8 PIN CERAMIC DUAL IN-LINE PACKAGE Search Results

Contextual Info: D S u ffix 18 pin Ceramic DIP Dual In-Line Package D S u ffix 20 pin Ceramic DIP (Dual In-Line Package) 10.5 MAX. C S u ffix n n n U LJ— U n R1 l_l' 8 pin Plastic Molded DIP (Dual In-Line Package) n ri 1— 1 r- A C S u ffix t 0.7 J ] LJ LJ o MAX. 8 pin Plastic M olded DIP

EQXO-2050BMH

Abstract: EQXO-2100BM 240000MHz 20.0000mhz EQXO-2050BM 14.7456MHz crystal 20.0000M WK08 MIL-O-55310C WK-120
Contextual Info: EURO QUARTZ EQXO-2000BM SERIES OSCILLATORS 8 pin Dual-in-Line MIL SPECIFICATION Page 1 of 2 FEATURES Ceramic substrate and ruggedized mounts for high reliability Industry-standard 8 pin DIL package for ease of design Full screening to MIL-O-55310C, Class B available

IC 2025

Contextual Info: Hermetic Optocouplers Choose from Hewlett-Packard's broad line of high performance hermetic optocouplers to meet your military, aerospace, and high reliability applications. There are three ceramic package styles to choose from: 8 and 16 pin dual in-line packages, and a 20 terminal

4.91520mhz

Abstract: WK-005 wm025
Contextual Info: EURO QUARTZ EQXO-2000BM OSCILLATORS 8 pin Dual-in-Line MIL SPECIFICATION 30kHz to 70MHz Page 1 of 2 FEATURES • Ceramic substrate and ruggedized mounts for high reliability Industry-standard 8 pin DIL package for ease of design Full screening to MIL-O-55310C, Class B available

Contextual Info: a 8-Lead Ceramic Dual In-Line Package [CERDIP] Q-8 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN 8 0.055 (1.40) MAX 5 0.310 (7.87) 0.220 (5.59) PIN 1 1 4 0.100 (2.54) BSC 0.320 (8.13) 0.290 (7.37) 0.405 (10.29) MAX 0.200 (5.08) MAX 0.200 (5.08)

LH0033

Abstract: LH0033G-MIL LH0033CG LH0033G R05B AN-48 G12B LH0033C LH0033J LH0063
Contextual Info: LH0033/LH0063 National Semiconductor LH0033/LH0063 Fast and Ultra Fast Buffers General Description LH0063C are specified from - 2 5 ”C to + 85°C. The LH0033 is available in either a 1.5W metal TO-8 package or an 8-pin ceramic dual-in-line package. The LH0063 is available in a

MO-150

Abstract: MO-187 MS-013 MS-026 TSOT23-5 103001 for mouse 44w SOT23
Contextual Info: Package Information Package Types The following are the package types and widths offered by Holtek. LQFP Low profile Quad Flat Package Pin Count DIP (Dual In-line Package) Pin Count Package Width 8, 14, 16, 18, 20 300mil 24, 28, 32, 40, 42 600mil 28, 32, 40 (Ceramic)

Q-16

Contextual Info: a 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN 0.098 (2.49) MAX 16 9 0.310 (7.87) 0.220 (5.59) PIN 1 1 0.200 (5.08) MAX 8 0.840 (21.34) MAX 0.060 (1.52) 0.015 (0.38) 0.320 (8.13) 0.290 (7.37)

D-16

Contextual Info: a 16-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP] D-16 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN PIN 1 0.200 (5.08) MAX 0.080 (2.03) MAX 16 9 1 8 0.840 (21.34) MAX 0.200 (5.08) 0.125 (3.18) 0.023 (0.58) 0.014 (0.36) 0.310 (7.87)

Contextual Info: a 14-Lead Ceramic Dual In-Line Package [CERDIP] Q-14 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN 14 0.098 (2.49) MAX 8 PIN 1 1 7 0.310 (7.87) 0.220 (5.59) 0.320 (8.13) 0.290 (7.37) 0.100 (2.54) BSC 0.785 (19.94) MAX 0.200 (5.08) MAX 0.200 (5.08)

Q-16

Contextual Info: 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16 Dimensions shown in inches and (millimeters) a 0.005 (0.13) MIN 0.098 (2.49) MAX 16 9 1 PIN 1 8 0.310 (7.87) 0.220 (5.59) 0.100 (2.54) BSC 0.840 (21.34) MAX 0.200 (5.08) MAX 0.200 (5.08) 0.125 (3.18) 0.023 (0.58)

Contextual Info: 14-Lead Ceramic Dual In-Line Package [CERDIP] Q-14 Dimensions shown in inches and (millimeters) a 0.005 (0.13) MIN 14 1 PIN 1 0.098 (2.49) MAX 8 7 0.310 (7.87) 0.220 (5.59) 0.100 (2.54) BSC 0.785 (19.94) MAX 0.200 (5.08) MAX 0.200 (5.08) 0.125 (3.18) 0.023 (0.58)

Contextual Info: a 14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP] D-14 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN 0.080 (2.03) MAX 8 14 1 PIN 1 0.200 (5.08) MAX 7 0.310 (7.87) 0.220 (5.59) 0.100 (2.54) BSC 0.765 (19.43) MAX 0.200 (5.08) 0.125 (3.18

SSOP48W

Abstract: SSOP20N 18w sot23 transistor TSSOP16 MO-150 MO-187 MO-220 MS-013 SSOP20S 103001 for mouse
Contextual Info: Package Information Package Types The following are the package types and widths offered by Holtek. Pin Count DIP Dual In-line Package 80, 100, 128 14mm ´ 20mm 208 28mm ´ 28mm Pin Count Package Width 8, 14, 16, 18, 20 300mil 24, 28, 32, 40, 42 600mil 28, 32, 40 (Ceramic)

8205S

Abstract: intel 8205 P8205 intel 8008 8205 microprocessor 8205 decoder 8205 C8205 chip 8205 8205 6 pin
Contextual Info: in te T 8205 HIGH SPEED 1 OUT OF 8 BINARY DECODER Low Input Load Current — .25 mA max., 1/6 Standard TTL Input Load Minimum Line Reflection — Low Voltage Diode Input Clamp Outputs Sink 10 mA min. 16-Pin Dual-ln-Line Ceramic or Plastic Package • I/O Port or Memory Selector

Contextual Info: 1442, 1445, 1446 Vishay Foil Resistors Bulk Metal Foil Technology Dual-In-Line Hermetic Resistor Networks Vishay Model 1442, 1445 and 1446 networks incorporate all the performance features of Vishay Bulk Metal® Foil technology. The 8, 14 and 16 pin side brazed DIPs are a ceramic package.

Contextual Info: 1442, 1445, 1446 Vishay Foil Resistors Bulk Metal Foil Technology Dual-In-Line Hermetic Resistor Networks Vishay Model 1442, 1445 and 1446 networks incorporate all the performance features of Vishay Bulk Metal® Foil technology. The 8, 14 and 16 pin side brazed DIPs are a ceramic package.

Contextual Info: 1442, 1445, 1446 Vishay Foil Resistors Bulk Metal Foil Technology Dual-In-Line Hermetic Resistor Networks Vishay Model 1442, 1445 and 1446 networks incorporate all the performance features of Vishay Bulk Metal® Foil technology. The 8, 14 and 16 pin side brazed DIPs are a ceramic package.

R871

Contextual Info: 1442, 1445, 1446 Vishay Foil Resistors Bulk Metal Foil Technology Dual-In-Line Hermetic Resistor Networks Vishay Model 1442, 1445 and 1446 networks incorporate all the performance features of Vishay Bulk Metal® Foil technology. The 8, 14 and 16 pin side brazed DIPs are a ceramic package.

Contextual Info: 1442, 1445, 1446 Vishay Foil Resistors Bulk Metal Foil Technology Dual-In-Line Hermetic Resistor Networks Vishay Model 1442, 1445 and 1446 networks incorporate all the performance features of Vishay Bulk Metal® Foil technology. The 8, 14 and 16 pin side brazed DIPs are a ceramic package.

LP2851

Abstract: sem 5025 2951 acm LP29S BP 2951 DS006546
Contextual Info: tß Semiconductor LP2950/LP 2951 Series of A d ju s ta b le M ic r o p o w e r Voltage R e g u la to rs The LP2950-5.0 in the popular 3-pin TO-92 package is pin-compatible with older 5V regulators. The 8-lead LP2951 is available in plastic, ceramic dual-in-line, or metal can

2950-CZ

Abstract: 2950ACZ-5 2950A-CZ50 2950CZ 2950ACZ 2950cz5.0 2951C 2950cz5 2950ACZ-50
Contextual Info: t ß Semiconductor LP2950/LP 2951 Series of A d ju s ta b le M ic r o p o w e r Voltage R e g u la to rs The LP2950-5.0 in the popular 3-pin TO-92 package is pin-compatible with older 5V regulators. The 8-lead LP2951 is available in plastic, ceramic dual-in-line, or metal can

760-3-R47

Contextual Info: Dual-In-Line Series 760/761 Bussed CTS Schematic 1 60% Greater Surface Area Available For Resistor Circuitry With CTS Products • Solid ceramic substrate • Low height profile • .100" lead spacing • High overload capabilities • 8, 14, 16 and 18 pin constructions

5962F9670901VRC

Abstract: 5962F9670901VXC ACS521HMSR ACS521MS B1516
Contextual Info: ACS521MS Radiation Hardened 8-Bit Magnitude Comparator January 1996 tle S5 S ia- Features Pinouts • Devices QML Qualified in Accordance with MIL-PRF-38535 20 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR CDIP2-T20, LEAD FINISH C TOP VIEW • Detailed Electrical and Screening Requirements are Contained in