7B181 Search Results

Contextual Info: CY7B180 7B181 s CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • Can be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors Functional Description T he CY7B180 and 7B181 are high-perform ance B iC M O S cache tag R A M s orga­

Contextual Info: CY7B180 7B181 PRELIMINARY CYPRESS SEMICONDUCTOR Features 4K x 18 Cache Tag • Can be used as 4K x 18 SRAM Functional Description Supports 50-MHz cache for all major high-speed processors 4K x 18 tag organization BiCMOS for optimum speed/power High speed

Contextual Info: CY7B180 7B181 I CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • C an be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors • 4K x 18 tag organization • BiCMOS for optimum speed/power • High speed — 10-ns match delay

HESE12

Abstract: cd3510
Contextual Info: PRELIM INARY r^ Y p p p C Q - 4K x 18 Cache Tag SEMICONDUCTOR Features • Can be used as 4K x 18 SRAM • Supports 50*MHz cache for all major h ig h sp eed processors F unctional D escription • 4 K x 18 tag organization • BiCMOS for optimum speed/power

ue09

Abstract: CY7B180-12GC cd 2313 UE 09
Contextual Info: CY7B180 7B181 AD VAN C ED IN F O R M A T IO N CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features Functional Description • 4K x 18 tag organization T h e CY7B180 and 7B181 are high-perform ance B iCM O S cache tag R A M s orga­ nized as 40% words by 18 bits. Each word

CY7B180-12JC

Abstract: CY7B181
Contextual Info: CY7B180 7B181 ' r CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • Can be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors • 4K x 18 tag organization • BiCMOS for optimum speed/power • High speed — 10-ns match delay

11ax

Abstract: 80486 microprocessor pin out diagram
Contextual Info: PRELIMINARY CYPRESS SEMICONDUCTOR Features 32K x 9 Synchronous Cache R/W RAM • D irect interface with the processor and external cache controller Supports 66-M Hz Pentium " CPU cache systems • TWo complementary synchronous chip enables Available in standard PLCC/LCC

Contextual Info: Qualification Report October 1993, Version 1.0, QTP# 93275 Thin Small Outline Package 32 Lead TSOP Type 1 Dry packing required CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 32 Pins TSOP

EME 6300HR

Abstract: EME-6300
Contextual Info: Qualification Report September 1993, Version 1.3, QTP# 93251 ASAT ASSEMBLY QUALIFICATION 80 Lead Quad Plastic Quad Flatpack PQFP (Dry packing) CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Mold Compound Name/Manufacturer: Lead Frame material:

EQUIVALENT cd 1031 cs

Abstract: WC18 dpi 510 7C103 10318
Contextual Info: 7b198/9:12/6/90 Revision: Monday, January 18,1993 CYPRESS • E5flSbb2 S E MI C O N D U C T O R S7E OOOÔTDâ CY7C1031 CY7C1032 D PRELIMINARY CYPRESS SEMICONDUCTOR Features 64K x 18 Synchronous Cache RAM • Direct interface with the processor and external cache controller

76494

Abstract: EME-6300H 80973 Q393
Contextual Info: Qualification Report April ,1993, QTP #91481 Version 1.0 BiCMOS CACHE TAG SRAMS MARKETING PART NUMBER DEVICE DESCRIPTION CY7B180 4K x 18 Cache Tag 7B181 4K x 18 Cache Tag PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part