PC314 Search Results

PC314

Abstract: ic 4060 internal circuit PC3D14 NC04 PC3Q14 TTT777 P-C314
Contextual Info: SHARP ELEK/ MELEC DIV 1SE d | ölflDVTä GQG2ölb b | Photocouplers _ • -I A Q û r i r v c ■ w O I *+ Itîo ■ .„ PC 314 Series T -4 1 -8 3 _ ■ 1. AC or Polarity insensitive inputs 2. Opaque type, mini-flat package PC314 1-channel PC3D14 (2-channel)

K743

Abstract: military specification M55302 10-296943-22 removal tool snap on tools for electronic IO2-120 MIL-G-45204 MIL-P-46161 amphenol 77820 MB3-132 io3051
Contextual Info: Amphenol Low Mating Force Rectangular Connectors 12-035-10 MIL-C-55302 Amphenol Table of Contents Page No. 1 Item The B3 Contact Innovation 2, 3 Low Mating Force Electrical Connectors 4 Low Mating Force Hybrid Configurations 5–8 8, 9 10, 11 How to Order

Contextual Info: 8GB x72, ECC, SR 240-Pin DDR3 RDIMM Features DDR3 SDRAM RDIMM MT18JSF1G72PZ – 8GB Features Figure 1: 240-Pin RDIMM (MO-269 R/C C2) • DDR3 functionality and operations supported as per the component data sheet • 240-pin, registered dual in-line memory module

MT18JSF51272PDZ-1G

Abstract: MT18JSF25672PDZ MT18JSF25672PDZ-1G4 2403 GB 123 MT18JSF51272PDZ-1G6 MT18JSF51272PDZ
Contextual Info: 2GB, 4GB x72, ECC, DR 240-Pin DDR3 RDIMM Features DDR3 SDRAM RDIMM MT18JSF25672PDZ – 2GB MT18JSF51272PDZ – 4GB Features Figure 1: 240-Pin RDIMM (MO-269 R/C B1) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module

DDR3 LRDIMM

Abstract: MT72JSZS4G72LZ-1G9 MT72JSZS4G72LZ-1G9E2A7 DDR3 DIMM SPD LRDIMM LRDIMM TSE-200
Contextual Info: 32GB x72, ECC, QR 240-Pin DDR3 LRDIMM Features DDR3 SDRAM LRDIMM MT72JSZS4G72LZ – 32GB Features Figure 1: 240-Pin LRDIMM (MO-269 RC/C) • 240-pin, load-reduced dual in-line memory module (LRDIMM) • Memory buffer (MB) isolates DRAM interface from card edge

MT9JSF25672AZ

Contextual Info: 1GB, 2GB x72, ECC, SR 240-Pin DDR3 UDIMM Features DDR3 SDRAM UDIMM MT9JSF12872AZ – 1GB MT9JSF25672AZ – 2GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C D1) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, unbuffered dual in-line memory module

MT8JTF51264

Abstract: MT8JTF51264AZ MT8JTF512 DDR3 udimm jedec MT8JTF51264A
Contextual Info: 1GB, 2GB, 4GB x64, SR 240-Pin DDR3 UDIMM Features DDR3 SDRAM UDIMM MT8JTF12864AZ – 1GB MT8JTF25664AZ – 2GB MT8JTF51264AZ – 4GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C A) • DDR3 functionality and operations supported as defined in the component data sheet

LRDIMM SPD

Abstract: Micron LRDIMM LRDIMM
Contextual Info: 32GB x72, ECC, QR 240-Pin DDR3 LRDIMM Features DDR3 SDRAM LRDIMM MT72JSZS4G72LZ – 32GB Features Figure 1: 240-Pin LRDIMM (MO-269 RC/C) • 240-pin, load-reduced dual in-line memory module (LRDIMM) • Memory buffer (MB) isolates DRAM interface from card edge

MT9JSF25672AZ-2G1

Abstract: micron ddr3 2133 MT4J128M8
Contextual Info: 1GB, 2GB x72, ECC, SR 240-Pin DDR3 UDIMM Features DDR3 SDRAM UDIMM MT9JSF12872AZ – 1GB MT9JSF25672AZ – 2GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C D1) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, unbuffered dual in-line memory module

MT36JSF2G72PZ-1G4 SPD

Contextual Info: 16GB x72, ECC, DR 240-Pin DDR3 RDIMM Features DDR3 SDRAM RDIMM MT36JSF2G72PZ – 16GB Features Figure 1: 240-Pin RDIMM (R/C J1) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line memory module

MT18JSF51272AZ

Abstract: MT18JSF25672AZ-1G6 MT18JSF1G72AZ-1G9 MT18JSF51272AZ-1G9
Contextual Info: 2GB, 4GB, 8GB x72, ECC, DR 240-Pin DDR3 UDIMM Features DDR3 SDRAM UDIMM MT18JSF25672AZ – 2GB MT18JSF51272AZ – 4GB MT18JSF1G72AZ – 8GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C E3) Module height: 30.0mm (1.181in) • DDR3 functionality and operations supported as

MT36JDZS2G72PZ-1G6E1

Abstract: MT36JDZS2G72PZ
Contextual Info: 16GB x72, ECC, DR 240-Pin DDR3 VLP RDIMM Features DDR3 SDRAM VLP RDIMM MT36JDZS2G72PZ – 16GB Features Figure 1: 240-Pin RDIMM (MO-269 R/C N, R/C N1) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, registered dual in-line very low profile

190 SR

Contextual Info: 1GB, 2GB, 4GB x72, ECC, SR 240-Pin DDR3 RDIMM Features DDR3 SDRAM RDIMM MT9JSF12872PZ – 1GB MT9JSF25672PZ – 2GB MT9JSF51272PZ – 4GB Features Figure 1: 240-Pin RDIMM (MO-269 R/C A – PCB 0692) • DDR3 functionality and operations supported as defined in the component data sheet

MT41J256M8

Abstract: micron ddr3 pcb design considerations MT8JTF25664AZ-1G4M1 MO-269 UDIMM thermal resistance 240 pin DIMM DDR3 signal assignments height sensor MICRON ddr3 udimm jedec package MO-269 240 unbuffered DDR3 DDR3 udimm jedec
Contextual Info: 1GB, 2GB x64, SR 240-Pin DDR3 SDRAM UDIMM Features DDR3 SDRAM UDIMM MT8JTF12864AZ – 1GB MT8JTF25664AZ – 2GB Features Figure 1: 240-Pin UDIMM (MO-269 R/C A) • DDR3 functionality and operations supported as defined in the component data sheet • 240-pin, unbuffered dual in-line memory module

Contextual Info: 240pin Load Reduced DDR3 L SDRAM DIMM DDR3(L) SDRAM Load Reduced DIMM Based on 4Gb A-die HMT84GL7AMR4A HMT84GL7AMR4C *SK hynix reserves the right to change products or specifications without notice. Rev. 0.1 / Mar. 2013 1 Revision History Revision No. History

Contextual Info: 240pin DDR3 SDRAM Unbuffered DIMM DDR3 SDRAM Unbuffered DIMMs Based on 4Gb B-Die HMT451U6BFR8C HMT451U7BFR8C HMT41GU6BFR8C HMT41GU7BFR8C *SK hynix reserves the right to change products or specifications without notice. Rev. 1.0 /Nov. 2013 1 Revision History

SLG8SP553V

Abstract: KB926 LA4101P SP8K10 LM 4863 D FBMA-L11-201209-221LMA30T 4101p ich9 JMB385 compal notebook schematics
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_GM+ICH9-M core logic 3 3 2008-01-01 4 4 Compal Secret Data Security Classification 2007/08/28 Issued Date 2006/03/10 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

MOSFET 2301

Abstract: cxd9872 cxd9872k a6019 ah41 cps ec nvs mbx149 MMC2301 a6806 TX39D80VC1GAA transistor c1093
Contextual Info: M C N 5 4 3 2 1 Schematics Page Index Title / Revision / Change Date B Date 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 1215 Page

AC82PM45

Abstract: AC82GM45 KB926 AF82801IBM SLB8Q N10M-GE1-S G545A1 NV10M-GS tps51620 LA-5081P KIWA7
Contextual Info: A B C D E 1 1 KIWA7/A8 2 2 Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_GM/PM+ICH9-M core logic 3 3 REV:0.4 4 4 Issued Date Compal Electronics, Inc. Compal Secret Data Security Classification 2008/03/25 Deciphered Date 2008/04/ Title THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

LA-4082P

Abstract: G6179 XDR 1 NVIDIA schematics kb926 tps51125 Compal Electronics la-6121P Montevina compal notebook schematics FBMA-L11-201209-221LMA30T TPS2231
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_PM+ICH9-M core logic 3 3 LA-4082P Vader Discrete NB9P-GS,NB9M-GE 2009-01-07 Rev 1.0_2F 4 4 2006/02/13 Issued Date Compal Electronics, Inc. Compal Secret Data

JBK00 LA4092P

Abstract: LA-4092P JBK00 KB926 tps51125 JBK00 LA4092P 1.0 FBMA-L11-201209-221LMA30T kb926qf RT8204 LA-4111P
Contextual Info: A B C D E 1 1 Compal confidential 2 2 JBK00 LA-4092P Schematics Document Mobile AMD S1G2 CPU with ATI RX781 & SB700 core logic with M82-S 3 3 2008-02-20 REV:0.4 4 4 Compal Secret Data Security Classification 2007/08/02 Issued Date 2008/08/02 Deciphered Date

NS692405

Abstract: KB926 tps51125 KB926 sequence LA-4102p FBMA-L11-201209-221LMA30T kb926qf SLG8SP553 compal HP Keyboard KB 0316
Contextual Info: A B C D E 1 1 Compal confidential Schematics Document Mobile Penryn uFCPGA with Intel Cantiga_PM+ICH9-M core logic 2 2 2008-02-25 3 3 www.kythuatvitinh.com 4 4 Compal Secret Data Security Classification 2008/02/25 Issued Date 2008/02/25 Deciphered Date Title

LA-4111p

Abstract: ENE KB 926 fcbga528 KB926 88e8042 Compal Electronics tps51125 compal PC319 9H03200413
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile AMD S1G2 CPU with ATI RS780M NB & SB700(SB) core logic 3 3 2008-03-07 REV:0.4 4 4 Compal Secret Data Security Classification 2007/08/02 Issued Date 2008/08/02 Deciphered Date Title Compal Electronics, Inc.

Contextual Info: Low Mating Force PC connector 3 row contact arrangements Number of Contacts PC Number* A Max. B C Max. 030 033 036 039 042 045 048 051 054 057 060 063 066 069 072 075 078 081 084 087 090 093 096 099 102 105 108 111 114 117 120 123 126 129 132 135 138 141 144