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Contextual Info: Surface Mounted Surface Mounted Pi Filters SLT/-/SM3A Circuit Diagram Ordering Information Please state Part Number. Materials Terminations: Tin lead or silver. For Test Conditions see page63 Voltage Rating Case Dimensions All dimensions in millimetres. 3.5 –0.1*

620 a940

Contextual Info: 13-Serie 18000-A_16-Serie 18000-A 21/11/12 15:40 Page63 18000 series Snap-action momentary pushbutton switches Distinctive features and specifications ❑ Panel and PC mount models ❑ Snap-in panel mounting version ❑ Tactile feedback B2 ELECTRICAL SPECIFICATIONS

Contextual Info: Solder Mounted Solder Mounted Pi Circuit Filters dBZ4 Circuit Diagram Ordering Information Please state Part Number. Materials Body: Brass, silver finish Feedthrough terminations: Copper alloy, tin lead or silver finish. For Test Conditions see page63 Voltage Rating

KFG2G16Q2A

Abstract: 0307h 0719h 63FBGA KFG2G16 onenand oneNand flash
Contextual Info: OneNAND2G KFG2G16Q2A-DEBx OneNAND4G(KFH4G16Q2A-DEBx) FLASH MEMORY KFG2G16Q2A KFH4G16Q2A 2Gb OneNAND A-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

63FBGA

Abstract: KFG1G16Q2B onenand
Contextual Info: OneNAND1Gb KFG1G16Q2B-DEBx FLASH MEMORY KFG1G16Q2B 1Gb OneNAND B-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

59013 h 331

Abstract: 59014 c 331 comcode 105 736 490 fcs 9013 GR-253-CORE JT-G704 JT-G706 TMXL28155 TR-62411 59014 c
Contextual Info: Preliminary Data Sheet, Rev 2 June, 2002 TMXL28155 SupermapperLite 155/51 Mbits/s SONET/SDH x28/x21 DS1/E1 1 Features • ■ Versatile IC supports 155/51 Mbits/s SONET/SDH interface solutions for T3, DS2, and T1/E1/J1 applications. Implementation supports both linear 1 + 1, unprotected and ring (UPSR) network topologies.

Contextual Info: OneNAND256 KFG5616x1A-xxB6 FLASH MEMORY OneNANDTM Specification Density 256Mb Part No. VCC(core & IO) Temperature PKG KFG5616Q1A-DEB6 1.8V(1.7V~1.95V) Extended 67FBGA(LF) KFG5616Q1A-PEB6 1.8V(1.7V~1.95V) Extended 48TSOP1 KFG5616D1A-DEB6 2.65V(2.4V~2.9V) Extended

hp laptop MOTHERBOARD pcb CIRCUIT diagram

Abstract: STAC9752A STAC9753A 9753A 9753 AES17-1991 pcb MOUNT JACK CONNECTOR 7mm audio hp laptop motherboard circuit diagram AC97 7410PC
Contextual Info: DATASHEET AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK STAC9752A/9753A FEATURES • High Performance Σ∆ Technology • AC’97 Rev 2.3 Complaint • 20-bit Full Duplex Stereo ADC & DACs • Independent Sample Rates for ADC & DACs • 5-Wire AC-Link Protocol Compliance

spdif jack 6 pin

Abstract: VRM Section of laptop Motherboard INTEL 845 MOTHERBOARD CIRCUIT diagram STAC9700 STAC9721 STAC9750 STAC9752 STAC9753 STAC9756 STAC9766
Contextual Info: DATASHEET TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING Description IDT's STAC9752/9753 are general purpose 20-bit, full duplex, audio CODECs conforming to the analog component specification of AC'97 Audio CODEC 97

Contextual Info: MuxOneNAND1G KFM1G16Q2A-DEBx MuxOneNAND2G(KFN2G16Q2A-DEBx) FLASH MEMORY KFXXX16Q2A 1Gb MuxOneNAND A-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

SLC NAND endurance 100k

Contextual Info: MuxOneNAND1G KFM1G16Q2M-DEB6 MuxOneNAND2G(KFN2G16Q2M-DEB6) FLASH MEMORY MuxOneNANDTMSpecification Density Part No. VCC(core & IO) 1Gb KFM1G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) 2Gb KFN2G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) Version: Ver. 1.0

samsung 2GB Nand flash 121 pins

Abstract: samsung 2GB Nand flash TOGGLE sensing nand flash memory SAMSUNG Electronics Toggle DDR NAND flash
Contextual Info: MuxOneNAND1G KFM1G16Q2M-DEB6 MuxOneNAND2G(KFN2G16Q2M-DEB6) FLASH MEMORY MuxOneNANDTMSpecification Density Part No. VCC(core & IO) 1Gb KFM1G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) 2Gb KFN2G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) Version: Ver. 1.1

022AH

Contextual Info: OneNAND1Gb KFG1G16Q2B-DEBx FLASH MEMORY KFG1G16Q2B 1Gb OneNAND B-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

4GB MLC NAND

Abstract: SAMSUNG NAND Flash MLC
Contextual Info: MuxOneNAND2G KFM2G16Q2M-DEBx MuxOneNAND4G(KFN4G16Q2M-DEBx) Preliminary FLASH MEMORY KFM2G16Q2M KFN4G16Q2M 2Gb MuxOneNAND M-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

558B

Abstract: S558-5999-U1 F ky U10 ADP3205 PMH4 C949
Contextual Info: CR-1 : @DESIGN.J3E SCH_1 :PAGE1 A B C D E G F H J K L M N DATE 9 YUKON/KODIAK VER SE 10/20/03 PLANAR 10/20/2003 7 6 5 4 3 2 1 TITLE PAGE EC HISTORY CPU(1/3) CPU(2/3) CPU(3/3) ITP CONN VCCCPUCORE DECOUPLING GMCH-M(1/5) GMCH-M(2/5) GMCH-M(3/5) GMCH-M(4/5) GMCH-M(5/5)

PMH4

Abstract: ADP3205 S558-599 t9 547B34 qm77 ky U10 357n c840 TP231005 ibm apollo
Contextual Info: CR-1 : @DESIGN.J3E SCH_1 :PAGE1 A B C D E F G H J K L M N DATE 9 YUKON/KODIAK VER SE PLANAR 10/20/03 EC NO. P PART Q NO. VER.SE 9 DEVELOPMENT NO. Q/M 1 6 5 4 3 2 1 78 10/20/2003 8 7 / 8 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20.

asus

Abstract: FA8142 PT8300 RS690M ATI M76-M m64m H5401 PT8700 M64-M ATXP1 8632e
Contextual Info: 5 4 3 2 1 */E*/I &PSGO MEKVEQ VGA VCORE D AMD CPU S1g1 CPU VCORE PAGE 85 PAGE 80 Clock gen. DDR2-800MHz PAGE 29 Dual Channel DDR2 D SO-DIMM X 2 Power On Sequence Up to 4GB DDRII PAGE 7,8,9 PAGE 32 PAGE 3,4,5 Li-Ion 6 cells:4800mAH,3S2P,53.28W (3S2P;4.2*3=12.6V;2400mAH*2=4800mAH;

DLT425PR

Abstract: DLT326PR
Contextual Info: Panel Mounted Panel Mounted L Circuit Filters DLT Ordering Information Circuit Diagram e.g. DLT326PR Blank - UNF thread M - Metric thread Blank - No special conditioning Bu - Standard burn in Bx - Burn in to cust. req. Blank - Standard thread L - Long thread

tag 1-500

Abstract: TAG 85 22
Contextual Info: Printed Circuit Mounted Printed Circuit Mounted Pi Filters SLT/-/PC2 Ordering Information Circuit Diagram Please state Part Number. Materials Feedthrough terminations: Copper alloy, tin lead finish. Earth tag: Brass, tin lead on area for user soldering, silver finish

Contextual Info: Solder Mounted Solder Mounted C Circuit Filters dBZ2 Circuit Diagram Ordering Information Please state Part Number. Materials Body: Mild steel, gold finish dBZ2/C/-/H Brass, gold finish (dBZ2/C/-) Feedthrough terminations: Iron/cobalt/nickel alloy gold finish (dBZ2/C/-/H)

Contextual Info: Miniature Threaded Miniature Threaded C and Pi Circuit Filters FLT Circuit Diagram Ordering Information Please state Part Number. Nuts and washers supplied as standard. FLTM/C/- Materials Body and Nut: Brass, silver finish Washer: Tin plated, beryllium-copper alloy

Contextual Info: Printed Circuit Mounted Printed Circuit Mounted Pi Circuit Ordering Information TPA Circuit Diagram Blank - No special conditioning Bu - Standard burn in Bx - Burn in to Cust. req. e.g. TPA950B Tangent of loss of angle Tan δ 0.04 max. Environmental Classification 55/125/04

OneNAND

Abstract: 63FBGA KFG1G16Q2M-DEB6 KFH2G16Q2M-DEB6 KFW4G16Q2M-DEB6 NAND Flash MLC
Contextual Info: OneNAND4G KFW4G16Q2M-DEB6 OneNAND2G(KFH2G16Q2M-DEB6) OneNAND1G(KFG1G16Q2M-DEB6) FLASH MEMORY OneNANDTM Specification Density Part No. VCC(core & IO) Temperature PKG 1Gb KFG1G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) 2Gb KFH2G16Q2M-DEB6 1.8V(1.7V~1.95V)

Contextual Info: IDT82V2058 E1 Octal Line Interface Unit Preliminary Data Sheet, Feb 2001 Ver 1.0 File No. IDT82V2058DS