THICKNE55 Search Results

Contextual Info: 2 4 7 6 REVISIONS ISS ZONE DESCRIPTION\PER REQUEST\DATE 8.3 -5,6 -4.1- • F F RECOMMENDED CABLE STRIPPING DIM’S E E D D C C NGTE5: 1. 2. 3. FINI5H BRASS BRASS NICKEL PLATING THICKNE55 IN MICRO—INCHE5 PER Q Q -B-626 PER G G -B-613 PL. 100 MIN. THICK OVER COPPER STRIKE

U30407

Contextual Info: 862 4 DIM. A CKT. SIZE 2.54±O,05 DIM. B INCH (MM) INCH (MM) " . 10 0 ±.0 0 2 T YP. 4 (2.54) . 100 (4.83) .190 (2.54±0.05) 6 (5.08) .200 (7.37) .290 . I00±.002 8 (7.62) .300 (9.91) .390 10 ( 10. 16) .400 ( 12.45) .490 12 ( 12.70) .500 ( 14.99) .590 14

Contextual Info: _ I 5.550 +. 0 0 5 / - . 0 10 140.97 +0. I3/-0.25 .290 (7.37) "H"REF. DRjAMft I .059 F ( I.0O) 'X' Liiwiw-a4ftw flfl: .157 (3.99) _ | 71729 FORELOCK: NONE 3. REFER TO PRODUCT SPEC PS-71243-9999 FOR PERFORMANCE SPECIFICATIONS. ' X 11—

Contextual Info: 12 13 10 MATERIAL NUMBER tt OF COLUMNS tt OF DIFF PAIR DIM "A" MAX DIM "B" 7 6 0 6 0 -*0 10 50 26.60 17.10 7 6 0 6 0 -*2 12 60 30.40 20.90 0.46 7 6 0 6 0 -*4 14 70 34.20 24.70 ±0.05 7 6 0 6 0 -*6 16 80 38.00 28.50 7 6 0 6 0 -*0 10 50 26.60 17.10

Contextual Info: NOTES; L CARD SL OT A C C E P T S I.27±0.I0 MEASURED OVER P.C. PADS . MM MODULE THICKNESS. P.C. BOARD THICKNESS L5T MM +0 . I 8 / - 0 . I 3 2. AUL PEGS ARE IN T E R F E R E N C E FI T S TO PCB THE DWG. UNUESS NOTED ON 3. RE FE R TO PRODUCT S P E C . P S - 8 7 6 3 0 - 0 0 4 FOR PE RF ORM AN CE

Contextual Info: THh 4M «n*n1 r» th« aw w ity «F Am pM M l Cwp*wtl*f> arrf la drtlvarMl an V ia BKp rass BondW iK i fehdI It I s n ot -I» be d lac las ad, rspraduad o r u sad , Tn whok nr In po-*» wionufbohjra or id Ii by # m tn v h a ra l C D rp tr tftw i v r V iM it T « _ o rio r e m i r i A * 0 1 n » r ig h i i t g r w r Mj «

52602-0579

Abstract: 52602-0679 FN-171
Contextual Info: ►— CS >ì 1. N0TE5 S M MATERIAL aulcp, CM o 0 CM Li] n n (/I ee, r \ O V ' y O " . t i ^ HOUSINGsG.F.LCP, WHITE ,UL94V-0 : R r SiI TERMINALrPHOSPHOR BRONZE ( t = 0 .2 u l 94 v- o ) 2. PLATING + 0.25 u m J X h CONTACT AREAsGOLD 0 .2 5 u m M IN . LJ : l i w

MIL-P-19468

Abstract: SMA7471
Contextual Info: 2 I5S ZDNE 3 4 5 6 REVISIONS D ESC RIPTIO N ^ ER REQUEST\DATE F F RECOMMENDED MOUNTING HOLE E E 8 HE D D .6 C C N O TES: FIN ISH PLA TIN G TH IC K N E S S IN M IC R O -IN C H E S 1. BRASS PER Q Q - B - B 2 6 S. BRASS PER Q Q - B - B 1 3 5. GOLD PL. 3 MIN. THICK O VER N IC K E L PL. 10D MIN. TH ICK

Contextual Info: II 12 9 10 7 8 A- B-i 6 1 79059 3 1 2 GROUNDING CLIP nrnrn^^ "HI­ NOTE 4 5°54 THIS SHEET 79059 LAST CIRCUIT(w50 SHOWN) ( 10.36) NOTES „646 16.4 I) j= B B s= n nr SEE SHEETS 4 AND 5 FOR PART NO'S. AND CHARTED DIMENSIONS. T A IL / PCB PATTERN FIXED AT LAST CRICUIT POSITION

52602

Contextual Info: ►— CS >ì N0TE5 1. S M MATERIAL a u lc p , CM o 0 CM Li] n n (/I ee, r \ O V ' y O " . t i ^ HOUSINGsG.F.LCP, WHITE ,UL94V-0 : R r Si I TERMINALrPHOSPHOR BRONZE ( t = 0 .2 u l 9 4 v - o ) 2 . PLATING + 0.25 u m JX h CONTACT AREAsGOLD 0 . 2 5 u m M IN .

DDR molex 184

Contextual Info: 12 5 . 55 0 + . 0 0 5 / - . 0 IO NOTES; L CARD SLOT ACCEPTS . 0 5 0 ± . 0 0 4 1.27±0. 10 MODULE THICKNESS. (MEASURED OVER P.C. PADS). 2. ALL PEGS ARE INTERFERENCE FITS TO PCB UNLESS NOTED . 3. REFER TO PRODUCT SPEC P S - 7 I 2 4 3 - 9 9 9 9 FOR PERFORMANCE

Contextual Info: SD , 87239-54 2 PART No. CKT 5IZE 87239-1054 87239-2054 10 2 DIM MM 9.90 19.90 DIM Y MM INCH 8.00 .315 .709 18.00 X INCH .390 .783 E S 8 7 2 3 9 5 4 aDGN CAD FILE DWG- N0- 6 P A R T NUMBER LEGEND 87239 - * * 5 4 1 - CONFIGURATION D CKT SIZE NOTES: 1 PIN PU5H0UT FORCE: 2 LBS. MIN. BEFORE SOLDERING

LI803

Contextual Info: 13 12 II IS 9 8 NOTES: 1. SEE SHEET 2 FOR PART NO'S, CHARTED DIM'S AND P.C. BOARD LAYOUT. 2. TAIL PATTERN FIXED AT LAST CIRCUIT POSITION FOR ALL CIRCUIT SIZ ES LISTE D IN CHART SEE SHEET 2). 3. FOR ILLUSTRATION PURPOSES A 68 CIRCUIT ASSEMBUY IS SHOWN.

Contextual Info: 12 II 10 9 8 7 6 1 79058 3 1 2 J J 567 I I 10.72 H H G G (9.24±0.03) TERMINATION HEIGHT SEE NOTE 5 (4 27) DETAIL "A (ASSEMBLED WITHOUT STRAIN-RELIEF) F F SCALE 8:1

sda 5222

Abstract: Ec 1030 Dim
Contextual Info: CIRCUIT SIZE DI M. A DI M. B DI M. C DI M. D 18.90 14.00 17.40 17.22 „744 .55 I .685 . 678 22.40 22.22 2 7 .2 2 30 23.90 50 60 70 TOP OF HOUSING TO SEATING PLANE 28.90 24.00 27.40 1.138 .945 1.079 1.072 33.90 29.00 32.40 3 2 .2 2 1.335 1.142 1.276 1.269

70498-2068

Abstract: 70498-4068
Contextual Info: 70498 .567 1 4 . 40 .2 0 3 ± . 0 0 6 " ( 5 . I 5 ± 0 . 15) 422 ( 10. 72 UPPER HOUSING f . 138 (3.51) DATE CODE .364±.00 I ( 9 . 2 4 +0 . 0 3 ) T E R M I N A T I O N HEIG H T SEE NOTE DETAIL UNSHIELDED PLUG (4.27) 5 "A HOUSING 70498 II nr Ip 1 - -FULLY

L123

Abstract: WSK-1A348-A2 7C3T-14474-EA 97BG-14474-AAB LS054R-403-N-4 7C3T-14474-GA 7C3T-14474-LA c19025 J112B SAE J1128
Contextual Info: 13 10 PLATING INFORMATION WIRE BRUSH TO BE NO MORE THAN 0.40 FROM CONDUCTOR CRIMP ZONE A1ZONE A2 INSIDE TERMINAL WIRE BRUSH TO BE BELOW TOP OF CONDUCTOR CRIMP ' w SECTION Z - Z S C A L E 5:1 . SECTION A-A PLATING NOTES: {FOR SMALL AND LARGE POLARIZATION RIB TERMINALS)

Contextual Info: 10 L96 • /\ /\ /\ n _ L J _ n 2 .2 5 *0.05 5.20 *o.c SECTION C-C LECTION A-A 5.60 MAX 7.60 MIN. — 16.9 - 10.41 ±0.08 10.86 • 0 .8 4 ±0.05 0 . 8 0 *0.08 1.6 5 *0.15 l- A 3.1. nun J u tk u u u HA ■ □ 1.7 9 *0.15 ■ C 1.8 2 *0.15 1 Tb pi m | ^ | o .15|b |

Contextual Info: 13 12 II IS 9 8 T 6 1 7 106 1 3 1 2 646464646464646464336464646464646464647574 .306 7.77) 71061 MATERIAL^ RECEPTACLE HOUSINGS GLASS FIL LE D LCP (LIQUID CRYSTAL POLYMER); COLOR TERMINALS; PHOSPHOR BRONZE B LA CK;U L 94V-0 5. FOR FIXED T A IL /P C B PATTERN AT LAST CIRCUIT POSITIONS REFER

Contextual Info: II 12 CKT. S IZ E TTFM NO D IM . A INCH MM 9 IS D IM . B INCH MM D IM . C INCH T 8 D IM . P RECOM M ENDED MM TA IL LENGTH INCH 6 1 71163 3 1 2 PCB MM 7 1 1 6 3 -0 0 0 1 50 1.5 10 3 8 .3 5 1.200 3 0 .4 8 1.366 3 4 .7 0 .1 0 0 .0 6 2 1.57 7 11 63 -00 02 68

10890229

Contextual Info: 8624 DIM. A CKT. SIZE 2.54±O,05 DIM. B INCH (MM) INCH (MM) " . 10 0 ±.0 0 2 T YP. 4 (2.54) . 100 (4.83) .190 (2.54±0.05) 6 (5.08) .200 (7.37) .290 . I00±.002 8 (7.62) .300 (9.91) .390 10 ( 10. 16) .400 ( 12.45) .490 12 ( 12.70) .500 ( 14.99) .590 14

Contextual Info: 10 •141.00 ■ I- 7.50 l » n n 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D 0 D G D 0 D 0 D 0 D B D D D D D D D D D Iin 2 .6 V linODODODODODODODODODODODODODODODODOaODnni i DGDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDDGG

UCP2004-024G

Abstract: 4013 pin configuration
Contextual Info: II 12 9 10 7 8 A- B-i 6 1 79059 3 1 2 GROUNDING CLIP nrnrn^^ "HI­ NOTE 4 5°54 THIS SHEET 79059 LAST CIRCUIT(w50 SHOWN) ( 10.36) NOTES „646 16.4 I) j= B B s= n nr SEE SHEETS 4 AND 5 FOR PART NO'S. AND CHARTED DIMENSIONS. T A IL / PCB PATTERN FIXED AT LAST CRICUIT POSITION

Contextual Info: II 12 C K T . M A T ' L NOa S I Z E D IN L INCH A MM D IN L INCH 10 B MM D IN L INCH C MM 9 D IN L INCH 7 8 D IM . P T A IL LENGTH D MM R E C O M M E N D E D INCH 6 1 71163 3 1 2 P C B MM 71163-1001 50 1.750 44.45 1.2 00 30.48 1.366 34.70 1.590 40.39 .125