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    SIGC101T170R3 Search Results

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    SIGC101T170R3 Price and Stock

    Infineon Technologies AG SIGC101T170R3EX1SA

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC101T170R3EX1SA)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC101T170R3EX1SA Waffle Pack 2,340
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    Infineon Technologies AG SIGC101T170R3X1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC101T170R3X1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC101T170R3X1SA1 Waffle Pack 31
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    Infineon Technologies AG SIGC101T170R3EX1SA2

    (Alt: SP000906252)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    EBV Elektronik SIGC101T170R3EX1SA2 2 Weeks 1
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    SIGC101T170R3 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SIGC101T170R3 Infineon Technologies IGBT Chip Original PDF
    SIGC101T170R3 Infineon Technologies For drive application, Trench-and Fieldstop technology Original PDF

    SIGC101T170R3 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: SIGC101T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC101T170R3 VCE ICn 1700V 75A This chip is used for: • power module


    Original     		PDF SIGC101T170R3 Q67050A4188-A001 771-A,

    SIGC101T170R3

    Abstract: No abstract text available
    Text: Preliminary SIGC101T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC101T170R3 VCE ICn 1700V 75A This chip is used for:


    Original     		PDF SIGC101T170R3 Q67050sawn A4188-A001 771-A, SIGC101T170R3

    tsc 1003

    Abstract: No abstract text available
    Text: SIGC101T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling This chip is used for: • power modules C Applications: • drives


    Original     		PDF SIGC101T170R3E L7771T, tsc 1003

    Untitled

    Abstract: No abstract text available
    Text: SIGC101T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power modules C Applications:  drives


    Original     		PDF SIGC101T170R3E L7777M, L7777T, L7777E,

    SIGC101T170R3

    Abstract: No abstract text available
    Text: SIGC101T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC101T170R3 VCE ICn 1700V 75A This chip is used for: • power module


    Original     		PDF SIGC101T170R3 Q67050A4188-A001 771-A, SIGC101T170R3

    Untitled

    Abstract: No abstract text available
    Text: Preliminary SIGC101T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC101T170R3 VCE ICn 1700V 75A This chip is used for:


    Original     		PDF SIGC101T170R3 Q67050sawn A4188-A001 771-A,