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    BGA29 Search Results

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    BGA29 Price and Stock

    Fischer Elektronik GmbH & Co KG ICK BGA 29 X 29 X 10

    Heatsink: extruded; black; L: 29mm; W: 29mm; H: 10mm; aluminium
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    TME ICK BGA 29 X 29 X 10 57 1
    • 1 $5.17
    • 10 $4.65
    • 100 $3.61
    • 1000 $3.61
    • 10000 $3.61
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    Fischer Elektronik GmbH & Co KG ICK BGA 29 X 29 X 6

    Heatsink: extruded; black; L: 29mm; W: 29mm; H: 6mm; aluminium
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME ICK BGA 29 X 29 X 6 5 1
    • 1 $5.03
    • 10 $4.49
    • 100 $3.49
    • 1000 $3.49
    • 10000 $3.49
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    TE Connectivity 85BSD-001BG-A2956

    PRESS XDCR;NISO;85BSD-001BG-A2
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Interstate Connecting Components 85BSD-001BG-A2956
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    Fischer Elektronik GmbH & Co KG ICK BGA 29X29X10

    Heat Sink Passive BGA ST SMD 18�C/W Aluminum (Alt: 10136488)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Abacus ICK BGA 29X29X10 13 Weeks 5
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    BGA29 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA292 NXP Semiconductors Footprint for reflow soldering Original PDF

    BGA29 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MD-001A

    Abstract: No abstract text available
    Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 FLGA424-C-1717 7.5 ns (at 1.8 V tolerance = ± 5%, 133 MHz)


    Original     		PDF MN103E010HRA, MN103E040HYB MN103E010HRA BGA292-P-2727 FLGA424-C-1717 16/24/32-bit 16-bit MD-001A

    JEDEC TRAY DIMENSIONS

    Abstract: tray container dimensions BGA package tray JEDEC tray standard dimensions 729-Pin tray bga TRAY CONTAINER JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm 4 x 9=36 135° C MAX. 31.60 29.23 31.10 252.8 315.0 322.6 Section A – A' 29.23 4.67 (6.35) 7.62 29.23 NEC 94.2 31.40 BGA29 × 29B A' 20.85 135.9 PPE A Applied Package 729-pin Plastic BGA (29×29) (Flip-chip type) Quantity (pcs)


    Original     		PDF BGA29 729-pin BGA29 SSD-A-H7796 JEDEC TRAY DIMENSIONS tray container dimensions BGA package tray JEDEC tray standard dimensions tray bga TRAY CONTAINER JEDEC tray standard

    0.3mm pitch BGA

    Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
    Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1


    Original     		PDF BGA292D 396mm 508mm 635mm FR4/G10 20X20 488mm SF-BGA292D-B-11 0.3mm pitch BGA micro pitch BGA 1mm pitch BGA BGA 20x20

    P-BGA-292

    Abstract: PBGA292
    Text: P-BGA292-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.


    Original     		PDF P-BGA292-2727-1 P-BGA-292 PBGA292

    C BGA292

    Abstract: BGA292 MS-034 BGA-292 sot881
    Text: Package outline Philips Semiconductors BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e ∅v ∅w b 1/2 e y1 C C A B C M M y Y W e V U T R P N M L e2 K J H 1/2 e G


    Original     		PDF BGA292: OT881-1 OT881-1 MS-034 C BGA292 BGA292 MS-034 BGA-292 sot881

    BGA-292

    Abstract: BGA292 C BGA292 MS-034
    Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K


    Original     		PDF BGA292: OT489-1 MS-034 BGA-292 BGA292 C BGA292 MS-034

    SF-BGA292A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA292A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA292A FR4/G10 SF-BGA292A-B-11

    SD2608

    Abstract: IEEE754 MN103E010HRA MN103E040HYB
    Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free


    Original     		PDF MN103E010HRA, MN103E040HYB MN103E010HRA BGA292-P-2727 FLGA424-C-1717 16/24/32-bit SD2608 IEEE754 MN103E010HRA MN103E040HYB

    PRBG0297FA-A

    Abstract: P-BGA297-23x23-1
    Text: JEITA Package Code P-BGA297-23x23-1.00 RENESAS Code PRBG0297FA-A B D1 D Previous Code 297F7X-A MASS[Typ.] 1.7g A A ZD b S AB e ZE AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21


    Original     		PDF P-BGA297-23x23-1 PRBG0297FA-A 297F7X-A PRBG0297FA-A

    sd2608

    Abstract: 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus
    Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free


    Original     		PDF MN103E010HRA, MN103E040HYB MN103E010HRA BGA292-P-2727 FLGA424-C-1717 16/24/32-bit PC-9801 sd2608 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus

    jedec bga tray

    Abstract: 784-pin 12Surface tray bga BGA package tray
    Text: TRAY CONTAINER 94.2 7 29.45 31.60 31.10 135°C MAX. 29.45 A' 20.85 A BGA29 x 29ESP 31.40 135.9 PPE 4 × 9=36 UNIT : mm 252.8 315.0 322.6 SECTION A – A' 29.45 (6.08) (6.35) 7.62 29.00 Applied Package Quantity (pcs) 272-pin Plastic BGA (29×29) (CAVITY DOWN ADVANCED TYPE)


    Original     		PDF BGA29 29ESP 272-pin 729-pin 784-pin BGA29 SSD-A-H6977-2 jedec bga tray 12Surface tray bga BGA package tray

    SF-BGA296A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA296A 26.67mm [1.050"] C 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] X 26.67mm [1.050"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA296A FR4/G10 SF-BGA296A-B-11

    MO-151

    Abstract: BGA292 transistor t 04 27 C BGA292
    Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K


    Original     		PDF BGA292: OT489-1 MO-151 MO-151 BGA292 transistor t 04 27 C BGA292

    BGA292

    Abstract: SF-BGA292B-B-11
    Text: D Package Code: BGA292B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]


    Original     		PDF BGA292B FR4/G10 SF-BGA292B-B-11 BGA292

    BGA292

    Abstract: BGA-292
    Text: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1


    Original     		PDF BGA292: OT489-1 BGA292 BGA-292

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x


    Original     		PDF BGA292: OT489-1 MS-034

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V W T P M K H F D B ∅v ∅w b 1/2 e e U R N L e2 J 1/2 e G E C A shape optional 4x 1 2 3 4 5


    Original     		PDF BGA292: OT881-1 MS-034

    VDD18

    Abstract: CLK48
    Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free


    Original     		PDF MN103E010HRA, MN103E040HYB MN103E010HRA BGA292-P-2727 FLGA424-C-1717 16/24/32-bit 16-bit timerSA27 VDD33 VDD18 CLK48

    SAMSUNG MCP

    Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
    Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)


    Original     		PDF KBB0xB400M 16Mx16) 4Mx16) 80-Ball 80x12 SAMSUNG MCP ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor

    Untitled

    Abstract: No abstract text available
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


    Original     		PDF K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX

    BGA292

    Abstract: RGMII to SGMII RJ45 1000M PHY
    Text: DP83864 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer Literature Number: SNLS172B September 2003 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer General Description Features bs ol e te The DP83864 is an extremely efficient full featured Quad • IEEE compliant 10BASE-T,100BASE-TX, 1000BASE-T


    Original     		PDF DP83864 DP83864 SNLS172B 10BASE-T 100BASE-TX, 1000BASE-T 10BASE-T, BGA292 RGMII to SGMII RJ45 1000M PHY

    Nexus S JTAG pins

    Abstract: mPC5746m Nexus S camera
    Text: Freescale Semiconductor Application Note Document Number: AN4566 Rev 1, 05/2013 MPC5746M Hardware Design Guide by: Martin Vaupel and David McMenamin Contents 1 Introduction 1 The MPC5746M is a multi-core 32-bit microcontroller


    Original     		PDF AN4566 MPC5746M 32-bit e200z4 200MHz. Nexus S JTAG pins Nexus S camera

    Untitled

    Abstract: No abstract text available
    Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10


    Original     		PDF MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316

    A4H1

    Abstract: HD6417750RBG240 264-PIN BSC COMPUTER SCIENCE digital logic design Notes Transistor mcr 22-8 413 REJ10B0210-0400 A5H1 zo 607 HD6417750RBP240V Tag 225 600 replacement
    Text: REJ09B0366-0700 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. SH7750, SH7750S, SH7750R Group 32


    Original     		PDF REJ09B0366-0700 SH7750, SH7750S, SH7750R 32-Bit Family/SH7750 A4H1 HD6417750RBG240 264-PIN BSC COMPUTER SCIENCE digital logic design Notes Transistor mcr 22-8 413 REJ10B0210-0400 A5H1 zo 607 HD6417750RBP240V Tag 225 600 replacement