G700 material
HCA8001AIB Abstract: hca8001 HCA8001IB ca3080e HIP51222 CDP65C51AE2 HAA9P-51635R2869 hip51222db CDP68HC68R2E HIP6008CB Text: PRODUCT CHANGE NOTICE Refer to: PCN00067 Date: 8/25//00 Intersil’s Agreement with ChipPAC Notice of Qualification of ChipPAC Sites for Commercial SOIC, PLCC and PDIP Products I N T E R S I L C O R P O R A T I O N Ã ÃÃ\| Post Office Box 883 \| Melbourne, FL USA 32902-0883 \| Telephone 407-724-7000 \| www.intersil.com	Original	PDF	PCN00067 PCN00061) HC55185ECM96R4854 HC55185ECMR4854 HC55185FCM HC55185FCM96 HC55185X HC5523IM HC5523IMR4706 HC5523IMR4722 HCA8001AIB hca8001 HCA8001IB ca3080e HIP51222 CDP65C51AE2 HAA9P-51635R2869 hip51222db CDP68HC68R2E HIP6008CB
IDT82V1671AJ Abstract: EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 IDT7025S35JI ablestik 8390 CRM1076 JESD22-B100-b Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0601-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 21-Mar-2006 MEANS OF DISTINGUISHING CHANGED DEVICES:	Original	PDF	21-Mar-2006 19-Jun-2006 IDTCV169NLG IDTCV170PAG IDTCV171NLG IDTCV174PAG IDTCV175PAG IDTNW1506AL IDTQS3VH16210PA IDTQS3VH16210PAG IDT82V1671AJ EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 IDT7025S35JI ablestik 8390 CRM1076 JESD22-B100-b
sumitomo eme 1100 Abstract: EME-6300 CY7C63231A 99273 MIL-STD-883 Method 3015.7 CY7C63221A EME6300 CY7C63231A-PC Text: Cypress Semiconductor Product Qualification Report QTP# 002104 VERSION 1.0 January, 2001 EnCoRe  USB P26TLM Technology, Fab 2-CTI CY7C63221A/ CY7C63231A Low Speed USB Peripheral Controller EnCoRe  is trademark of Cypress Semiconductor CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:	Original	PDF	P26TLM CY7C63221A/ CY7C63231A CY7C63221A/ 7C6399AT 85C/85 sumitomo eme 1100 EME-6300 CY7C63231A 99273 MIL-STD-883 Method 3015.7 CY7C63221A EME6300 CY7C63231A-PC
CY62128-SC Abstract: mp8000ch4 mp8000ch4-a2 Nitto* mp8000ch4 8361H CY62148 JESD22 Text: Cypress Semiconductor Package Qualification Report QTP# 002605 VERSION 1.0 December, 2000 32.45-lead Plastic Small Outline Package SOIC Level 3 Cypress Philippines (CSPI-R) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director	Original	PDF	45-lead CY62148 CY62128-SC 619922743M CY62128-SC mp8000ch4 mp8000ch4-a2 Nitto* mp8000ch4 8361H CY62148 JESD22
401745 Abstract: cel 9200 CY7C1019BV33 CY7C1021BV33 8361H 84 FBGA thermal Text: Cypress Semiconductor Product Qualification Report QTP# 000505 VERSION 2.0 November, 2000 1 Meg Fast Asynchronous SRAM R52FD-3 Technology, Fab 4 CY7C1021BV33 CY7C1019BV33 64K x 16 Static RAM 128K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:	Original	PDF	R52FD-3 CY7C1021BV33 CY7C1019BV33 CY7C1021BV33, N5V18-BAI CY62145V18-BAI 401745 cel 9200 CY7C1019BV33 CY7C1021BV33 8361H 84 FBGA thermal
CEL9200 Abstract: 8361H A100R CY7C1329 JESD22 Text: Cypress Semiconductor Technology Qualification Report QTP# 99311 VERSION 2.0 December, 2000 R52D-3Technology, Fab 4 Qualification CY7C1329 64K x 32 Synchronous-Pipelined Cache RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director	Original	PDF	R52D-3Technology, CY7C1329 R52D-3 CY7C1329-2Meg Pipeline00 CY7C1329-AC 30C/60 CEL9200 8361H A100R CY7C1329 JESD22
ics633m Abstract: ICS9112BM-17 EME-G700 EME-G600 ICS9155C-02CW20 ICS9170-01CS08 ics5342-3 EMEG700 qmi519 ICS405M Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0607-06 DATE: 29-Sep-2006 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: PLCC, SOIC 150 mil/300 mil (Standard Package)	Original	PDF	29-Sep-2006 mil/300 29-Dec-2006 CHANGK3727S MPC962305D-1H MK2059-01SI MK3732-10S MPC962308D-1 MK2302S-01 MK3732-17S ics633m ICS9112BM-17 EME-G700 EME-G600 ICS9155C-02CW20 ICS9170-01CS08 ics5342-3 EMEG700 qmi519 ICS405M
CY7C1350B Abstract: CY7C1329 CY7C1351B CY7C1352B CY7C1353B Text: Cypress Semiconductor Product Qualification Report QTP# 99245 VERSION 3.0 December, 2000 4 Meg Synchronous SRAM R52D-3 Technology, Fab 4 CY7C1350B 128K x 36 Pipeline SRAM with NoBL Architecture CY7C1351B 128K x 36 Flow Through SRAM with NoBL™ Architecture	Original	PDF	R52D-3 CY7C1350B CY7C1351B CY7C1352B CY7C1353B CY7C1329-AC 30C/60 CY7C1350B CY7C1329 CY7C1351B CY7C1352B CY7C1353B
99503 Abstract: 8361H CY7C1339B CY7C1325B CY7C1327B CY7C1329 CY7C1338B CY7C1345B CY7C1347B 619911-1 Text: Cypress Semiconductor Product Qualification Report QTP# 99503VERSION 2.0 October, 2000 4 Meg Synchronous Cache RAM R52D-3 Technology at Fab 4 CY7C1325B 256K x 18 Synchronous Flow-Through Cache RAM CY7C1327B 256K x 18 Synchronous Pipelined Cache RAM CY7C1345B	Original	PDF	99503VERSION R52D-3 CY7C1325B CY7C1327B CY7C1345B CY7C1347B CY7C1338B CY7C1339B CY7C1329-AC 99503 8361H CY7C1339B CY7C1325B CY7C1327B CY7C1329 CY7C1338B CY7C1345B CY7C1347B 619911-1

000301 Abstract: 8361H CY7C1019B CY7C1021B CY7C1049B R52D Text: Cypress Semiconductor Product Qualification Report QTP# 000504 VERSION 1.0 January 2001 1 Meg Fast Asynchronous RAM R52D-5R Technology, Fab 4 CY7C1021B 64K x 16 Static RAM CY7C1019B 128K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell	Original	PDF	R52D-5R CY7C1021B CY7C1019B CY7C1049B CY7C1049B-VC 7C1549C) 000301 8361H CY7C1019B CY7C1021B R52D
sumitomo 6600 Abstract: on semiconductor traceability marking soic dALLAS MARKING CODE ablestik ablebond On semiconductor SOIC Traceability DS12885 DS1585 ablebond ablestik dallas date code DALLAS SOIC PRODUCT CHANGE Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: February 6, 1998 Subject: PRODUCT CHANGE NOTICE - A82301 Description: DS12885, 24L SOIC and DS1585, 28L SOIC assembly material change Hyundai-Korea	Original	PDF	A82301 DS12885, DS1585, DS12885 DS1585 8361J DS1585 9814A2" sumitomo 6600 on semiconductor traceability marking soic dALLAS MARKING CODE ablestik ablebond On semiconductor SOIC Traceability ablebond ablestik dallas date code DALLAS SOIC PRODUCT CHANGE
CY7C1048-SC Abstract: 140C 8361H CEL9200 JESD22 cel-9200 Text: Cypress Semiconductor Qualification Report QTP# 97184 VERSION 1.0 August, 1997 32 Ld, 450-mil SOIC Package ASE - Taiwan Assembly Cypress Semiconductor Assembly: ASE, Taiwan Package: 32Ld, 450-mil SOIC QTP# 97184, V. 1.0 Page 2 of 4 August, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION	Original	PDF	450-mil CEL9200 8361H JESD22-A112 30C/60 CY7C1048-SC CY7C1048-SC 140C 8361H CEL9200 JESD22 cel-9200
140C Abstract: 8361H CEL9200 JESD22 copper bond wire Text: Cypress Semiconductor Qualification Report QTP# 97173 VERSION 2.0 February, 1998 28 Ld TSOP Package 150 x 150 Pad Size Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97173, V. 2.0 Page 2 of 4 February, 1998	Original	PDF	CEL9200 8361H JESD22-A112 85C/85 CY7C199-ZC 140C 8361H CEL9200 JESD22 copper bond wire
hitachi mold cel Abstract: 9200 hitachi CEL9200 cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H Text: Cypress Semiconductor Qualification Report QTP# 97383 VERSION 1.0 January, 1998 32 Ld SOJ Package - Hitachi CEL9200 Mold Compound Omedata, Indonesia Assembly Cypress Semiconductor Assembly: Omedata, Indonesia Package: 32 Ld SOJ - Hitachi CEL 9200 Mold Compound	Original	PDF	CEL9200 CEL9200 8361H CY7C109-VC 85C/85 CY7C107-VC hitachi mold cel 9200 hitachi cel hitachi cel-9200 cel 9200 Hitachi CEL 9200 140C 8361H
EME-7351 Abstract: Ablestik 8361 140C JESD22 JESD22-A112 Text: Cypress Semiconductor Qualification Report QTP# 97098 VERSION 1.0 April, 1997 28 Ld Thin Small Outline Package TSOP Anam, Philippines Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP QTP# 97098, V. 1.0 Page 2 of 4 April, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION	Original	PDF	209mil JESD22-A11 85C/85 CY7C199-ZC EME-7351 Ablestik 8361 140C JESD22 JESD22-A112
7C43 Abstract: 9748 CY7C42 CY7C42 qualification CY7C1049V33-VC Text: Cypress Semiconductor Product Qualification Report QTP# 97483 VERSION 2.0 November, 2000 Low Voltage Deep Synchronous FIFO High Speed 100-MHZ Operation R42D – Fab 4 CY7C4255V/CY7C4265V/CY7C4275V/CY7C4285V 8K/16K/32K/64K x 18 CY7C4261V/CY7C4271V/CY7C4281V/CY7C4291V	Original	PDF	100-MHZ CY7C4255V/CY7C4265V/CY7C4275V/CY7C4285V 8K/16K/32K/64K CY7C4261V/CY7C4271V/CY7C4281V/CY7C4291V 16K/32K/64K/128K CY7C4282V/CY7C4292V 64K/128K CY7C42 CY7C1021V33-VC 7C43 9748 CY7C42 qualification CY7C1049V33-VC
140C Abstract: 8361H JESD22 Text: Cypress Semiconductor Qualification Report QTP# 97513, Version 1.0 March, 1998 48/56 Ld SSOP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 48/56 Ld SSOP QTP# 97531, V. 1.0 2 of 4 March, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION	Original	PDF	6300HR 8361H JESD22-A112 CY2273APVC 140C 8361H JESD22
128H Abstract: 140C 8361H CEL9200 JESD22 Text: Cypress Semiconductor Qualification Report QTP# 97227 VERSION 1.0 June, 1997 100 Pins TQFP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TQFP QTP# 97227, V. 1.0 Page 2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION	Original	PDF	CEL9200 8361H JESD22-A112 CY7C1335-AC 128H 140C 8361H CEL9200 JESD22
hyundai Abstract: 9734 CEL9200 8361H 37159 140C JESD22 Text: Cypress Semiconductor Qualification Report QTP# 97348 VERSION 1.0 January, 1998 32 Ld TSOP Package Hyundai, Korea Assembly Cypress Semiconducto Assembly: Hyundai, Korea Package: 32 Ld TSOP QTP# 97348, V. 1.0 Page 2 of 4 January, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION	Original	PDF	CEL9200 8361H JESD22-A112 30C/60 CY7C109-ZC hyundai 9734 CEL9200 8361H 37159 140C JESD22

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ABLESTIK 8361 Search Results

ABLESTIK 8361 Result Highlights (5)

ABLESTIK 8361 Datasheets Context Search

8361J

8361H

tanaka wire

EME 7320

ablestik 8390

HCA8001AIB

IDT82V1671AJ

sumitomo eme 1100

CY62128-SC

401745

CEL9200

ics633m

CY7C1350B

99503

000301

sumitomo 6600

CY7C1048-SC

140C

hitachi mold cel

EME-7351

7C43

140C

128H

hyundai