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    BGA PROFILING

    Abstract: fine BGA thermal profile M21131 hot air bga M21151 M21161 M21141G reflow hot air BGA M21136 M21151V
    Text: 211xx-APP-002-A April 2006 SMT BGA Ball Grid Array Eutectic Solder Balls Application Note Products Affected: M21131, M21131V, M21136, M21141G4, M21141G5, M21151, M21151V, M21156, M21161G4, M21161G5 Introduction The objective of this application note is to provide the basic SMT design and process requirements necessary to


    Original     		PDF 211xx-APP-002-A M21131, M21131V, M21136, M21141G4, M21141G5, M21151, M21151V, M21156, M21161G4, BGA PROFILING fine BGA thermal profile M21131 hot air bga M21151 M21161 M21141G reflow hot air BGA M21136 M21151V

    M21161G5

    Abstract: No abstract text available
    Text: 144x144 5.0 Gbps Crosspoint Switch with Amplif-Eye Signal Conditioning M21161G5 5.0 Gbps Performance as a Drop-inReplacement for the M21151, 3.2 Gbps and M21161G4, 4.25 Gbps 144x144 Crosspoint Switches The M21161G5, designed for today’s demanding SAN,


    Original     		PDF 144x144 M21161G5 M21151, M21161G4, M21161G5, M21161G4 21161G4-BRF-001-A M21161G5