IGC193T120T8RM Search Results
IGC193T120T8RM Price and Stock
Infineon Technologies AG IGC193T120T8RMX1SA1IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC193T120T8RMX1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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IGC193T120T8RMX1SA1 | Waffle Pack | 20 Weeks | 1,089 |
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IGC193T120T8RMX1SA1 | 21 Weeks | 1 |
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IGC193T120T8RM Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: IGC193T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling Qualified according to JEDEC for target applications Chip Type |
Original |
IGC193T120T8RM IGC193T120T8RM L7713U, L7713O, | |
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Contextual Info: IGC193T120T8RM IGBT4 Medium Power Chip Features: • 1200V Trench & Field stop technology low switching losses soft turn off positive temperature coefficient easy paralleling Qualified according to JEDEC for target applications Chip Type |
Original |
IGC193T120T8RM IGC193T120T8RM L7713U, L7713O, | |
ff600r12me4
Abstract: ff600r12me ff600r12me4_b11
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Original |
IGC193T120T8RM IGC193T120T8RM IEC62258-3: L7713U, L7713O, ff600r12me4 ff600r12me ff600r12me4_b11 |