L777HDD78P
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 78 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
|
|
L777HRB44PVFM
|
|
Amphenol Communications Solutions
|
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell+Grounding Dimplesl, 44 Pin, M3 Fixed Front Screwlock |
|
|
L777HREH15PVF
|
|
Amphenol Communications Solutions
|
Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 15 Pin, 4-40 Rear Nut, 4-40 Removable Front Screwlock |
|
|
L777HDAH26POL2RM8
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Pin, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
|
|
L777HDB44PD1CH4R
|
|
Amphenol Communications Solutions
|
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Pin, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock |
|
|