PK482 Search Results

Contextual Info: 100% Material Declaration Data Sheet FF1924 PK482 v1.1 September 28, 2012 Average Weight: 28.3806 g Component Silicon Die (FPGA) Substance Description Doped silicon (Si) CAS Number or Description 7440-21-3 Percentage of Component 100.00 Solder Bump Use in Product

Contextual Info: 10 PICK AND PLACE COVER TERMINAL ^ 7 d ± o.i : MOLEX LOGO CKTS HOUSING . q FITTING NAIL^ ^ a d [7 ” T I X f l-f l- f l-f l- fl-o X s s s6.3s s s 4.7 4.3 3.05 u- - - - p REC O M M EN DED P.C.B L A Y O U T (0 7 ) 3k 3 : 1.7 ±0.05 I n JLJL

Contextual Info: NOTE: 1. MATERIAL: HOUSING: POLYESTER GLASS FILLED.ULS^-VO.COLORrBLACK TERMINAL: PHOSPHOR BRONZE METAL SHELL: SPCC BOARD LOCK: BRASS SCREW: BRASS 2. TERMINAL: CONTACT AREA: SEE PA R T NUMBER LEGEND SOLDER TAIL:TIN Sn ,THICKNESS=100 MICROINCH MIN/2.54 MICROMETER MIN.

Contextual Info: 10 A ±0.1 RECOMMENDED PCB LAYOUT SECTION E-E NOTES: 1. 2. C0PLANARITY IS 0.1 mm MAX. MATERIAL : HOUSING: NYLON, GLASS FILLED, UL 94V-0, COLOR: SEE TABLE TERMINAL: PHOSPER BRONZE. FITTING NAIL: PHOSPER BRONZE 3. FINISHES : TERMINAL : SEE TABLE FITTING NAIL: SEE TABLE

io card pci 1230

Contextual Info: M^ PIN ttAI 10.00 SLOT TO INDICATE^ CKT «A1 DIM *E* •N’ SPACES AT 1.00 1.50 1.50 u u m u I “ BHBBBHBHH BHBBBHBHH HBHHHBHHBHHBBHBBHBBI BBBBBBBBBBBBBBBI n 11.65 14.50 I I I !' DIM -D- PCB THK REF DIM’A" 4.10 SECTION 1.73 ±0.08 1.50 MAX 1.57 L. P-P

Contextual Info: 10 _ |_ 3_ |_ 2_ |_ 1 NOTES: 1. MATERIALS: 14.00 9.50 SEE TABLE 3.00 2. PLATING: SEE TABLE 3. RECOMMENDED PCB THICKNESS=1.2mm. □ B U. PRODUCT SPECIFICATION REFER TO PS-48286-001. 5. PACKING SPECIFICATION REFER TO PK-48286-001.