NX5P1000E Search Results
NX5P1000E Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| NX5P1000E |
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WLCSP12: wafer level chip-scale package; 12 bumps | Original |
NX5P1000E Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch Backside coating included A E NX5P1000E NX5P3001/NX18P3001 B A2 ball A1 index area A D A1 detail X e1 e C Øv Øw b C A B C y D e C e2 1/2 e B A ball A1 |
Original |
WLCSP12: NX5P1000E NX5P3001/NX18P3001 wlcsp12 NX5P100005 |