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    OSRAM GmbH LHT674MM2

    Optoelectronic Device
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA LHT674MM2 3,560
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    74MM2 Datasheets Context Search

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    msi 7267 MOTHERBOARD SERVICE MANUAL

    Abstract: ttl cookbook msi ms 7267 MOTHERBOARD CIRCUIT diagram "0.4mm" bga "ball collapse" height PCF 799 crystal oscillator 8MHz 4 pins smd diode MARKING F5 44C smd TRANSISTOR code marking A7 terminals diagram of smd transistor bo2 cookbook for ic 555
    Text: GTL/GTLP Logic High-Performance Backplane Drivers Data Book Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information


    Original
    PDF GDFP1-F48 -146AA GDFP1-F56 -146AB msi 7267 MOTHERBOARD SERVICE MANUAL ttl cookbook msi ms 7267 MOTHERBOARD CIRCUIT diagram "0.4mm" bga "ball collapse" height PCF 799 crystal oscillator 8MHz 4 pins smd diode MARKING F5 44C smd TRANSISTOR code marking A7 terminals diagram of smd transistor bo2 cookbook for ic 555

    Untitled

    Abstract: No abstract text available
    Text: www.fairchildsemi.com AN-9077 Motion SPM 7 Series User’s Guide Table of Contents 1 2 3 4 Introduction. 2 Application Example . 14 1.1. Design Concept .2


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    PDF AN-9077

    W3H128M72ER-XSBX

    Abstract: LDM-1 W3H128M72
    Text: White Electronic Designs W3H128M72ER-XNBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES  Data rate = 667, 533, 400 Mb/s  Posted CAS additive latency: 0, 1, 2, 3 or 4  Package:  Write latency = Read latency - 1* tCK  Commercial, Industrial and Military Temperature


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    PDF W3H128M72ER-XNBX W3H128M72ER-XSBX LDM-1 W3H128M72

    Untitled

    Abstract: No abstract text available
    Text: W3H128M72ER-XNBX ADVANCED* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  45% Space savings vs. FBGA  Package:  Reduced part count • 255 Plastic Ball Grid Array PBGA , 23 x 21mm  51% I/O reduction vs FBGA


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    PDF W3H128M72ER-XNBX

    SN74GTLP1394

    Abstract: SN74GTLP817 SN74GTLPH1612 SN74GTLPH1645 SN74GTLPH1655 SN74GTLPH16912 SN74GTLPH16945 SN74GTLPH306 SN74GTLPH3245 SN74GTLPH32912
    Text: T H E W O R L D Increase the speed of parallel backplanes 3x with GTLP L E A D E R I N L O G I C P R O D U C T S For high-speed parallel backplanes, GTLP is the answer. Migrate to next-generation speed In today's interconnected, bandwidthhungry world, designers can easily


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    PDF B010300 SCEB005 SN74GTLP1394 SN74GTLP817 SN74GTLPH1612 SN74GTLPH1645 SN74GTLPH1655 SN74GTLPH16912 SN74GTLPH16945 SN74GTLPH306 SN74GTLPH3245 SN74GTLPH32912

    Untitled

    Abstract: No abstract text available
    Text: W3H128M72ER-XNBX ADVANCED* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  45% Space savings vs. FBGA  Package:  Reduced part count • 255 Plastic Ball Grid Array PBGA , 23 x 21mm  51% I/O reduction vs FBGA


    Original
    PDF W3H128M72ER-XNBX

    W3H128M72ER-XSBX

    Abstract: M2 8gb pinout
    Text: White Electronic Designs W3H128M72ER-XSBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES „ Data rate = 667, 533, 400 Mb/s „ Posted CAS additive latency: 0, 1, 2, 3 or 4 „ Package: „ Write latency = Read latency - 1* tCK „ Commercial, Industrial and Military Temperature


    Original
    PDF W3H128M72ER-XSBX W3H128M72ER-XSBX M2 8gb pinout

    PowerPC 601 instructions set

    Abstract: PPC601 ppc601fd
    Text: Prelim inary D ata IBM Microelectronics Total Technology Solutions“ PowerPC601 100 MHz RISC Microprocessor P roduct D escription The IBM Microelectronics PowerPC 6011Mmicroprocessor is the first im plem entation of the PowerPC™ family of Reduced Instruction Set


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    PDF 6011Mmicroprocessor 32-bit PowerPC 601 instructions set PPC601 ppc601fd