IDT7M7005 Search Results

Contextual Info: ggrx SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 16/32K x 16 CMOS SRAM/EEPROM MODULE î*o \dt Integrated Dev ice Technology» Inc. PRELIMINARY IDT7M7005 FEATURES: DESCRIPTION: • High-density CMOS module with SRAM and EEPROM memory on-board • Member of the Subsystems "Flexi-Pak" Family of

ce 2826

Contextual Info: INTEGRATED 47E D DE VIC E Integrated Device Technology, Inc. • MÔ2S771 G0102S4 SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 16/32K x 16 CMOS SRAM/EEPROM MODULE T ■ IDT PRELIMINARY IDT7M7005 FEATURES: DESCRIPTION: • T h e ID T 7 M 70 05 is a high-speed, high-density C M O S

Contextual Info: SUBSYSTEMS “FLEXI-PAK ” FAMILY Integrated Device Technology, Inc. PRELIMINARY IDT7M7005 32K X 16/32K x 16 CMOS SRAM/EEPROM MODULE FEATURES: DESCRIPTION: • The IDT7M 7005 is a high-speed, high-density CMOS module with both SRAM & EEPROM memory on-board. It is

32KX8

Contextual Info: P'S dt) Integrated Devi ce Technology» Inc. SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 1 6/32K x 1 6 CMOS SRAM/EEPROM MODULE PRELIMINARY IDT7M7005 FEATURES: DESCRIPTION: • High-density CMOS module with SRAM and EEPROM memory on-board • M em ber of the S u b syste m s "F le xi-P a k” Fam ily of

128k x 8 eeprom

Abstract: 64k x 8 64k x 8 sram
Contextual Info: GENERAL INFORMATION THE SUBSYSTEM'S “FLEXI-PAK ” CMOS MODULE FAMILY Integrated Device Technology, Inc. SRAM, EPROM, & EEPROM MODULES FEATURES: DESCRIPTION: • High-density modules using high-speed CMOS SRAM, EPROM, and EEPROM components. • Inter-changeable modules, with equivalent footprints,

ce 2826 ic

Abstract: E723 ce 2826
Contextual Info: SUBSYSTEMS “FLEXI-PAK ” FAMILY 32K x 16/32K x 16 CMOS SRAM/EEPROM MODULE y Integrated Devlc e Technology, Inc. DESCRIPTION: FEATURES: • H igh -density C M O S m odu le w ith S R A M an d E E P R O M m em ory on -board • • M e m b e r of th e T h e ID T 7 M 7 0 0 5 is a hig h -s p e e d , high-density C M O S

Contextual Info: I N T E G R A T E » DE VI CE 3ÔE D • M Ö 2 S 7 7 1 O D G S I S M 1 ■ IDT THE SU B SY ST EM 'S “FLEXI-PAK ” CM O S MODULE FAMILY Integrated Device Technology, Inc. GENERAL INFORMATION SRAM, EPROM, & EEPROM MODULES \ Ol FEATURES: DESCRIPTION: • High-density modules using high-speed C M O S SRAM,