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    Infineon Technologies AG SIDC03D60C6X1SA2

    Diode Switching 10A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC03D60C6X1SA2)
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    Avnet Americas SIDC03D60C6X1SA2 Waffle Pack 1,338
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    SIDC03D60C6 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SIDC03D60C6 Infineon Technologies Used for IGBT3 Original PDF
    SIDC03D60C6X1SA2 Infineon Technologies Discrete Semiconductor Products - Diodes - Rectifiers - Single - DIODE GEN PURP 600V 10A WAFER Original PDF

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    SIDC03D60C6

    Abstract: No abstract text available
    Text: SIDC03D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC03D60C6 600V IF 10A A This chip is used for:


    Original     		PDF SIDC03D60C6 Q67050-A4350A101 L4521M, SIDC03D60C6

    Untitled

    Abstract: No abstract text available
    Text: SIDC03D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type VR SIDC03D60C6 600V IF 10A A This chip is used for:


    Original     		PDF SIDC03D60C6 Q67050-A4350A101 L4521M,

    L4521M

    Abstract: FS10R06VE3 SIDC03D60C6
    Text: SIDC03D60C6 Fast switching diode chip in EMCON 3 -Technology FEATURES: • 600V EMCON 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • power module • discrete components


    Original     		PDF SIDC03D60C6 L4521M, L4521M FS10R06VE3 SIDC03D60C6