TC7SP58FU Search Results
TC7SP58FU Datasheets (2)
Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
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TC7SP58FU |
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Japanese - General Purpose Logic ICs | Original | |||
TC7SP58FU |
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General Purpose Logic ICs | Original |
TC7SP58FU Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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tc7sp57fu
Abstract: TC7SP57 TC7SP58FU schmitt buffer H 110 3.6 V
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TC7SP57 TC7SP57FU TC7SP58FU TC7SP57) TC7SP58) TC7SP57FU, TC7SP58FU schmitt buffer H 110 3.6 V | |
Contextual Info: TC7SP57,58FU TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC7SP57FU,TC7SP58FU Low Voltage Single Configurable Multiple Function Gate with 3.6-V Tolerant Inputs and Outputs The TC7SP57,58 is a high performance CMOS multiple Function Gate which is guaranteed to operate from 1.2-V to 3.6-V. |
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TC7SP57 TC7SP57FU TC7SP58FU TC7SP57) TC7SP58) | |
tc7sp57fu
Abstract: TC7SP57 TC7SP58FU
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TC7SP57 TC7SP57FU TC7SP58FU TC7SP57) TC7SP58) TC7SP58FU | |
Contextual Info: TC7SP57,58FU TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC7SP57FU,TC7SP58FU Low Voltage Single Configurable Multiple Function Gate with 3.6-V Tolerant Inputs and Outputs The TC7SP57,58 is a high performance CMOS multiple Function Gate which is guaranteed to operate from 1.2-V to 3.6-V. |
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TC7SP57 TC7SP57FU TC7SP58FU TC7SP57) TC7SP58) | |
Contextual Info: Reliability Tests Report Product Name: TC7SP58FU Package Name: US6 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s |
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TC7SP58FU |