CMLD2838 Search Results
CMLD2838 Datasheets (3)
Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
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CMLD2838 |
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SURFACE MOUNT PICOmini DUAL PAIR, SILICON SWITCHING DIODES | Original | |||
CMLD2838 BK |
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DIODE | Original | |||
CMLD2838 TR |
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DIODE | Original |
CMLD2838 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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CMLD2838Contextual Info: CMLD2838 SURFACE MOUNT DUAL PAIR, SILICON SWITCHING DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded PICOmini surface |
Original |
CMLD2838 CMLD2838 OT-563 100mA 18-January | |
Contextual Info: CMLD2838 SURFACE MOUNT DUAL PAIR, SILICON SWITCHING DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded PICOmini surface |
Original |
CMLD2838 CMLD2838 OT-563 100mA 18-January | |
CMLD2838Contextual Info: Central CMLD2838 TM Semiconductor Corp. SURFACE MOUNT PICOmini DUAL PAIR, SILICON SWITCHING DIODES DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy |
Original |
CMLD2838 OT-563 100mA 22-March CMLD2838 | |
Contextual Info: CMLD2838 SURFACE MOUNT SILICON DUAL PAIR SWITCHING DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded SOT-563 surface mount |
Original |
CMLD2838 CMLD2838 OT-563 100mA | |
CMLD2838Contextual Info: PROCESS CPD30V Central Dual Switching Diode TM Semiconductor Corp. Dual, Common Cathode, High Speed Switching Diode Chip PROCESS DETAILS Die Size 15.4 X 15.4 MILS Die Thickness 7.1 MILS Anode 1 Bonding Pad Area 5.9 X 5.9 X 8.3 MILS Anode 2 Bonding Pad Area |
Original |
CPD30V CMLD2838 28-September CMLD2838 | |
3SMC30A
Abstract: CMPZ4614 P6SMB56CA CMSD4448 sod-80 stabistor 882L CMOZ20V STB-400 3smc60ca CMZ5945B
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OD-923 OT-923 OT-953 OD-523 OT-523 OT-563 OD-323 OT-323 OT-363 OD-123 3SMC30A CMPZ4614 P6SMB56CA CMSD4448 sod-80 stabistor 882L CMOZ20V STB-400 3smc60ca CMZ5945B | |
BF244 datasheet
Abstract: 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910
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1N456 CPD64 1N456A. 1N457 1N457A. 1N458 BF244 datasheet 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910 | |
UJT 2n3904
Abstract: transistor 2N4033 ujt 2N6027 2n4209 datasheet mj15003 equivalent transistor 2N5401 mj15004 2N4393 MJ15003 MJ15004 BAV45
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Contextual Info: PROCESS CPD30V Dual Switching Diode Dual, Common Cathode, High Speed Switching Diode Chip PROCESS DETAILS Die Size 15.4 x 15.4 MILS Die Thickness 7.1 MILS Anode 1 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS Anode 2 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS Top Side Metalization |
Original |
CPD30V CMLD2838 29-April |