CHA5012 Search Results

CHA5012 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
CHA5012		United Monolithic Semiconductors	X Band Driver Amplifier		Original	PDF

CHA5012 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
CHA5012 Abstract: No abstract text available Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description Main Features The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including, via holes through	Original	PDF	CHA5012 CHA5012 DSCHA50126066
CHA5012 Abstract: No abstract text available Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including via holes through the substrate and air bridges. A nitride	Original	PDF	CHA5012 CHA5012 DSCHA50120179
Untitled Abstract: No abstract text available Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including via holes through the substrate and air bridges. A nitride	Original	PDF	CHA5012 CHA5012 DSCHA50120179
CHA5012 Abstract: No abstract text available Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including, via holes through	Original	PDF	CHA5012 CHA5012 DSCHA50126286
99-F Abstract: CHA5012-99F CHA5012 Text: CHA5012 X Band Driver Amplifier GaAs Monolithic Microwave IC Description The CHA5012 chip is a monolithic twostage medium power amplifier designed for X band applications. This device is manufactured using a GaInP HBT process, including, via holes through	Original	PDF	CHA5012 CHA5012 DSCHA50126286 99-F CHA5012-99F
PPH25X Abstract: No abstract text available Text: Contents Products . 3 Foundry open processes. 12 GaN current packaging solutions and demo boards. 14	Original	PDF