AAVID THERMAL TECHNOLOGIES Search Results

Contextual Info: — — HOW TO SELECT A HEAT SINK Seri Lee, Director Advanced Thermal Engineering Aavid Thermal Technologies, Inc. Laconia, New Hampshire 03247 Tel: 603 527-2339 Fmc (603) 528-1478 e-mail: lee@aavid. com With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors,

Contextual Info: Comparative Analysis of Various Heatsink Technologies in Forced Ventilation AAVID THERMALLOY in cooperation with Applied Thermal Technologies - India www.aavidthermalloy.com www.appliedthermal.co.in 03 April 2003 with APPLIED Thermal Technologies - INDIA 1

INTEL 82306

Abstract: 65630 tic 2360 ES 61420 EN 61210 intel 80468 62660 60490 I1335 60550 AAVID
Contextual Info: AAV ID TM AAVID ENGINEERING, INC. C T R B 'x ,J; / Ü 7 ' Aluminum Heat Sink Extrusion Profiles Thermal Management Solutions m DIMENSIONAL TOLERANCES FOR ALUMINUM EXTRUSIONS TYPICAL PROPERTIES OF 6063-T5 ALUMINUM EXTRUSION ALLOY Aavid Engineering’s aluminum extrusions comply with

heat sink design guide, IGBT

Abstract: loop heat pipes Aavid Thermalloy Aavid Thermalloy cold plate Aavid cold plate heat exchanger heat pipes igbt clip rail air fin fan exchangers Heat exchanger air to air
Contextual Info: Thermal Management Solutions for Cooling Electronics WWW.AAVIDTHERMALLOY.COM Our Mission Aavid Thermalloy will lead the electronics thermal management industry worldwide. We will be the company our customers partner with to solve their most demanding thermal challenges. Our business processes are designed for

AAVID THERMALLOY COMPOUND 250

Contextual Info: THERMAL PERFORMANCE OF INTERFACE MATERIAL IN MICROELECTRONICS PACKAGING APPLICATIONS By l Malcolm Early , Seri Lee, and Mark Pellilo Aavid Thermal Technologies, Inc. Laconia, New Hampshire 03247 As the need to dissipate heat from microelectronics packaging increases, the role of

electronic passive components catalog

Abstract: heat sink design guide, IGBT polar cap Aavid Thermalloy cold plate loop heat pipes laptop fan Aavid Thermalloy TUBE MTBF IGBT
Contextual Info: Thermal Management Solutions for Cooling Electronics WWW.AAVIDTHERMALLOY.COM Our Mission Aavid Thermalloy will lead the electronics thermal management industry worldwide. We will be the company our customers partner with to solve their most demanding thermal challenges. Our business processes are designed for

Peltier Thermo

Contextual Info: Power Thermal Solution Solutions Division Cooling to keep your Key Chips Alive Guy Diemunsch Aavid Thermalloy diemunsch.g@aavid.com Agenda Power Thermal Solution Solutions Division From the Chip to the Fluid The story of conductivity and heat density Technologies and Heat Transfer coefficients

250G AAVID THERMALLOY

Abstract: Thermalcote THE 249 AAVID THERMALLOY 250G 101700F00000G AAVID THERMALLOY 102000F00000G AAVID 101700F00000G 101800F00000G thermalcote 100300F00000G 100500F00000
Contextual Info: Home | Contact Us | About Aavid | Sales Rep Log In Chinese -Useful Links- / Interface Materials Products 6 / Greases Thermal Greases Search by part # » Sil - Free RoHS Compliant silicone - free synthetic thermal grease Check distributor part inventory

Contextual Info: THERMAL PERFORMANCE OF AN ELLIPTICAL PIN FIN HEAT SINK Christopher L. Chapman, and Seri Lee Aavid Engineering, Inc. Laconia, New Hampshire 03247 Bill L. Schmidt Silicon Graphics Computer Systems Mountainview, California 94039 L m Abstract Comparative thermal tests have been carried out using

CLP212s

Abstract: ICS Sensors 1220 FT 147 M 78215 T0218 T0247 T092 ft 103 CLP212T 78315
Contextual Info: THE MAX CLIP SYSTEM ™ THE THE PROPRIETARY PROPRIETARY THERMAL THERMAL MANAGEMENT MANAGEMENT SOLUTION SOLUTION FOR FOR ALL ALL POWER POWER COMPONENTS COMPONENTS AAVID THERMALLOY ONE COOL IDEA AFTER ANOTHER THE MAX CLIP SYSTEM™ FOR POWER TRANSISTORS How do you optimize the thermal management of power transistors while saving labor and costs?

Contextual Info: Home | Contact Us | About Aavid | Sales Rep Log In Chinese -Useful Links- Products Search by part # / Interface Materials / Adhesives Thermal Adhesives Ther - O- Bond 1500 Epoxy casting system for potting and encapsulation Check distributor part inventory

Contextual Info: BLISTER LIQUID COLD PLATES – PRODUCTION TECHNOLOGY; THERMAL PERFORMANCES ANALYSIS AND APPLICATION COMPARISONS Author: Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY ITALY Abstract: The Blister Liquid Cold Plates are an innovative approach to the manufacturing of cost

Contextual Info: BONDING AND BRAZING TECHNOLOGIES FOR POWER ELECTRONIC COOLING – WHEN AND WHY Author: Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY ITALY Abstract: Bonding is a joint obtained with a special designed thermal epoxy resin: performance and characteristic. Brazing is a pure metallic joint obtained at high temperature: performance and characteristic.

tip122 tip127 audio amp schematic

Abstract: mje521 equivalent BJT small signal low power BD139 MJ15003 300 watts amplifier 2N3773 pinout transistor mj11032 equivalent MJ11028 transistor equivalent 2n3055 IC 2N3773 audio amplifier diagram 2n222 TRANSISTOR use as audio amplifier
Contextual Info: DL111/D Rev. 8, July-2001 Bipolar Power Transistor Data Bipolar Power Transistor Data DL111/D Rev. 8, Jul–2001  SCILLC, 2001 Previous Edition  1995 “All Rights Reserved’’ Grafoil is a registered Trademark of Union Carbide. Kon–Dux and Rubber–Duc are trademarks of Aavid Thermal Technologies, Inc.

fin heat sink igbt

Abstract: 027440 416201U 62625 aluminum part polar cap aavid 8911A 62465 Aavid Thermalloy 6063
Contextual Info: HEAT SINK COOLING FOR IGBT MODULES T H E R M A L P R O D U C T S, I N C. Aavid offers several methods for cooling IGBT modules – cold plates, extruded aluminum heat sinks, bonded fin heat sinks, and fan cooled modules. 6-PASS COLD PLATE 6-pass liquid-cooled cold plates offer optimum thermal management for high power IGBT modules.They

retention mechanisms

Abstract: AAVID Thermal Products
Contextual Info: HEAT SINKS FOR INTEL’S CELERON MICROPROCESSOR OPTIMIZED FOR OEM INSTALLATION An array of Low Cost Solutions for the Pentium® II in the Single Edge Processor Package S.E.P.P. ASSEMBLY VIEW FEATURES: • Scalable passive solutions • Optimized for cost performance with

Contextual Info: Cooling to keep your Key Chips Alive Guy Diemunsch Aavid Thermalloy 70 Commercial Street, Suite 200 Concord, NH 03301 USA Abstract: plenty of cooling technologies are available, they can be used to spread the heat, conduct it to or exchange it with the cold source. We

368052B20067

Abstract: 368055B00032 LR92346
Contextual Info: THE 3680 ACTIVE HEAT SINK FOR EMBEDDED PC COOLING T H E R M A L P R O D U C T S, I N C. The 3680 Active Heat Sink is a low profile fan heat sink for power IC’s. FEATURES: • Reliability for Industrial Usage • Low Profile Assembly • Quick Installation to IC

D149

Abstract: IcePak
Contextual Info: THIN-FIN HEAT SINKS T H E R M A L P R O D U C T S, I N C. FOR COMPUTER AND CUSTOM APPLICATIONS LOW PROFILE COPPER HEAT SINKS IDEAL FOR PCI AND AGP CHIP SETS When space is at a premium, Aavid’s Thin-fin heat sinks reduce package case temperature by as much as 20º C. These flexible, copper

T0252

Abstract: D3PAK T0-252 T0-268 440 d-pak thermal PCB D2PAK T0268 Aavid 252 573100D00000 573100D00010
Contextual Info: SURFACE MOUNT HEAT SINKS FOR D-PAK, D2PAK AND D3PAK PACKAGES T H E R M A L P R O D U C T S, I N C. THEORY OF OPERATION: • Surface mountable heat sink Heat from the D-PAK, D2PAK or D3PAK device is removed indirectly through conduction – no direct contact is made to the

Chomerics T710

Abstract: A13494
Contextual Info: COLUSA 860 CHIP SET COOLING SOLUTIONS Part # 23408 Part # 23409 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 860 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available

533002B02551

Abstract: 530614 00 AAVID THERMALLOY COMPOUND 250 577102b04000 63815 MULTIWATT die semiconductors cross index CC 3053 566010B03400 53010-1
Contextual Info: PRODUCT SELECTION GUIDE Condensed AAVID THERMALLOY AAVID THERMALLOY PRODUCT SELECTION GUIDE Condensed This condensed catalog features the more popular devices and configurations that Aavid Thermalloy produces today to cool high speed microprocessors and other commonly used semi

10-6326-27

Abstract: bgs2 10-5607-05 374924B60024 2332B 374924B00035 374224B00032 BGA 441 10-L4LB-03 10-L4LB-05
Contextual Info: PRODUCT SELECTOR GUIDE New Cooling Solutions for Ball Grid Arrays The Industry’s Most Comprehensive Selection of BGA Heat Sinks Aavid Thermalloy offers the broadest line of innovative BGA heat sinks – including standard, off-the-shelf solutions to support all of your most demanding applications. Cost effective

Chomerics T710

Abstract: A13494 a1349
Contextual Info: TEHAMA 850 CHIP SET COOLING SOLUTIONS Part # 23410 Part # 23411 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 850 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available