MIL-STD-202 METHOD 301
Abstract: MIL-STD-1344, Method 3001
Text: _! CONTECH RESEARCH, INC, -~ -iiv - - - - - MAY 16, 1389 TEST REPORT 89189 VERIFICATION TESTISG PART NUMBER: SS-120-T-2N SPECIFICATION: AJCO88 SAMTEC CORPORATICN 67 MECHANIC STREET AITLEBORO, MASSACHUSEllS 02703 SO8/ 226-4800 MAY 16, 1989 TEST REPORT #89189
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Original
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ii89189
SS-120-T-2N
AJCO88
MOO88
an500
97OOFS8892)
i330AccLlracv
MIL-STD-202 METHOD 301
MIL-STD-1344, Method 3001
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Untitled
Abstract: No abstract text available
Text: V40100G, VI40100G www.vishay.com Vishay General Semiconductor Dual High-Voltage Trench MOS Barrier Schottky Rectifier Ultra Low VF = 0.42 V at IF = 5 A FEATURES TMBS • Trench MOS Schottky technology TO-262AA TO-220AB • Low forward voltage drop, low power losses
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V40100G,
VI40100G
O-262AA
O-220AB
22-B106
V40100G
AEC-Q101
2011/65/EU
2002/95/EC.
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bh 26 00
Abstract: DH80102 BH-2003 BH301 80204 89129 R/BH-202
Text: SILICON PIN AND NIP DIODES FOR SWITCHING AND PHASE SHIFTING APPLICATIONS MEDIUM AND HIGH POWER This series of high power, high voltage PIN and NIP diodes incorporates ceramic-glass passivated mesa technology. A broad range of products is available, In terms of breakdown voltages, junction
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Resistan00
TD037
bh 26 00
DH80102
BH-2003
BH301
80204
89129
R/BH-202
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fad27
Abstract: FAD47 FRQ01 FAD21 FAD30 FAD45 FAD26 fca 173 FAD 203 FAD37
Text: NEUBRIDGE MICROSYSTEMS NEWBRIDGE fc.4E D • b5öölQl JANUARY, 1993 MICROSYSTEMS Fully compatible with IEEE Std 896.1 - 1991 - Profiles A & B register selectable TTL input/output levels Low power CMOS implementation Futurebus+ interface - 896.1 compelled mode data transfer protocol
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0DD203
CA91C899
64-bit
fad27
FAD47
FRQ01
FAD21
FAD30
FAD45
FAD26
fca 173
FAD 203
FAD37
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230NT
Abstract: No abstract text available
Text: F-207 m samTëc F T S H -1 1 0 -0 1 -L -D V F T S H -1 2 0 -0 2 -F -D V SHT .050“ MICRO HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?FTSH SERIIES ALSO AVAILABLE M a te s w ith: FFSD, CLP, FLE, SFMC, SFMH
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F-207
230NT
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PDF
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samtec ASP 146
Abstract: No abstract text available
Text: F-207 m samTëc T M M -1 0 8 -0 3 -T -Q T M M -1 1 6 -0 1 -G -S T M M -1 0 6 -0 4 -S -D T M M -1 1 2 -0 1 -L -D -R A m ro u g n \ W 2mm LOW PROFILE SPECIFICATIONS For complete specifications see www.samtec.com?TMM In sulator Material: TMM SERIES 'Ultra-low profile
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F-207
852-26904858-Fax:
samtec ASP 146
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Untitled
Abstract: No abstract text available
Text: I >8 mm SPECIFICATIONS For com plete specifications and recom m ended PCB layouts see www.sam tec.com ?QSE Insulator Material: Liquid C rystal •ill Polym er mm mis* Term inal Material: P hosphor Bronze ii<£ * Plating: Au over 50p" 1 ,27pm) Ni C urrent Rating:
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852-26904858-Fax:
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40x8
Abstract: No abstract text available
Text: F-207 m samTëc OPEN PIN FIELD INTERCONNECTS OPEN PIN FIELD ARRAY SPECIFICATIONS For com plete specifications and recom m ended PCB layouts see www .sam tec.com ?SEAF In sulator Material: Black LCP C ontact Material: C opper Alloy C urrent Rating: 2.7 A Operating Tem p Range:
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F-207
972-3-75266CO
852-26904858-Fax:
40x8
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Untitled
Abstract: No abstract text available
Text: F-206-1 Te c M TM M -114-05-T-Q -225 M TM M -108-07-G -D -200 JSV MODIFIED HEADER M TM M -124-14-S-S-600 m rougn x SPECIFICATIONS For complete specifications see www.samtec.com?MTMM MTMM SERIES Choice of single, double or quad row M ates with: CLT, SQT, SQW, ESQT,
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F-206-1
-114-05-T-Q
-108-07-G
-124-14-S-S-600
7747-Fax:
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Untitled
Abstract: No abstract text available
Text: F-207 s am samTec 75Q S S P E C IF IC A T IO N S For complete specifications and recommended Cable Stripping see www.samtec.com?SMB7H B& SMB7H □ OX SMB7H, MCX7 SERIES PLATING GENDER Shell Material: Brass Contact Material: Brass Insulator Material: Teflon
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F-207
7526SC
852-26904858-Fax:
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Untitled
Abstract: No abstract text available
Text: SC Mates w ith: APf APS, APO, APA, APE.APH Highest re lia b ility DIP sockets 1C and ICS series DIP sockets feature U.L. rated G.F. polyester body with mounting holes and use precision machined lead sockets for high reliability in the most demanding applications.
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852-26904858-Fax:
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Untitled
Abstract: No abstract text available
Text: F-206-1 ,8mm HI-SPEED DATA LINK HFEM2 SERIES SPECIFICATIONS For complete specifications see www.samtec.com?HFEM-DP www.samtec.com?HFEM2-DP or www.samtec.com?HFEM2-SE -D P M a t e s w ith : QTE-DP, Q S E -D P -S E M a t e s w ith : Differential Pairs or \ SingleEnded
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F-206-1
689CG37
852-26904858-Fax:
7747-Fax:
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Untitled
Abstract: No abstract text available
Text: 1G 1rA i G LElD-S11B SPECIFICATIONS D S M -3 1 8 , D S M -5 9 0 S E R IE S Insulator Material: Black High Temperature Thermoplastic Pin Material: Brass Socket Material: Phosphor Bronze Shell Material: Steel Plating: Gold on Contacts, Nickel on Shell, Tin-Lead on Tails
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SIZE20
Boar60
689CG37
852-26904858-Fax:
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PDF
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Untitled
Abstract: No abstract text available
Text: F-207 M TM M -114-05-T-Q -225 M TM M -108-07-G -D -200 JSV MODIFIED HEADER M TM M -124-14-S-S-600 in r o u g n x SPECIFICATIONS For complete specifications see www.samtec.com?MTMM MTMM SERIES M ates with: CLT, SQT, SQW, ESQT, TLE, SMM, MMS, TCSD Insulator Material:
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F-207
-114-05-T-Q
-108-07-G
-124-14-S-S-600
852-26904858-Fax:
7747-Fax:
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PDF
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Untitled
Abstract: No abstract text available
Text: D-SUBMINIATURE SHELL SPECIFICATIONS DSM For complete specifications see www.samtec.com?DSM-CP Insulator Material: DQ SHELL SIZEPOSITIONS CP GENDER b I c s e r ie s SHELL PLATING High Temperature Thermoplastic Shell Material: -E -0 9 -A -1 5 -B -2 5 Steel Shell Plating:
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689CG37
7747-Fax:
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PDF
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samtec tsm
Abstract: 1-800-SAMTEC-9 TSM-110-01-T-DV tsm11001tdv
Text: F-205-1 amte c Mates with: SSW, SSQ, SSM, BSW, ESW, ESQ, BCS, SLW, CES, IDSS, IDSD, HLE LEAD STYLE 111I PN0E R PINS ro w XQM I o iv i H y SPECIFICATIONS I 02 thru 36 For com plete specifications see w w w .sam tec.com ?TSM Insulator Material: B lack Liquid C rystal
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025so
612-Fax:
26S6-3367
852-26904858-Fax:
samtec tsm
1-800-SAMTEC-9
TSM-110-01-T-DV
tsm11001tdv
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PDF
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1-800-SAMTEC-9
Abstract: J302
Text: F-205-1 a m te c 2mm LOW PROFILE Tiger Claw contacts Mates with: TMM, TMMH, MTMM, MMT, TW SPECIFICATIONS For complete specifications see www.samtec.com?CLT Insulator Material: Black Liquid Crystal t o Polymer Contact Material: Phosphor Bronze Plating: Sn or Au over
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F-205-1
So4-42-8319
26S8-3367
852-26904858-Fax:
7747-Fax:
1-800-SAMTEC-9
J302
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PDF
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icf-648
Abstract: No abstract text available
Text: F -2 07 S U P P L E M E N T sam tëc ICF-648-S-I P L C C -0 4 4 -F -A SURFACE MOUNT SOCKETS SPEC IFIC A TIO N S For com plete specifications and recom m ended P C B layouts se e w w w .sam tec.com vlCF Insulator Material: B la ck L C P Contact Material: BeCu
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7526SCO
852-26904858-Fax:
ICF-648-S-I
LCC-044-F-A
icf-648
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PDF
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1-800-SAMTEC-9
Abstract: No abstract text available
Text: PES PES 08 RA 04 SD VT 02 POWER EDGE ' SOCKET PES SERIES SPECIFICATIONS For com plete specifications see w w w .sam tec.com ?PES In sulator M aterial: Black LCP Term inal M aterial: C opper Alloy Plating: Sn or Au over 50p" 1,27|jm Ni C urrent Rating: 2 5A @ 80°C
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F-206-1
7526S00
972-3-7526S90
PES-04-01-S-RA-SD
PES-08-02-T-VT
1-800-SAMTEC-9
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PDF
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PC104
Abstract: No abstract text available
Text: F-207 SUPPLEMENT a m te c 2mm HI-DENSITY SOCKET SERIES SPECIFICATIONS M a te s w ith : YTT, YTW, YTE For complete specifications see www.samtec.com?YTE Insu lator Material: Black Liquid Crystal t o Polymer "“ «•« Contact Material: Phosphor Bronze C urrent Rating:
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F-207
7526SOO
852-26904858-Fax:
PC104
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PDF
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Futurebus
Abstract: No abstract text available
Text: m m m r s e p te m b e r1 " 1 c a 9 ic 8 9 6 FUTUREBUS+ ARBITER • Fully compatible with IEEE P896.1 -1991 • IEEE 1149.1 JTAG testability port • TTL input/output levels • Low power CMOS implementation • Futurebus* Interface - 254level priortty/round-robin arbiter
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254level
Futurebus
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FAD41
Abstract: FAD33 FAD17 LAD-23 FAD20 fad27 FAD34 FAD47 ts4 1060 FAD32
Text: NEWBRIDGE MICROSYSTEMS NEWBRIDGE b4E D • tj5ññlDl 0 D 0 2 0 1 1 JANUARY, 1993 MICROSYSTEMS Fully compatible with IEEE Std 896.1 -1991 - Profiles A & B register selectable TTL input/output levels Low power CMOS implementation Futurebus+ interface - 896.1 compelled mode data transfer protocol
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CA91C899
32-bit
304-Pering,
FAD41
FAD33
FAD17
LAD-23
FAD20
fad27
FAD34
FAD47
ts4 1060
FAD32
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Untitled
Abstract: No abstract text available
Text: F-207 m samTëc POWER/Q2 SIGNAL COMBO SPECIFICATIONS 1 OMS W Vj C I V I O For complete specifications and recommended PCB layouts see www.samtec.com?QMS-PC or www.samtec.com?QFS-PC si Insulator Material: Liquid Crystal Polymer Contact,Terminal & Ground Plane Material:
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F-207
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Untitled
Abstract: No abstract text available
Text: F-207 m samTëc F T S H -1 2 0 -0 2 -F -D F T S H -1 3 0 -0 2 -L -D -E S T,H .050" MICRO HEADER SER IES SPECIFICATIONS Impedance matchedA for high speed applications Mated with CLP series M a te s w ith: FFSD, CLP, FLE, SFMC For complete specifications see www.samtec.com?FTSH
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F-207
852-26904858-Fax:
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PDF
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