NAND FLASH BGA
Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
Text: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction
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FBGA69)
IR250
NAND FLASH BGA
BGA NAND Flash
BGA PACKAGE thermal profile
BGA-56P-M01
MCP NAND
FBGA56
FBGA69
32M X 32 MEMORY
FLASH BGA
FBGA71
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M02142
Abstract: CSOP-48 BGA672 CS36 J-STD-020A ultrasonic full bridge cleaning S02-1 FD-FBGA-60 FBGA-304 tsop-48 flash
Text: Package Mounting Methods Mounting Methods/Reliability/Storage 1. Mounting Methods 2. Surface Mounted Plastic Package Reliability 3. Storage DB81-10004-2E 1 Package Mounting Methods (Mounting Methods/Reliability/Storage) 1. Mounting Methods PACKAGE 1. Mounting Methods
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DB81-10004-2E
M02142
CSOP-48
BGA672
CS36
J-STD-020A
ultrasonic full bridge cleaning
S02-1
FD-FBGA-60
FBGA-304
tsop-48 flash
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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Untitled
Abstract: No abstract text available
Text: P-FBGA73-091E-0.80AZ Uniti nn Jan,2004
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P-FBGA73-091E-0
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Abstract: No abstract text available
Text: P—FBGA73—0912—0.80AZ Unit' nn 0 — 1. 40MAX rp rg o i 0. 33±0. 05 C II ^ nrroi, . ID. 8 0 I oooicboo DOOOOOOCD 0000|000 0 o_o_o o_oio o_o_o : o o o o o jo o o o 'o oooooooo OOOO'OOOO Q OOolo OO o\ I ©0 \lN D E X I a. 1 2 3 4 5 6 7 8 9 1 0 a J Jan.2004
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Untitled
Abstract: No abstract text available
Text: P—FBGA73—0912—0.80BZ
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P-FBGA73-0912-0
80BZP-FBGA73-0912-0
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Untitled
Abstract: No abstract text available
Text: P—FBGA73—101E—0.80AZ Uniti nn Jan,2004
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P-FBGA73-1012-0
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Abstract: No abstract text available
Text: P—FBGA73—091E—0.80DZ Uniti nn Feb.2004
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P-FBGA73-091E-0
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Abstract: No abstract text available
Text: P—FBGA73—0912—0.80BZ Unit' nn m— ^ 1. 40MAX ID. 80 I n rw i,. 0. 33±0. 05 o II oooicboo CD DOOOOOOCD 0000|000 0 o_o_o o_oio o_o_o : o o o o o jo o o o 'o oooooooo OOOO'OOOO Q O O olo O O o \\ l N D E X II ©0 a. 1 2 3 4 5 J 6 7 8 9 1 0 a Jan.2004
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Untitled
Abstract: No abstract text available
Text: P—FBGA73—091E—0.80BZ Uniti nn Jan,2004
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P-FBGA73-091E-0
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