DS5461 Search Results

MF446

Contextual Info: MF446 High-Performance PIN DS5461 ISSUE 1 May 2001 Ordering Information MF446 MF446 MF446 MF446 MF446 MF446 13514.11 TO-46 Package 15062.11 ST Housing 13743.11 SMA Housing 13741.11 FC Housing 15268.11 SC Housing 15050.11 Pig-Tail including 1m of 62.5/125 µ m multi-mode fibre

bi-directional switches IGBT

Abstract: DIM800FSM17-A000 mj 340
Contextual Info: DIM800FSM17-A000 DIM800FSM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5461-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5461-3.1 July 2002

MF446

Contextual Info: MF446 High-Performance PIN DS5461 ISSUE 1 May 2001 Ordering Information MF446 MF446 MF446 MF446 MF446 MF446 13514.11 TO-46 Package 15062.11 ST Housing 13743.11 SMA Housing 13741.11 FC Housing 15268.11 SC Housing 15050.11 Pig-Tail including 1m of 62.5/125 µ m multi-mode fibre

MF446

Contextual Info: MF446 High-Performance PIN DS5461 ISSUE 1 May 2001 Ordering Information MF446 MF446 MF446 MF446 MF446 MF446 13514.11 TO-46 Package 15062.11 ST Housing 13743.11 SMA Housing 13741.11 FC Housing 15268.11 SC Housing 15050.11 Pig-Tail including 1m of 62.5/125 µ m multi-mode fibre

DIM800FSM17-A000

Abstract: LIN26325
Contextual Info: DIM800FSM17-A000 Single Switch IGBT Module DS5461-3.2 August 2008 LIN26325 FEATURES 10µs Short Circuit Withstand Non Punch Through Silicon Isolated AlSiC Base with AIN Substrates Lead Free Construction High Thermal Cycling Capability KEY PARAMETERS VCES

preamplifier st

Abstract: MF446
Contextual Info: MF446 High-Performance PIN DS5461 ISSUE 1 May 2001 Ordering Information MF446 MF446 MF446 MF446 MF446 MF446 13514.11 TO-46 Package 15062.11 ST Housing 13743.11 SMA Housing 13741.11 FC Housing 15268.11 SC Housing 15050.11 Pig-Tail including 1m of 62.5/125 µ m multi-mode fibre

DIM800FSM17-A000

Contextual Info: DIM800FSM17-A000 DIM800FSM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5461-2.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5461-3.1 July 2002

DIM800FSM17-A000

Contextual Info: DIM800FSM17-A000 DIM800FSM17-A000 Single Switch IGBT Module Preliminary Information Replaces May 2001, version DS5461-1.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates

Contextual Info: DIM800FSM17-A000 Single Switch IGBT Module Replaces DS5461-3.2 DS5461-4 November 2010 LN27717 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)

Contextual Info: MF446 High-Performance PIN DS5461 ISSUE 1 May 2001 Ordering Information MF446 MF446 MF446 MF446 MF446 MF446 13514.11 TO-46 Package 15062.11 ST Housing 13743.11 SMA Housing 13741.11 FC Housing 15268.11 SC Housing 15050.11 Pig-Tail including 1m of 62.5/125 µ m multi-mode fibre

Contextual Info: MF446 High-Performance PIN DS5461 ISSUE 1 May 2001 Ordering Information MF446 MF446 MF446 MF446 MF446 MF446 13514.11 TO-46 Package 15062.11 ST Housing 13743.11 SMA Housing 13741.11 FC Housing 15268.11 SC Housing 15050.11 Pig-Tail including 1m of 62.5/125 µ m multi-mode fibre

Contextual Info: MF446 High-Performance PIN DS5461 ISSUE 1 May 2001 Ordering Information MF446 MF446 MF446 MF446 MF446 MF446 13514.11 TO-46 Package 15062.11 ST Housing 13743.11 SMA Housing 13741.11 FC Housing 15268.11 SC Housing 15050.11 Pig-Tail including 1m of 62.5/125 µ m multi-mode fibre

DS5461-1

Contextual Info: DIM800FSM17-A000 DIM800FSM17-A000 Single Switch IGBT Module Preliminary Information DS5461-1.0 May 2001 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS

DIM800FSM17-A000

Abstract: DIM800FSM17-A
Contextual Info: DIM800FSM17-A000 Single Switch IGBT Module Replaces DS5461-3.2 DS5461-4 November 2010 LN27717 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)