MC10LVEP16 Search Results

D1875

Abstract: HVP16 KVP16 LVEL16 MC100LVEP16 MC10LVEP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

MAX9321ESA

Contextual Info: 19-2152; Rev 0; 8/01 Differential LVPECL/LVECL/HSTL Receiver/Drivers Features ♦ Improved Second Source of the MC10LVEP16 MAX9321 Both devices are offered in space-saving 8-pin SOT23 and industry-standard SO and TSSOP packages. ♦ Available in Thermally Enhanced Exposed-Pad

MAX9321ESA

Abstract: MAX9321 MAX9321A MAX9321AEKA-T MAX9321AESA MAX9321AEUA MAX9321EKA-T MAX9321EUA MC10LVEP16
Contextual Info: 19-2152; Rev 2; 11/02 Differential LVPECL/LVECL/HSTL Receiver/Drivers Features ♦ Improved Second Source of the MC10LVEP16 MAX9321 Both devices are offered in space-saving 8-pin SOT23, SO, and µMAX packages. ♦ Available in Thermally Enhanced Exposed-Pad

MAX9321ESA

Contextual Info: 19-2152; Rev 2; 11/02 Differential LVPECL/LVECL/HSTL Receiver/Drivers Features ♦ Improved Second Source of the MC10LVEP16 MAX9321 The MAX9321/MAX9321A feature ultra-low propagation delay (172ps) and part-to-part skew (20ps) with 24mA maximum supply current, making these devices ideal

100LVEP16

Abstract: KVP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

HVP16

Abstract: KVP16 LVEL16 MC100LVEP16 MC10LVEP16 2015 soic8
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver Description MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 8 1 TSSOP−8 DT SUFFIX CASE 948R • 240 ps Propagation Delay • Maximum Frequency > 4 GHz Typical • PECL Mode Operating Range: VCC = 2.375 V to 3.8 V

MAX9321ESA

Contextual Info: 19-2152; Rev 0; 8/01 Differential LVPECL/LVECL/HSTL Receiver/Drivers Features ♦ Improved Second Source of the MC10LVEP16 MAX9321 Both devices are offered in space-saving 8-pin SOT23 and industry-standard SO and TSSOP packages. ♦ Available in Thermally Enhanced Exposed-Pad

HVP16

Abstract: KVP16 LVEL16 MC100LVEP16 MC10LVEP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

HVP16

Abstract: KVP16 LVEL16 MC100LVEP16 MC10LVEP16 marking code 5y
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver Description MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 8 1 8 HVP16 AYWWXG G 8 1 Features TSSOP−8 DT SUFFIX CASE 948R • 240 ps Propagation Delay • Maximum Frequency > 4 GHz Typical

Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver • 240 ps Propagation Delay • Maximum Frequency > 4 GHz Typical • PECL Mode Operating Range: VCC = 2.375 V to 3.8 V MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 8 1 8 HVP16 AYWWXG

Contextual Info: MC10LVEP16 Product Preview Differential Receiver The MC10LVEP16 is a differential receiver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16 and LVEL16, the LVEP16 is ideally suited for interfacing with high frequency and

HVP16

Abstract: KVP16 LVEL16 MC100LVEP16 MC10LVEP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3V ECL Differential Receiver/Driver Description MARKING DIAGRAMS* 8 8 1 SOIC−8 D SUFFIX CASE 751 8 1 TSSOP−8 DT SUFFIX CASE 948R • 240 ps Propagation Delay • Maximum Frequency > 4 GHz Typical • PECL Mode Operating Range: VCC = 2.375 V to 3.8 V

KVP16

Abstract: HVP16 LVEL16 MC100LVEP16 MC10LVEP16
Contextual Info: MC10LVEP16, MC100LVEP16 2.5V / 3.3VĄECL Differential Receiver/Driver The MC10/100LVEP16 is a world class differential receiver/driver. The device is functionally equivalent to the EL16, EP16 and LVEL16 devices. With output transition times significantly faster than the EL16

MAX9321ESA

Abstract: MAX9321 MAX9321A MAX9321AEKA-T MAX9321AESA MAX9321AEUA MAX9321EKA-T MAX9321EUA MC10LVEP16
Contextual Info: 19-2152; Rev 1; 7/02 Differential LVPECL/LVECL/HSTL Receiver/Drivers Features ♦ Improved Second Source of the MC10LVEP16 MAX9321 Both devices are offered in space-saving 8-pin SOT23 and industry-standard SO and TSSOP packages. ♦ Available in Thermally Enhanced Exposed-Pad

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16 100H646
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and

CML ECL termination

Abstract: MC100EP16 MC100EP16F MC100EP16VS MC100EP16VT MC100LVEP16 MC10EP16 MC10EP16T MC10LVEP16 NBSG16
Contextual Info: SGD508/D Jan-2002 Rev 0 1 to 12 GHz Differential Receiver/Drivers Bandwidth GHz Gain Input Termination (50Ω) Open Input Default State (D, D) Input Level Output Level Output Enable LOW, HIGH ECL, CMOS, CML, LVDS RSECL(3) No 1 FCBGA 16 Yes(1) LOW, HIGH ECL, CMOS,

CS5170

Abstract: mps2112 MPS2112ZL1 100A 300V IGBT MC3346P CS4124YDW16 ON Semiconductor PRICE BOOK 12V to 220V smps inverter bd234 igbt ac motor speed control
Contextual Info: SGD501/D REV 8, January 5, 2002 NORTH AMERICA SALES AND DISTRIBUTION ON Semiconductor PRICE BOOK THIS BOOK IS IN COMPUTER SORT PRODUCT CLASSIFICATION – Please see General Information Section EFFECTIVE DATE: JANUARY 5, 2002 General Information Elimination Of Ozone Depleting Chemicals . . . .

KLT20

Abstract: k1648 klt22 KEL32 MC100 HEP64 KLT21 LP17 KEP32 HEP139
Contextual Info: AND8002/D ECLinPS, ECLinPS Lite, ECLinPS Plus, ECLinPS MAX, and GigaComm Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and

3335

Abstract: MC100EL91 MC100EPT25 MC100LVEP16 MC10LVEP16
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and

motorola HEP cross reference

Abstract: EPT 4045 KPT23 motorola HEP 320 cross reference vef 202 manual KEP52 MC10EP016 HEP 801 hep51 HEP64
Contextual Info: BR1513/D Rev. 2, Apr-2001 ECLinPS Plus Device Data ECLinPS Plus Device Data Advanced ECL in Picoseconds BR1513/D Rev. 2, Apr–2001  SCILLC, 2001 Previous Edition  2000 “All Rights Reserved” ECLinPS, ECLinPS Lite, and ECLinPS Plus are trademarks of Semiconductor Components Industries, LLC.

kvt22

Abstract: KVL11 KPT23 ON Semiconductor marking k1648 KLT20 HEL16 KEL32 KEL01 xaa9646
Contextual Info: AND8002/D ECLinPS, ECLinPS Lite and ECLinPS Plus Device Type and Date Code Marking Guide Gary Richards, ECL Logic Product Engineering http://onsemi.com APPLICATION NOTE need ON Semiconductor’s marking spec 12MON00232D and S.O.P. 7–19 ID of Products to Location of

SC64046

Abstract: SC64046FNG SC64046FN SC64029FN SB99026MNG SB99026MNR2G MC100EP016A sb99026mn SC6404 MC100EP101
Contextual Info: EO1_LISTED_PART_ID MC100ELT23D MC100ELT23DG MC100ELT23DR2 MC100ELT23DR2G MC100ELT23DT MC100ELT23DTG MC100ELT23DTR2 MC100ELT23DTR2G MC100H600FN MC100H600FNG MC100H600FNR2 MC100H600FNR2G MC100H601FN MC100H601FNG MC100H601FNR2 MC100H601FNR2G MC100H602FN MC100H602FNG

MC100EL91

Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16
Contextual Info: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and