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    78 BALL FBGA THERMAL RESISTANCE Search Results

    78 BALL FBGA THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    78 BALL FBGA THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    FBGA DDR3 x32

    Abstract: MT41K256M32 MT41K256M16 MT41K256M3 MICRON fBGA package code
    Text: Preliminary‡ 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D


    Original     		PDF MT41K256M32 MT41K256M16 MT41K256M32. 136-ball DDR3L-1600) DDR3L-1333) DDR3L-1066) SAC305 09005aef84ad0652 FBGA DDR3 x32 MT41K256M32 MT41K256M3 MICRON fBGA package code

    MT41K256M32

    Abstract: MT41K256M3 8Gb DDR3 SDRAM twindie MT41K256M16
    Text: 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D – 136-ball FBGA


    Original     		PDF MT41K256M32 MT41K256M16 MT41K256M32. 136-ball DDR3L-1600) DDR3L-1333) DDR3L-1066) 09005aef84ad0652 MT41K256M32 MT41K256M3 8Gb DDR3 SDRAM twindie

    MT41K256M32

    Abstract: FBGA DDR3 x32 MT41K256M3 MT41K256M16
    Text: Preliminary‡ 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D


    Original     		PDF MT41K256M32 MT41K256M16 MT41K256M32. 136-ball DDR3L-1600) DDR3L-1333) DDR3L-1066) SAC305 09005aef84ad0652 MT41K256M32 FBGA DDR3 x32 MT41K256M3

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    MT41K512M16

    Abstract: 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON
    Text: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)


    Original     		PDF MT41K512M16 MT41K256M16 MT41K512M16. 96-ballw 09005aef84ccb467 MT41K512M16 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON

    MT41K256M16

    Abstract: No abstract text available
    Text: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)


    Original     		PDF MT41K512M16 96-ball 071ns DDR3L-1866) DDR3L-1600) DDR3L-1333) DDR3L-1066) 09005aef84ccb467 MT41K256M16

    MT41K512M16

    Abstract: MT41K256M16 96 ball fbga thermal resistance micron Theta JC of FBGA MICRON fBGA package code micron marking code information
    Text: Preliminary‡ 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)


    Original     		PDF MT41K512M16 MT41K256M16 MT41K512M16. SAC305 09005aef84ccb467 MT41K512M16 MT41K256M16 96 ball fbga thermal resistance micron Theta JC of FBGA MICRON fBGA package code micron marking code information

    Untitled

    Abstract: No abstract text available
    Text: CY7C1461AV25 CY7C1463AV25 CY7C1465AV25 PRELIMINARY 36-Mbit 1M x 36/2M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Functional Description[1] Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles


    Original     		PDF CY7C1461AV25 CY7C1463AV25 CY7C1465AV25 36-Mbit 36/2M 18/512K 133-MHz 100-MHz

    CY7C1460AV25

    Abstract: CY7C1462AV25 CY7C1464AV25 K973
    Text: CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states


    Original     		PDF CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 36/2M 18/512K 250-MHz CY7C1460AV25, CY7C1462AV25 CY7C1460AV25 CY7C1464AV25 K973

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    CY7C1462AV25

    Abstract: CY7C1460AV25 CY7C1464AV25
    Text: CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states


    Original     		PDF CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 36/2M 18/512K 250-MHz CY7C1460AV25, CY7C1462AV25 CY7C1460AV25 CY7C1464AV25

    Untitled

    Abstract: No abstract text available
    Text: CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Pipelined SRAM with NoBL Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states


    Original     		PDF CY7C1460AV25 CY7C1462AV25 CY7C1464AV25 36-Mbit 36/2M 18/512K 250-MHz 200-MHz 167-MHz

    Untitled

    Abstract: No abstract text available
    Text: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 PRELIMINARY 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Features • JTAG boundary scan for BGA and fBGA packages • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles.


    Original     		PDF CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 36-Mbit 18/512K 133-MHz 100-MHz

    Untitled

    Abstract: No abstract text available
    Text: Preliminary‡ 8Gb: x4, x8 1.5V TwinDie DDR3 SDRAM Features TwinDie DDR3 SDRAM MT41J2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41J1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Features Marking Options • Configuration – 128 Meg x 4 x 8 banks x 2 ranks – 64 Meg x 8 x 8 banks x 2 ranks


    Original     		PDF MT41J2G4 MT41J1G8 SAC305 09005aef847fe0df

    Untitled

    Abstract: No abstract text available
    Text: Preliminary‡ 8Gb: x4, x8 1.5V TwinDie DDR3 SDRAM Features TwinDie DDR3 SDRAM MT41J2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41J1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Features Marking Options • Configuration – 128 Meg x 4 x 8 banks x 2 ranks – 64 Meg x 8 x 8 banks x 2 ranks


    Original     		PDF MT41J2G4 MT41J1G8 78-ball 071ns DDR3L-1866) DDR3L-1600) DDR3L-1333) DDR3L-1066) SAC305

    DDR3L SDRAM

    Abstract: TN0008 MT41K1G8
    Text: Preliminary‡ 8Gb: x4, x8 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41K1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Description Options Marking • Configuration – 128 Meg x 4 x 8 banks x 2 ranks


    Original     		PDF MT41K2G4 MT41K1G8 MT41K1G4 MT41K2G4; MT41K512M8 MT41K1G8. 78-ball SAC305 09005aef84787542 DDR3L SDRAM TN0008 MT41K1G8

    CY7C1461AV33

    Abstract: CY7C1463AV33 CY7C1465AV33
    Text: CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 36-Mbit 1M x 36/2 M x 18/512K x 72 Flow-Through SRAM with NoBL Architecture Functional Description[1] Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Supports up to 133-MHz bus operations with zero wait


    Original     		PDF CY7C1461AV33 CY7C1463AV33 CY7C1465AV33 36-Mbit 18/512K 133-MHz CY7C1461AV33/CY7C1463AV33/CY7C1465AV33 36/2M CY7C1461AV33 CY7C1463AV33 CY7C1465AV33

    CY7C1441AV25

    Abstract: CY7C1443AV25 CY7C1447AV25
    Text: CY7C1441AV25 CY7C1443AV25 CY7C1447AV25 36-Mbit 1M x 36/2M x 18/512K x 72 Flow-Through SRAM Functional Description[1] Features • Supports 133-MHz bus operations • 1M x 36/2M x 18/512K x 72 common I/O • 2.5V core power supply • 2.5V/1.8V I/O power supply


    Original     		PDF CY7C1441AV25 CY7C1443AV25 CY7C1447AV25 36-Mbit 36/2M 18/512K 133-MHz CY7C1441AV25 CY7C1443AV25 CY7C1447AV25

    DDR3L SDRAM

    Abstract: F0513 MT41K1G8
    Text: 8Gb: x4, x8 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K2G4 – 128 Meg x 4 x 8 Banks x 2 Ranks MT41K1G8 – 64 Meg x 8 x 8 Banks x 2 Ranks Description Options Marking • Configuration – 128 Meg x 4 x 8 banks x 2 ranks – 64 Meg x 8 x 8 banks x 2 ranks


    Original     		PDF MT41K2G4 MT41K1G8 MT41K1G4 MT41K2G4; MT41K512M8 MT41K1G8. 78-ball 09005aef84787542 DDR3L SDRAM F0513 MT41K1G8