Ablecube
Abstract: ATM-0018 Ablestik ATM-0087 ablebond ablebond technical 8200C ATM-0089 ablebond ablestik ablestik ablebond
Text: PILOT TECHNICAL DATASHEET ABLEBOND 8200C ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC
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8200C
8200C
RP-751
Ablecube
ATM-0018
Ablestik
ATM-0087
ablebond
ablebond technical
ATM-0089
ablebond ablestik
ablestik ablebond
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Ablebond
Abstract: Ablecube ablebond 2815a 2815A ablestik ablebond 2815a ATM-0018 ablebond ablestik ablebond technical Ablestik Ablestik 2815
Text: DEVELOPMENTAL TECHNICAL DATASHEET ABLEBOND 2815A THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.
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Sumitomo EME-G600 material
Abstract: Ablestik 8290 Ablecube EME-G600 thermal conductivity ablebond 8290 ablestik 8390 Ablebond 84-1*SR4 EME-G600 Ablebond 8390 Ablebond 84-1LMISR4
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0401-01 DATE: 1/20/2004 Product Affected: SOIC package family (see attachment for affected part #s). Date Effective: 4/20/2004 Contact: Geoffrey Cortes
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Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077,
JESD78,
Sumitomo G700K
sumitomo 6600h
Compound c7025
JESD22-B101
Nitto MP8000
G700K
SUMITOMO-G600
epoxy 8290
ablebond ablestik 8290
SUMITOMO g600 UL
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ABLEBOND
Abstract: No abstract text available
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086L,
JESD78,
ABLEBOND
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G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077L,
JESD78,
G700K
Nitto MP8000
Sumitomo G600
Sumitomo G700K
JESD78
sumitomo 6600h
Compound c7025
JESD-78
BCB4026
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Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086,
JESD78,
Nitto MP8000
Sumitomo G700K
g700k
JESD78
JESD-78
sumitomo 6600h
ablebond ablestik
BCB4026
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Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1094L,
JESD78,
Sumitomo G700K
SUMITOMO g600
Ablestik 84-1
sumitomo 6600h
G700K
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JEDEC JESD22-B116 free
Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see attachment for affected part #s). Date Effective: 3/20/2003 Contact: George Snell
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SR-0212-02
EME-G700
JEDEC JESD22-B116 free
SUMIKON EME-G700
EME-G700
ablebond 3230
SUMItomo EME-G700
Sumitomo EME-G700 material
Ablebond 84-1*SR4
Ablebond 8390
sumitomo G700 Tg
ablebond 8390 cure time
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AUS308
Abstract: PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal
Text: March 21, 2007 CN 032107 Customer Notification CX2751x-12 Material Set Change Dear Valued Customer: This notification is for the CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. Mindspeed’s turnkey supplier has sent notification that all their BGA products will be manufactured using
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CX2751x-12
CX27511-11,
CX27512-12,
CX27513-12,
CX27514-12,
CX27512G-14.
CX2751x-12,
CX2751xG-12,
2751x-PCN-001-A
AUS308
PSR4000 AUS308
HL832NX
TAIYO PSR 4000
AUS308 dielectric
TAIYO PSR 4000 AUS308 Thermal Conductivity
PSR-4000
AUS-308
PSR4000
AUS308 thermal
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Ablebond 8380
Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
Text: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is
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ANSI/J-STD-001,
Ablebond 8380
X3304
ablestik ablebond
Ablestik 8380
A5700
shoulder angle foot length lead solder joint reliability
smema control
IPC-SM-780
tms 3615
A5716
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Ablebond 8380
Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These
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Ablebond 8380
Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that
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CH12WIP
Ablebond 8380
smema
DA6523
nozzle heater
X3304
Theta-JC
5th mechnical engineering date sheet
alpha Resistors slide
cut template DRAWING
Die Attach epoxy stamping
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ablebond 8380
Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized
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IPC-SM-782A
J-STD-001
ablebond 8380
land pattern PQFP 132
smema
Ablestik 8380
ablestik ablebond
shoulder angle foot length lead solder joint reliability
nozzle heater
gold embrittlement
Ablebond
cut template DRAWING
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Ablebond 8380
Abstract: Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001
Text: Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in developing a process using epoxy as the attachment material for assembly is the exposure to temperatures and subsequent cooling during epoxy curing or the ability of the epoxy to withstand temperature cycling.
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APN3001
6/99A
Ablebond 8380
Ablestik 8380
Die Attach epoxy stamping
FR4 substrate height and thickness
FR4 substrate epoxy
FR4 substrate height and thickness 1.2
Ablebond
APN3001
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Die Attach epoxy stamping
Abstract: Ablebond 8380 APN3001
Text: APPLICATION NOTE APN3001: Epoxy Die Attachment for GaAs Flip Chip Devices This application note describes the recommended method for die attachment of GaAs flip chip devices. A major concern in developing a process using epoxy as the attachment material for
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APN3001:
Die Attach epoxy stamping
Ablebond 8380
APN3001
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ph44
Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 Product Affected: All Plastic packages Product Mark Back Mark
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G9911-04
Mil-Std-883,
S-7390)
S-7383
ph44
Tanaka GL2
tanaka wire
Ablebond 8340
tanaka au wire
tanaka epoxy
Compound c7025
Ablebond
tanaka
C7025
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ablebond 84-3J
Abstract: SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151
Text: MIL-STD-1553 Bus Transceivers Plastic SOIC Package Transfer Product Change Notice PCN1201 v1.0 January 20, 2012 Overview The purpose of this notification is to describe the changes to the 20 Pin Plastic Small Outline ESOIC-WB packages for the MIL-STD-1553 family of devices.
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MIL-STD-1553
PCN1201
20L-SOIC
ablebond 84-3J
SUMITOMO g600f
CRM-1151
ablebond 8006ns
sumitomo EME G600
sumitomo crm
ablebond ablestik 8006ns
84-3j
hi-1579psm
SUMITOMO CRM-1151
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power one pmp 5.24
Abstract: RF Nitro Communications RF TRANSISTOR 10GHZ 84-1LMI NKD-100-D Ablebond 84-1LMI RF TRANSISTOR 10-12 GHZ
Text: Millimeter-Wave Frequency Doubler MMIC NKD-100-D 5-24 GHz 6000056 Rev. A 1 Features Applications • • • • • • • • Reliable Low-Cost GaInP/GaAs HBT Design Low Conversion Loss, 10dB at 24GHz Low Current Consumption, Icc=25mA Broadband Performance 5-12GHz input frequency
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NKD-100-D
24GHz
5-12GHz
NKD-100-D
84-1LMI
10420-F
power one pmp 5.24
RF Nitro Communications
RF TRANSISTOR 10GHZ
Ablebond 84-1LMI
RF TRANSISTOR 10-12 GHZ
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Untitled
Abstract: No abstract text available
Text: NKD-100-D MILLIMETER-WAVE FREQUENCY DOUBLER MMIC 5GHz TO 24GHz Typical Applications • Narrow and Broadband Commercial and • Upconversion Stage used in MW Radio/Optical Designs Military Radio Designs • Linear and Saturated Radio Applications Product Description
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NKD-100-D
NKD-100-D
24GHz.
84-1LMI
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84-1LMI
Abstract: No abstract text available
Text: NKD-100-D 4 MILLIMETER-WAVE FREQUENCY DOUBLER MMIC 5GHz TO 24GHz Typical Applications • Narrow and Broadband Commercial and • Upconversion Stage used in MW Radio/ Optical Designs Military Radio Designs • Linear and Saturated Radio Applications GENERAL PURPOSE
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NKD-100-D
24GHz
NKD-100-D
24GHz.
84-1LMI
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AlGaN/GaN HEMTs
Abstract: ablestik ablebond 84-1LMI NGN-125-D 10420-F
Text: High Power AlGaN/GaN HEMTs on Sapphire NGN-125-D DC-8 GHz 6000060 Rev. 1 2 Features Applications • • • • • • • • • • • High Microwave Power Output Large RF Voltage Swing, ~25 volts High Breakdown Voltages, ~ 100 volts State-of-the-Art Wide Bandgap Technology
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NGN-125-D
84-1LMI
10420-F
AlGaN/GaN HEMTs
ablestik ablebond
NGN-125-D
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ablebond epoxy
Abstract: NKD-100-D 84-1LMI
Text: NKD-100-D 0,//,0 7(5:$9( 5(48(1&< '28%/(5 00,& *+] 72 *+] 7\SLFDO $SSOLFDWLRQV • Narrow and Broadband Commercial and Military Radio Designs • Upconversion Stage used in MW Radio/ Optical Designs • Linear and Saturated Radio Applications GENERAL PURPOSE
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NKD-100-D
NKD-100-D
24GHz.
84-1LMI
ablebond epoxy
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Untitled
Abstract: No abstract text available
Text: E l Stanford Microdevices Product Description SNA-200 Stanford Microdevices' SNA-200 is a GaAs monolithic broadband amplifier MMIC in die form. This amplifier provides !6dB of gain when biased at 50mA and 4V. DC-6.5 GHz, Cascadable GaAs MMIC Amplifier External DC decoupling capacitors determine low frequency
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SNA-200
SNA-276,
SNA-200
84-1LMIT1
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