mark a7 sot23
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1815, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1815,
JESD78,
mark a7 sot23
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PDF
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Ablebond 84-1 LMISR4
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1812, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1812,
JESD78,
Ablebond 84-1 LMISR4
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PDF
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1813, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1813,
JESD78,
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PDF
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Tsi148-133IL
Abstract: G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1001-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: Apr 2, 2010 TSI148-133CL TSI148-133IL
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A1001-01
TSI148-133CL
TSI148-133IL
Tsi148-133IL
G770* sumitomo
ablebond 2100A
TSI148-133CL
2100a epoxy
G770J
A1001-01
8355F
A1001
seal sumitomo
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PDF
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mark a7 sot23
Abstract: J-STD-20A atec 6710S CDA194 mp8000
Text: 08/23/2004 RELIABILITY REPORT FOR DS1816, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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Original
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DS1816,
JESD78,
mark a7 sot23
J-STD-20A
atec
6710S
CDA194
mp8000
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PDF
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CDA194
Abstract: mark a7 sot23
Text: 08/23/2004 RELIABILITY REPORT FOR DS1810, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1810,
JESD78,
CDA194
mark a7 sot23
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PDF
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LMISR4
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1811, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1811,
JESD78,
LMISR4
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PDF
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CDA194
Abstract: mark a7 sot23 mold compound
Text: 08/23/2004 RELIABILITY REPORT FOR DS1817, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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Original
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DS1817,
JESD78,
CDA194
mark a7 sot23
mold compound
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PDF
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1818,
JESD78,
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PDF
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Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077,
JESD78,
Sumitomo G700K
sumitomo 6600h
Compound c7025
JESD22-B101
Nitto MP8000
G700K
SUMITOMO-G600
epoxy 8290
ablebond ablestik 8290
SUMITOMO g600 UL
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PDF
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ABLEBOND
Abstract: No abstract text available
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086L,
JESD78,
ABLEBOND
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PDF
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G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077L,
JESD78,
G700K
Nitto MP8000
Sumitomo G600
Sumitomo G700K
JESD78
sumitomo 6600h
Compound c7025
JESD-78
BCB4026
|
PDF
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EME-G700A
Abstract: No abstract text available
Text: LOGIC Devices Green Initiative ROHS Policy LOGIC Devices Incorporated – Green Initiative – Rev. C 4/01/13 1 Table of Contents LOGIC Devices’ Green Initiative . 3
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Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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Original
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DS1086,
JESD78,
Nitto MP8000
Sumitomo G700K
g700k
JESD78
JESD-78
sumitomo 6600h
ablebond ablestik
BCB4026
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PDF
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LMISR4
Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Text: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com
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DS1685,
LMISR4
J-STD20A
J-STD-20A
ablebond
copper bond wire
copper bond wire amkor
ti 9841
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PDF
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS80C310,
JESD78,
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PDF
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sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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PDF
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ablebond 84-3J
Abstract: Ablebond 84-3j ricoh marking smd transistor 3j ABLEBOND 84-3 SMD-49 pc1a FM803TS3X ILC5061M31X
Text: Date Created: 1/23/2004 Date Issued: 2/25/2004 PCN # 20040407 FORECAST CHANGE NOTIFICATION This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence. This is a preliminary notification. A final PCN will
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epax02
604-6437211EXT659
fairchC5062IC31X
ILC5062IC46X
ILC5062M25X
ILC5062M28X
ILC5062M31X
ILC5062M46X
ILC5061IC27X
ILC5061IC31X
ablebond 84-3J
Ablebond
84-3j
ricoh marking
smd transistor 3j
ABLEBOND 84-3
SMD-49
pc1a
FM803TS3X
ILC5061M31X
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PDF
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Ablebond 8380
Abstract: Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001
Text: Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in developing a process using epoxy as the attachment material for assembly is the exposure to temperatures and subsequent cooling during epoxy curing or the ability of the epoxy to withstand temperature cycling.
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APN3001
6/99A
Ablebond 8380
Ablestik 8380
Die Attach epoxy stamping
FR4 substrate height and thickness
FR4 substrate epoxy
FR4 substrate height and thickness 1.2
Ablebond
APN3001
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PDF
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CDA194
Abstract: 9731
Text: 02/25/2003 RELIABILITY REPORT FOR DS2404 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS2404
MIL-STD-883-2009
J-STD-020
CDA194
9731
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PDF
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C18045
Abstract: CDA151 9918 9936
Text: 05/31/2005 RELIABILITY REPORT FOR DS80C390, Rev C3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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Original
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DS80C390,
Reliab918
30C/60%
C18045
CDA151
9918
9936
|
PDF
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ultrasonic amplifier circuit diagram
Abstract: Ablebond LMA116 162mm
Text: 2-10GHz MESFET Amplifier Filtronic LMA116 Solid State Features • • • • • • • • • • 4.5dB Typical Noise Figure 15dB Typical Gain 18dBm Saturated Output Power 12dB Input/Output Return Loss Typical 2-10GHz Frequency Bandwidth +8 Volts Single Bias Supply
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2-10GHz
LMA116
18dBm
62mmX1
LMA116
10GHz.
ultrasonic amplifier circuit diagram
Ablebond
162mm
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PDF
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AMS-5511
Abstract: ams 5642 AMS-QQ-N-290 C173
Text: P/N APPLICABLE NOTE S BASIC SF CC CCSF CCCESF 1.2 1.2 1,2 1,2 1,2 M IE BY (2X 0 .102) EPOXY CAPTIVATION (.500 SQ) (.460) 5642 NOTES(S): SMA FEMALE INTERFACE PER M IL-STD-348 1. MATERIAL(S): 1.1 BODY: 304 SST PER A M S -5 5 1 1 1.2 CENTER CONDUCTOR: BeCu ALLOY C173 PER ASTM B -196.
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OCR Scan
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MIL-STD-348
AMS-5511
B-196.
D-1710.
B-488
AMS-QQ-N-290.
AMS-5511
ams 5642
AMS-QQ-N-290
C173
|
PDF
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Untitled
Abstract: No abstract text available
Text: APPLICABLE NOTE S P/N BASIC SF 1.2 CC 1,2 C CSF 1,2 1.2 M1E BY 1.2 CCCESF (2X 0 .102) EPOXY CAPTIVATION (.500 SQ) (.460) 5642 . , NOTES(S): SMA FEMALE INTERFACE PER M IL -S T D -3 4 8 1. MATERIAL(S): 1.1 BODY: 3 0 4 SST PER A M S - 5 5 1 1 1.2 CENTER CONDUCTOR: BeCu ALLOY C 17 3 PER ASTM B - 1 9 6 .
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OCR Scan
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PDF
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