IRFC2204B Search Results
IRFC2204B Datasheets Context Search
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Contextual Info: PD - 94770 IRFC2204B HEXFET Power MOSFET Die in Wafer Form N-CH D l l 100% Tested at Probe Available in Chip Pack, Unsawn Wafer Sawn on Film G 40V RDS on = 3.6mΩ (max.) 6" Wafer S Key Electrical Characteristics (Packaged Part)c Min. Typ. Max. Test Conditions |
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IRFC2204B |