IGC39T65T8M Search Results
IGC39T65T8M Price and Stock
Infineon Technologies AG IGC39T65T8MX1SA1- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC39T65T8MX1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IGC39T65T8MX1SA1 | Waffle Pack | 111 Weeks | 57 |
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IGC39T65T8M Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: IGC39T65T8M IGBT3 Chip Medium Power Features: • 650V Trench & Field Stop technology high short circuit capability, self limiting short circuit current positive temperature coefficient easy paralleling Qualified according to JEDEC for target |
Original |
IGC39T65T8M L7572M, | |
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Contextual Info: IGC39T65T8M IGBT3 Chip Medium Power Features: • 650V Trench & Field Stop technology high short circuit capability, self limiting short circuit current positive temperature coefficient easy paralleling Qualified according to JEDEC for target |
Original |
IGC39T65T8M IEC62258-3 L7572M, |