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    HF30A060ACB Search Results

    HF30A060ACB Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    HF30A060ACB International Rectifier HF30A060ACB Hexfred Die in Wafer Form Original PDF

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    HFA15TB60

    Abstract: HF30A060ACB
    Text: Previous Datasheet Index Next Data Sheet PD-2.500 TARGET HF30A060ACB HF30A060ACB Hexfred Die in Wafer Form 600 V Size 30 4" Wafer Electrical Characteristics Wafer Form Parameter Description VFM Forward Voltage BVR Reverse Breakdown Voltage IRM Reverse Leakage Current


    Original     		PDF HF30A060ACB HF30A060ACB HFA15TB60 HFA15TB60

    HFA15TB60

    Abstract: HF30A060ACB
    Text: PD-2.500 TARGET HF30A060ACB HF30A060ACB Hexfred Die in Wafer Form 600 V Size 30 4" Wafer Electrical Characteristics Wafer Form Parameter Description VFM Forward Voltage BVR Reverse Breakdown Voltage IRM Reverse Leakage Current Guaranteed (Min/Max) 1.8V Max.


    Original     		PDF HF30A060ACB HF30A060ACB HFA15TB60 HFA15TB60

    SCR gate drive circuit

    Abstract: an 80771 IN1190 IN1190A IN1190A diode 20509 Diode 31DQ HFA25TB60 SD400N IR 31DQ 03
    Text: Revised 8/27/98 www.irf.com Rectifiers / Thyristors Catalog of Availble Documents IR ProCenter Fax-On-Demand 310 252-7100 Standard Recovery Diodes Description Datasheets 1N1183 - IN1190 Series 1N1183A - IN1190A Series 1N1199A - 1N1206A Series 1N2054 thru 1N2068 Series


    Original     		PDF 1N1183 IN1190 1N1183A IN1190A 1N1199A 1N1206A 1N2054 1N2068 1N3085 -1N3092 SCR gate drive circuit an 80771 IN1190A diode 20509 Diode 31DQ HFA25TB60 SD400N IR 31DQ 03

    Untitled

    Abstract: No abstract text available
    Text: International IQR Rectifier PD‘2500 H F30A 060A C B TARGET HF30A060ACB Hexfred Die in Wafer Form 600 V Size 30 4" Wafer Electrical Characteristics Wafer Form Param eter V fm BV r I RM Description Guaranteed (Min/Max) Forward Voltage Test Conditions 1.8V Max.


    OCR Scan     		PDF HF30A060ACB 250pA 100mm,

    HF30A060ACD

    Abstract: HF06A060ACB
    Text: International Iö R Rectifier Wafer Part Die Part Number Number HEXFRED Die A' Bond Pad 'B' Anode Length/Side Length/Side Metalization in. mm (in.) mm Tray (top side) Quantity HF30A060ACB HF30A060ACD <0.115x0.155) 2.92x3.94 (0.064x0.104) 1 63x2.64 AI


    OCR Scan     		PDF HF30A060ACB HF40A060ACB HF40C HF50C120ACB HF06A060ACB HF20A060ACB HF30A060ACD HF40A060ACD HF20CI20ACD HF30C120ACD

    HF10A060ACD

    Abstract: HFA08TB60 equivalent HFA16TA120C HFA16TA60C equivalent HFA04TB60 equivalent hfa06tb120 HF30A060ACD HF06A060ACB HFA30PA60C
    Text: I n t e r n a t i o n a l R e c t if ie r F w t l II HEXFRED 1 <2) Wafer Part Number (3) Di* Part Number Bond Pad ‘C X O’ Unjth/SIb* (ln.)mm Anod* MetaSzation (topskk) Tray Quantity Equivalent fin is M Product Di* S in DhAXB'Langth/Skb (iajmm 6 (0.066x0.066)1.68x1.68


    OCR Scan     		PDF HF06A060ACB 066x0 037x0 HFA04TB60 HFA08TA60C HFA08PB60 HFA08TB60 HFA16PA60C HFA16TA60C HFA15PB60 HF10A060ACD HFA08TB60 equivalent HFA16TA120C HFA16TA60C equivalent HFA04TB60 equivalent hfa06tb120 HF30A060ACD HFA30PA60C