SSOP24 Search Results

Contextual Info: Ordering number : EN5741 CMOS LSI LC89902V CMOS Driver for VGA-Format Image Sensors Overview Package Dimensions The LC89902V is a vertical driver CMOS IC specifically designed for use with VGA-format CCD image sensors. unit: mm 3175A-SSOP24 Applications [LC89902V]

SSOP24J

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 24Pin Plastic SSOP24J 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

ssop24

Abstract: SSOP-24
Contextual Info: PACKAGE DIMENSIONS SSOP24 0 ~ 10º 10.2±0.3 24 0.5±0.2 7.8±0.3 5.4±0.2 13 12 1 0.8 +0.1 0.15 -0.05 0.10 0.36±0.1 0.12 M +0.1 0.05 - 0.05 1.8±0.1 0.85MAX UNIT : mm

sanyo ctp

Abstract: sanyo ccb chip
Contextual Info: Ordering number : ENN6974A CMOS IC LC72148V Electronic Tuning PLL Frequency Synthesizer for Car Stereo Systems Package Dimensions unit: mm 3175B-SSOP24 [LC72148V] 7.8 24 1 0.33 0.65 7.6 0.15 0.22 0.1 (1.3) • High-speed programmable divider — FMIN: 10 to 180 MHz . Pulse swallower technique

SSOP24-P-300-0

Abstract: 24P2Q 24p2q-a
Contextual Info: 24P2Q-A Plastic 24pin 300mil SSOP EIAJ Package Code SSOP24-P-300-0.80 JEDEC Code – Weight g 0.2 Lead Material Cu Alloy e I2 13 E F Recommended Mount Pad Symbol 1 12 A A2 A1 D L L1 HE e1 24 b2 e y c b Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

MO-137

Abstract: SSOP24 L121
Contextual Info: PDF: 2003 Apr 07 Philips Semiconductors Package outline SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT556-1 A X c y HE v M A Z 13 24 A2 A A 3 A1 θ Lp L 12 1 e detail X w M bp 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

MO-137-AE

Abstract: sot556 2413A2
Contextual Info: PDF: 1999 May 05 Philips Semiconductors Package outline SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT556-1 A X c y HE v M A Z 13 24 A2 A A 3 A1 θ Lp L 12 1 e detail X w M bp 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

LC9915

Abstract: 57415 LC89902V SSOP24 LC99152
Contextual Info: Ordering number : EN5741 CMOS LSI LC89902V CMOS Driver for VGA-Format Image Sensors Overview Package Dimensions The LC89902V is a vertical driver CMOS IC specifically designed for use with VGA-format CCD image sensors. unit: mm 3175A-SSOP24 Applications [LC89902V]

PRSP0024GA-A

Abstract: 24P2Q-A 24P2Q
Contextual Info: JEITA Package Code P-SSOP24-5.3x10.1-0.80 RENESAS Code PRSP0024GA-A Previous Code 24P2Q-A MASS[Typ.] 0.2g E 13 *1 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. F 1 12 Index mark *2 c A2 A1 D A

SSOP24

Contextual Info: 24-Pin Shrink Small Outline Package Embossed EL Tape for the SSOP24 Package Tape Dimensions Unit: mm 12.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 2.0 ±0.1 4.0 ±0.1 Y 0.3 ±0.05 X’ X 8.3 ±0.1 φ1.6 +0.1 –0 16.0 ±0.3 7.5 ±0.1 Y Y’ Y’ Feed direction 8.0 ±0.1

Contextual Info: Ordering number : ENN6974A CMOS IC LC72148V Electronic Tuning PLL Frequency Synthesizer for Car Stereo Systems Package Dimensions unit: mm 3175B-SSOP24 [LC72148V] 7.8 24 1 0.33 0.65 7.6 0.15 0.22 0.1 (1.3) • High-speed programmable divider — FMIN: 10 to 180 MHz . Pulse swallower technique

SSOP24

Contextual Info: パッケージ外形図 SSOP24 0 ~10 ゜ 10.2±0.3 24 0.5±0.2 7.8±0.3 5.4±0.2 13 12 1 0.8 +0.1 0.15 -0.05 0.10 0.36±0.1 0.12 M +0.1 0.05 - 0.05 1.8±0.1 0.85MAX 単位 : mm

12NC ordering code nxp

Contextual Info: SS OP 24 SOT340-1 SSOP24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 5 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

TA8761P

Abstract: QFP100-P-1420 TC9078F ta8761 ta86 TC9089AN
Contextual Info: D igital Y/C Separation Typ« No. TC9057BF Package Outline QFP100-P-1420 Motion-adaptive 3 dimensional Y/C separation TC9066F Q FP100-P-1420 TC9086F* Q FP100-P-1420A TC9089AN/AF TA8667P/F TA8761P SDIP28-P-400 SOP28-P-450 DIP18-P-300A SSOP24-P-300B OIP16-P-300A

Contextual Info: 24P2U-A Plastic 24pin 375mil SSOP EIAJ Package Code SSOP24-P-375-0.80 Weight g 0.4 JEDEC Code – Lead Material Cu Alloy e I2 13 E Recommended Mount Pad F Symbol 12 1 A A2 A1 D e y L L1 HE e1 24 b2 b c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

sot340

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A A 3 A1 pin 1 index θ Lp L 1 12 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

vif sweep generator

Abstract: LA75676 SSOP24
Contextual Info: Ordering number : EN7868 Monolithic Linear IC IF Signal Processor VIF+SIF for TV and VCR Products LA75676VA Overview The LA75676VA is a VIF/SIF IC that supports NTSC intercarrier reception and adopts a semi-adjustment-free design. It is provided in the SSOP24 (225mil, 0.5mm lead pitch) package, which is appropriate for miniature 2-in-1 tuner products. In

SSOP24

Abstract: land pattern ssop24
Contextual Info: 24-Pin Shrink Small Outline Package SSOP24 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 7.6 ±0.3 +0.03 0.15 -0.01 13 5.6 ±0.2 24 0 ～10゜ 0.45 ±0.2 0.325 typ. 0.65 12 0.22 +0.09 –0.06 0.1 Land Pattern Example 0.13 M Enlarged view of A

MO-150

Abstract: SSOP24 jedec MO-150
Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A A 3 A1 pin 1 index θ Lp L 1 12 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

MO-150

Abstract: SSOP24 jedec MO-150
Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A A 3 A1 pin 1 index θ Lp L 1 12 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

4392

Abstract: 4392 ic equivalent dr brushless driver 4392 a ic reference-voltage
Contextual Info: Ordering number: EN4392A Monolithic Digital IC LB1674V Brushless, Sensorless Motor Driver Overview Package Dimensions The LB1674V is a small motor driver ideal for mini-cassettes, headphone stereos and micro-cassettes. unit : mm 3175A-SSOP24 [LB1674V] Functions and Features

Contextual Info: Ordering number: EN4392A Overview Package Dimensions The LB 1674V is a small motor driver ideal for mini-cassettes, headphone stereos and micro-cassettes. unit : mm 3175A-SSOP24 [LB 1674V] O.IS Functions and Features & it • 3-phase unipolar, brushless, sensorless m otor driver

vif sweep generator

Abstract: la75676 SSOP24 record bias oscillator coil vco coil
Contextual Info: Ordering number : ENA0831 Monolithic Linear IC For TV and VCR Products LA75676V IF Signal Processor VIF+SIF Overview The LA75676V is a VIF/SIF IC that supports NTSC intercarrier reception and adopts a semi-adjustment-free design. It is provided in the SSOP24 (225mil, 0.5mm lead pitch) package, which is appropriate for miniature 2-in-1 tuner products. In

Contextual Info: Package outline SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 pin 1 index A A 3 A1 θ Lp L 1 12 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max.