S10226 Search Results

charge amplifier

Abstract: cmos IMAGE SENSOR evaluation board
Contextual Info: IMAGE SENSOR CMOS linear image sensor S10226 Small plastic package CMOS image sensor Features Applications l Compact and high cost-performance t Surface mount package: 2.4 x 9.1 × 1.6 mm l Pixel pitch: 7.8 µm Pixel height: 125 µm l Number of pixels: 1024 ch

refractometer

Abstract: S10226 high frequency linear cmos IMAGE SENSOR charge amplifier
Contextual Info: IMAGE SENSOR CMOS linear image sensor S10226 Small plastic package CMOS image sensor Features Applications l Compact and high cost-performance t Surface mount package: 2.4 x 9.1 × 1.6 mm l Pixel pitch: 7.8 µm Pixel height: 125 µm l Number of pixels: 1024 ch

Contextual Info: IMAGE SENSOR CMOS linear image sensor S10226 Small plastic package CMOS image sensor Features Applications l Compact and high cost-performance t Surface mount package: 2.4 x 9.1 × 1.6 mm l Pixel pitch: 7.8 µm Pixel height: 125 µm l Number of pixels: 1024 ch

Contextual Info: CMOS linear image sensor S10226 Small, resin-sealed CMOS image sensor The S10226 is a resin-sealed CMOS linear image sensor to offer compact size and high cost-performance compared to our previous product S9226 series . Features Applications Compact and high cost-performance

05564

Contextual Info: CMOSリニアイメージセンサ S10226-10 小型・樹脂封止型CMOSイメージセンサ S10226-10は従来品 S9226シリーズ と比べて小型で高いコストパフォーマンスを実現した樹脂封止型のCMOSリニアイ メージセンサです。

S10226

Abstract: S EOS 001
Contextual Info: IMAGE SENSOR CMOSリニアイメージセンサ S10226 小型プラスチックパッケージCMOSイメージセンサ 特長 用途 l 小型で高いコストパフォーマンスを実現 l バーコードリーダ l 変位計 l 屈折計 l 干渉計 l 簡易型分光器

C10500

Contextual Info: セレクションガイド 2013.11 イメージセンサ 幅 広 い 波 長 範 囲 に 対 応した 計 測 用 イメ ー ジ セ ン サ IMAGE SENSOR イメージセンサ 幅広い波長範囲に対応した 計測用イメージセンサ 浜 松ホトニクスは赤 外から可 視・紫 外・真 空 紫 外・

S11830-3344MF

Contextual Info: NEWS 01 2011 Solid state PRODUCTS PAGE 11 Thumb-sized “ultra-compact spectrometer” with VIS-NIR response SOLID STATE PRODUCTS PAGE 16 New developments for the MPPC ELECTRON TUBE PRODUCTS PAGE 21 H2D2 light sources L11788 series, L11789 series SYSTEMS PRODUCTS

Contextual Info: Technology introduction CHAPTER 13 1 Semiconductor process technology 1-1 Silicon process technology 1-2 Compound semiconductor process technology 2 Assembly technology 2-1 2-2 2-3 2-4 2-5 Packages for diverse needs Flip chip bonding Dicing Module products

Contextual Info: 2007 Vol.1 NEWS Belgium / Denmark / France / Germany / Italy / Netherlands / North Europe & CIS / 16 models with different spectral response, resolution, sensitivity, etc. Select a model that fits your application 4 MPPC Multi-Pixel Photon Counter 8 10 Gbps ROSA

Contextual Info: 技術紹介 第 13 章 1 半導体プロセス技術 1-1 1-2 Siプロセス技術 化合物半導体プロセス技術 2 アッセンブリ技術 2-1 2-2 2-3 2-4 2-5 多様なパッケージ フリップチップボンディング ダイシング モジュール化

R6094 pmt divider circuit

Abstract: Hamamatsu r6094 C9321CA-02 R4110U-74 AUTOMATIC STREET LIGHT CONTROLLER using IR sensor InGaas PIN photodiode chip back illuminated apd raman wafer 60g H9656 sensor x-ray
Contextual Info: New CCD for Low-Light Scientific Applications High-Speed InGaAs APD + TIA ROSA Highly Sensitive Image Intensifier with Large Active Area Flat-Panel Sensor Product Line Extended The Improved Macro Imaging System AEQUORIA Imaging-Based Plate Reader FDSS for HighThroughput

C10500

Abstract: linear CCD 512 TDI cmos image sensor
Contextual Info: Selection guide - Sep. 2014 Image Sensors Various types of image sensors covering a wide spectral response range for photometry HAMAMATSU PHOTONICS K.K. Image sensors Various types of image sensors covering a wide spectral response range for photometry H A M A M AT S U d e v e l o p s a n d p r o d u c e s a d vanced image sensors for measurement applications in spectral and energy ranges including infrared, visible, ultraviolet, vacuum ultraviolet, soft X-rays and hard X-rays. We provide

S10604

Contextual Info: 2008 Vol.1 NEWS 2008 Vol.1 E x h i b i t i o n s NEWS Belgium / Denmark / France / Germany / Italy / Japan / Netherlands / Northern Europe / Poland / Portugal / Russia / South Africa / February USGEB 2008 Meeting Lausanne / Switzerland Emerging Technologies in Diagnostic Imaging