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    A020309 Search Results

    A020309 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    TN0610

    Abstract: No abstract text available
    Text: TN0610 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN0610 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TN0610 TN0610 A020309 PDF

    TN2640

    Abstract: No abstract text available
    Text: TN2640 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 70 70 11 ± 1.5 Au 1 (mils) TN2640 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TN2640 TN2640 A020309 PDF

    TP2435

    Abstract: No abstract text available
    Text: TP2435 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TP2435 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TP2435 TP2435 A020309 PDF

    DN2530

    Abstract: No abstract text available
    Text: DN2530 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) DN2530 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		DN2530 DN2530 A020309 PDF

    VN2410

    Abstract: No abstract text available
    Text: VN2410 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) VN2410 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		VN2410 VN2410 A020309 PDF

    TN5335

    Abstract: No abstract text available
    Text: TN5335 Die Specification Pad Layout 1 2 0,0 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 30 56 8.0 ± 1.0 Au 1 (mils) TN5335 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		TN5335 TN5335 A020309 PDF

    TN0606

    Abstract: No abstract text available
    Text: TN0606 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN0606 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TN0606 TN0606 A020309 PDF

    TP2535

    Abstract: No abstract text available
    Text: TP2535 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2535 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TP2535 TP2535 A020309 PDF

    TN2504

    Abstract: No abstract text available
    Text: TN2504 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2504 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TN2504 TN2504 A020309 PDF

    DN3765

    Abstract: No abstract text available
    Text: DN3765 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 95.3 95.3 11 ± 1.5 Au 1 (mils) DN3765 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		DN3765 DN3765 A020309 PDF

    DN2535

    Abstract: No abstract text available
    Text: DN2535 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) DN2535 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		DN2535 DN2535 A020309 PDF

    TN2535

    Abstract: No abstract text available
    Text: TN2535 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2535 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TN2535 TN2535 A020309 PDF

    TP2522

    Abstract: No abstract text available
    Text: TP2522 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2522 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TP2522 TP2522 A020309 PDF

    TN2435

    Abstract: No abstract text available
    Text: TN2435 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) TN2435 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TN2435 TN2435 A020309 PDF

    VN24061

    Abstract: VN2406
    Text: VN2406 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) VN2406 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		VN2406 VN2406 A020309 VN24061 PDF

    TP2635

    Abstract: No abstract text available
    Text: TP2635 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 70 70 11 ± 1.5 Au 1 (mils) TP2635 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TP2635 TP2635 A020309 PDF

    TN2529

    Abstract: No abstract text available
    Text: TN2529 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2529 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TN2529 TN2529 A020309 PDF

    TP2510

    Abstract: No abstract text available
    Text: TP2510 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2510 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TP2510 TP2510 A020309 PDF

    VP3203

    Abstract: No abstract text available
    Text: VP3203 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 55 55 11 ± 1.5 Au 1 (mils) VP3203 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		VP3203 VP3203 A020309 PDF

    TN2524

    Abstract: No abstract text available
    Text: TN2524 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TN2524 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TN2524 TN2524 A020309 PDF

    VN1206

    Abstract: No abstract text available
    Text: VN1206 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) VN1206 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		VN1206 VN1206 A020309 PDF

    VN0550

    Abstract: No abstract text available
    Text: VN0550 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VN0550 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		VN0550 VN0550 A020309 PDF

    VP0106

    Abstract: No abstract text available
    Text: VP0106 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness (mils) Back Side Metal 37 37 11 ± 1.5 Au 1 (mils) VP0106 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain


    Original     		VP0106 VP0106 A020309 PDF

    TP2520

    Abstract: No abstract text available
    Text: TP2520 Die Specification Pad Layout 1 0,0 2 Backside: Drain Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 45 45 11 ± 1.5 Au 1 (mils) TP2520 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si


    Original     		TP2520 TP2520 A020309 PDF