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Catalog Datasheet	MFG & Type	Document Tags	PDF
79L24 Abstract: No abstract text available Text: TYPE 79L24nd CHIP APPEARANCE CHIP SIZE CHIP THICKNESS 3 BONDING PAD DIMENSION SCRIBE LINE WIDTH TOP METAL BACK METAL WAFER SIZ 0,85  0,85 mm 480  20m or 350(280  20m) 92  92 m 92  92 m 92  92 m 80 m Al – (or Ti-Ni-Ag)	Original	79L24nd 79L24n 79L24	PDF

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79L24

Abstract: No abstract text available
Text: TYPE 79L24nd CHIP APPEARANCE CHIP SIZE CHIP THICKNESS 3 BONDING PAD DIMENSION SCRIBE LINE WIDTH TOP METAL BACK METAL WAFER SIZ 0,85  0,85 mm 480  20m or 350(280  20m) 92  92 m 92  92 m 92  92 m 80 m Al – (or Ti-Ni-Ag)

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79L24nd 79L24n 79L24

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