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intel mch 945gc Abstract: bga dye pry UL1439 945gc PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet Text: Intel Atom Processor 300Δ Series Thermal and Mechanical Design Guidelines — Supporting Nettop Platform for ‘08 September 2008 Document Number: 320530-001 THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED “AS IS” WITH NO WARRANTIES, EXPRESS OR	Original	PDF	E20724-001 E40825-001 945GC E37585-001 intel mch 945gc bga dye pry UL1439 PCM45F atx specification v2.2 BGA heatsink compressive force 437-pin foxconn motherboard 945gc datasheet
intel g31 chipset motherboard Abstract: BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 Text: Intel G35 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82G35 Graphics and Memory Controller Hub GMCH August 2007 Document Number: 317609-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR	Original	PDF	82G35 OTH97; D29081 intel g31 chipset motherboard BB17 foxconn motherboard ls 36 Motherboard Foxconn LS 36 AY21 intel marking STD 164997 AC4 honeywell g31 motherboard g31 Chipset Platform Design Guide AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
foxconn g41 Abstract: g2100c888 Motherboard Foxconn LS 36 BTX 82G41 foxconn motherboard ls 36 Motherboard Foxconn LS 36 TIM-PCM45F intel g41 82Q45 3EE77-002 Text: Intel 4 Series Chipset Thermal and Mechanical Design Guidelines September 2008 Document Number: 319972-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT	Original	PDF	D29081 foxconn g41 g2100c888 Motherboard Foxconn LS 36 BTX 82G41 foxconn motherboard ls 36 Motherboard Foxconn LS 36 TIM-PCM45F intel g41 82Q45 3EE77-002
d9258 Abstract: d92580 Loctite 7452 82X38 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN Text: Intel X38 Express Chipset Thermal and Mechanical Design Guidelines — For the Intel® 82X38 Memory Controller Hub MCH September 2007 Revision -001 Document Number: 317612-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR	Original	PDF	82X38 d9258 d92580 Loctite 7452 AVC cool indium paste TT-T-36 5SRTC-TT-T36-72 FLUKE 79 42SN
honeywell pcm45 Abstract: PCM45 HB9703E-M3W HB9703E-DW A13494008 HB9703EDW A13494-008 BGA heatsink compressive force PCM45F D82348-004 Text: Intel 7500 Chipset Thermal/Mechanical Design Guidelines March 2010 Reference Number: 322825-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS	Original	PDF