TS0502W3s
Abstract: TS0505W3S TS05XXW3S TS0500W3S TS0514W3 TS0503W3S 755W002 TS0501W3S ts0505 TS0518
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS05W3S-DKIT DESCRIPTION: TS05XXW3S CHIP ATTENUATOR DESIGN KIT. 1 EMC CATALOG 25 PCS TS0500W3S 25 PCS TS0504W3S 25 PCS TS0508W3S 25 PCS TS0514W3S 25 PCS TS0501W3S 25 PCS TS0505W3S 25 PCS TS0509W3S 25 PCS TS0516W3S
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TS05W3S-DKIT
TS05XXW3S
TS0500W3S
TS0504W3S
TS0508W3S
TS0514W3S
TS0501W3S
TS0505W3S
TS0509W3S
TS0516W3S
TS0502W3s
TS0505W3S
TS0500W3S
TS0514W3
TS0503W3S
755W002
TS0501W3S
ts0505
TS0518
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TS0500W3S
Abstract: 10DB DC-18GHZ MIL-R-55342
Text: TITLE: SPECIFICATION CONTROL DRAWING TS0500W3S KIT PART IDENTIFIER: DESCRIPTION: ASSEMBLY DWG: 1.0 CHIP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ
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TS0500W3S
DC-18GHZ
MIL-R-55342.
MIL-STD-202,
MIL-STD-130.
MC0023.
10DB
DC-18GHZ
MIL-R-55342
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TS0500
Abstract: No abstract text available
Text: TS0500 VSWR 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.05 VSWR 1 25C 5.05 10.1 Frequency (GHz) 15.1 18 Attenuation 5 DB(|S(2,1)|) 25C 4 3 2 1 -1 -2 -3 -4 -5 0.05 5.05 10.1 Frequency (GHz) 15.1 18.1 S(1,1) 25C Swp Max 12.4GHz 2. 0. 6 0.8
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TS0500
05GHz
TS0500
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10DB
Abstract: DC-18GHZ MIL-R-55342 TS0500W3
Text: TITLE: PART IDENTIFIER: SPECIFICATION CONTROL DRAWING TS0500W3 KIT DESCRIPTION: CHIP: ASSEMBLY DWG: 1.0 ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ
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TS0500W3
DC-18GHZ
MIL-R-55342.
MIL-STD-202,
MIL-STD-130.
755W002.
09-E0971
10DB
DC-18GHZ
MIL-R-55342
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10DB
Abstract: DC-18GHZ MIL-R-55342
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS0500 KIT DESCRIPTION: CHIP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. ASSEMBLY DWG: N/A 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ
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TS0500
DC-18GHZ
MIL-R-55342.
MIL-STD-202,
MIL-STD-130.
MC0023.
10DB
DC-18GHZ
MIL-R-55342
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10DB
Abstract: DC-18GHZ MIL-R-55342 TS0500G
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS0500G KIT DESCRIPTION: IP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. ASSEMBLY DWG: N/A 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ
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TS0500G
DC-18GHZ
MIL-R-55342.
MIL-STD-202,
MIL-STD-130.
MC0023.
10DB
DC-18GHZ
MIL-R-55342
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10DB
Abstract: DC-18GHZ MIL-R-55342
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: DESCRIPTION: CHIP ATTENUATOR KIT 1 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. ASSEMBLY DWG: 1.0 TS0500WB1 KIT N/A SPECIFICATIONS 1.1 ELECTRICAL 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ
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TS0500WB1
DC-18GHZ
MIL-R-55342.
MIL-STD-202,
MIL-STD-130.
MC0023.
04-E231
10DB
DC-18GHZ
MIL-R-55342
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TS0500W3
Abstract: No abstract text available
Text: TS0500W3 VSWR 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.05 VSWR 1 25C 5.05 Frequency (GHz) 10.05 12.4 Attenuation 5 DB(|S(2,1)|) 25C 4 3 2 1 -1 -2 -3 -4 -5 0.05 5.05 Frequency (GHz) 10.05 12.4 S(1,1) 25C Swp Max 12.4GHz 2. 0. 6 0.8 1.0
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TS0500W3
05GHz
TS0500W3
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ts0505
Abstract: TS0503 TS0506 marking code wb1 TS0510 TS0504
Text: A ttenuators General Specifications Teclutologi/ TS05 M arking Code Part # dB Value TS0500 TS0501 TS0502 TS0503 TS0504 TS0505 TS0506 TS0507 TS0508 TS0509 TS0510 TS0511 TS0512 TS0513 TS0514 TS0515 TS0516 TS0517 TS0518 TS0519 TS0520 0 dB 1 dB 2 dB 3 dB 4 dB
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TS0500
TS0501
TS0502
TS0503
TS0504
TS0505
TS0506
TS0507
TS0508
TS0509
marking code wb1
TS0510
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Ablestik 84-1LMI
Abstract: gold melting furnace 84-1LMI epoxy adhesive
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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4160P
Abstract: 4161p
Text: NEW PRODUCTS HIGH POWER LOADS The performance of many of our standard, high power loads has been significantly improved. The 5307 and 5657 are now specified for operation through 2 GHz with 1.25:1 VSWR. The 5309 is now specified for operation through 4 GHz with 1.35:1 VSWR. The power
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4161P
4162P
4160P.
4181P
4181J
4181P/J
4180P/J
4160P
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ts0505
Abstract: marking code wb1 mw 772 TS05XXW1 TS05XXW3 ts0506 TS0503 TS05 TS0518 TS0509
Text: Attenuators Introduction Features • Substrate - Alumina • Power Rating - 0.1 to 2 Watts • Frequency Range DC to 18 GHz • Tape and Reel Packaging Available • VSWR under 1.50:1 • Variety of Chip Sizes • Attenuation Values from 1 to 20 dB in 1 dB increments; consult the factory
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TS0500
TS0501
TS0502
TS0503
TS0504
TS0505
TS0506
TS0507
TS0508
TS0509
marking code wb1
mw 772
TS05XXW1
TS05XXW3
TS05
TS0518
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Untitled
Abstract: No abstract text available
Text: THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film element on an alumina ceramic substrate with solderable terminals in two sizes. The larger TS03XX Series operates to 12.4 GHz and the
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TS03XX
TS05XX
TS0518
TS0519
TS0520
TS0510
TS0300
TS0500
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tva0300n07
Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,
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d8693
Abstract: RYT Circulators amf-3d-008019.1 miteq amf-3f x-band waveguide isolators ps223 TS0303W3 JSD00114 H-BEND
Text: AST Lagerliste 2010 solange r u n f u a Verk icht! Vorrat re Hohlleiter- und Koaxialbauteile, vom Diplexer bis zu Leistungsverstärker, passive Bauteile wie z.B. Leistungswiderständen oder Dämpfungsglieder, und Kabel bis zu 65 GHz werden mit weit über 50% Preisnachlass angeboten.
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AM-1598-11166
AM-1607-10231
AM-1013-0
D-86932
d8693
RYT Circulators
amf-3d-008019.1
miteq
amf-3f
x-band waveguide isolators
ps223
TS0303W3
JSD00114
H-BEND
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TS0300
Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Text: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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ECF564A
Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Text: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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ina 124
Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Text: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz
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42TVA
R0300
HR0500
TS0300
TS0300W
TS0400
TS0500
TS0500W1
TS0500W
TS0500WB1
ina 124
CT2525ALN
"beryllium oxide"
ct2335
SMT3725ALN
SC0066M
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TS05XXW3
Abstract: TS0500 marking code wb1 TS05XX ts0506 TS0507 EMC TS-050
Text: ATTENUATORS THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film Impedance: 50 Q element on an alumina ceramic substrate with solderable terminals Operating Temperature: -55°C to +150°C
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TS03XX
TS05XX
TS0300
TS0500
TS03XX,
TS03XXW3,
TS05XX,
TS0500WB1
TS05XXW3
marking code wb1
ts0506
TS0507 EMC
TS-050
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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84-1LM
Abstract: ECF564A
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with
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