WLCSP25217X232 Search Results

Contextual Info: Package outline WLCSP25: wafer level chip-size package; 25 bumps; 2.17 x 2.32 x 0.56 mm B D WLCSP25217X232 A ball A1 index area A2 A E A1 detail X e1 e C C A B C Øv Øw b E y e D e2 C B A ball A1 index area 1 2 3 4 5 X 2 mm scale Dimensions mm are the original dimensions

LPC1101

Abstract: I2C-INTERFACE data flash ITS 7166 hvqfn 24 mo-220 HVQFN33
Contextual Info: LPC111xLV/LPC11xxLVUK 32-bit ARM Cortex-M0 MCU; up to 32 kB flash, 8 kB SRAM; ADC Rev. 1 — 21 June 2012 Objective data sheet 1. General description The LPC111xLV/LPC11xxLVUK is an ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple

books national semiconductor

Abstract: LPC1101
Contextual Info: LPC111xLV/LPC11xxLVUK 32-bit ARM Cortex-M0 MCU; up to 32 kB flash, 8 kB SRAM; 8-bit ADC Rev. 2 — 10 October 2012 Product data sheet 1. General description The LPC111xLV/LPC11xxLVUK is an ARM Cortex-M0-based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple

Contextual Info: LPC111xLV/LPC11xxLVUK 32-bit ARM Cortex-M0 MCU; up to 32 kB flash, 8 kB SRAM; ADC Rev. 1 — 21 June 2012 Objective data sheet 1. General description The LPC111xLV/LPC11xxLVUK is an ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple