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    NX5P1000E Search Results

    NX5P1000E Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    NX5P1000E NXP Semiconductors WLCSP12: wafer level chip-scale package; 12 bumps Original PDF

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    Abstract: No abstract text available
    Text: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch Backside coating included A E NX5P1000E NX5P3001/NX18P3001 B A2 ball A1 index area A D A1 detail X e1 e C Øv Øw b C A B C y D e C e2 1/2 e B A ball A1


    Original     		PDF WLCSP12: NX5P1000E NX5P3001/NX18P3001 wlcsp12 NX5P100005